Intel Server SR6850HW4 User Manual
Intel® Server Platform  
SR6850HW4  
Technical Product Specification  
Intel order number D23151-001  
Revision 1.0  
May, 2005  
Enterprise Platforms and Services Division – Marketing  
Intel Confidential  
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Intel® Server Platform SR6850HW4 TPS  
Table of Contents  
Table of Contents  
1. Product Overview.................................................................................................................1  
2. System Overview..................................................................................................................3  
2.1  
2.2  
2.3  
System Feature Overview........................................................................................3  
Introduction..............................................................................................................4  
External Chassis Features - Front...........................................................................8  
Front Control Panel..................................................................................................8  
Hot-swap Hard Disk Drive and Peripheral Device Bays ..........................................9  
External Chassis Features - Rear..........................................................................10  
Internal Chassis Features......................................................................................11  
Server Board Set SE8500HW4 Mainboard............................................................11  
Server Board Set SE8500HW4 Memory Board.....................................................12  
Power Distribution Board.......................................................................................12  
SCSI Backplane Board Board ...............................................................................12  
Front Panel I/O Board............................................................................................13  
Front Panel Control Board.....................................................................................13  
SATA-to-IDE Converter Board...............................................................................13  
Intel® Management Module...................................................................................13  
Fibre Channel Module ...........................................................................................14  
2.3.1  
2.3.2  
2.4  
2.5  
2.5.1  
2.5.2  
2.5.3  
2.5.4  
2.5.5  
2.5.6  
2.5.7  
2.5.8  
2.5.9  
2.5.10 RAID On Motherboard (ROMB).............................................................................14  
2.5.11 Power Supply Module............................................................................................14  
2.5.12 Cooling Subsystem................................................................................................16  
2.6  
New Platform Features..........................................................................................16  
Advanced Memory Performance and Protection ...................................................16  
Rolling BIOS ..........................................................................................................17  
Server Management ..............................................................................................17  
Intel Management Module (IMM)...........................................................................17  
Hot Swap Controller...............................................................................................19  
Reliability, Availability, Serviceability, Usability, Manageability (RASUM) .............19  
Expansion Support ................................................................................................20  
Specifications.........................................................................................................21  
2.6.1  
2.6.2  
2.7  
2.7.1  
2.7.2  
2.8  
2.9  
2.10  
2.10.1 Environmental Specifications Summary ................................................................21  
2.10.2 Physical Specifications ..........................................................................................22  
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Table of Contents  
Intel® Server Platform SR6850HW4 TPS  
3. Server System Chassis and Assemblies .........................................................................23  
3.1  
3.1.1  
Chassis, Rails and Top Cover ...............................................................................23  
Chassis..................................................................................................................23  
Slide Rails..............................................................................................................25  
Top Cover..............................................................................................................25  
Power and Fans.....................................................................................................25  
Fan Subsystem......................................................................................................26  
Mainboard Assembly .............................................................................................26  
Peripheral Bay and Front Panel.............................................................................27  
Hot-Swap Hard Disk Drive Carrier.........................................................................27  
Optical Drive Carrier ..............................................................................................28  
Front Panel ............................................................................................................29  
Front Bezel ............................................................................................................30  
3.1.2  
3.1.3  
3.2  
3.3  
3.4  
3.5  
3.5.1  
3.5.2  
3.5.3  
3.6  
4. Cables and Connectors .....................................................................................................31  
4.1  
4.2  
Cable and System Interconnect Descriptions........................................................33  
User-accessible I/O Connectors............................................................................35  
Video Connectors ..................................................................................................35  
USB 2.0 Connectors..............................................................................................36  
Etherent Connectors..............................................................................................37  
External 68-pin Ultra320 SCSI VHDCI Connector.................................................39  
Internal 68-pin SCSI Connectors...........................................................................40  
80-pin SCA2 Hard Disk Drive Connectors.............................................................41  
AC Power Input Connectors ..................................................................................42  
3-pin Chassis Intrusion Connector.........................................................................42  
12-pin Power Distribution Board Power Connector ...............................................42  
4.2.1  
4.2.2  
4.2.3  
4.2.4  
4.2.5  
4.2.6  
4.2.7  
4.2.8  
4.2.9  
4.2.10 30-pin Power Distribution Board to Mainboard Connector ....................................43  
4.2.11 30-pin SCSI Backplane Board Board to Front Panel I/O Board Connector...........43  
4.2.12 100-pin Mainboard to SCSI Backplane Board Board Connector...........................44  
4.2.13 Peripheral Power Connector..................................................................................45  
4.2.14 Fan Connectors .....................................................................................................46  
4.2.15 50-pin Front Panel Control Module Connector ......................................................47  
4.2.16 SATA-to-IDE Converter Board Connector .............................................................48  
4.2.17 SATA-to-IDE Converter Board Power Connector..................................................48  
4.2.18 SATA Connector....................................................................................................49  
5. Power Supply......................................................................................................................51  
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Table of Contents  
5.1  
5.2  
Mechanical Outline ................................................................................................52  
Power Supply Output Interface..............................................................................54  
Blade Connector....................................................................................................54  
AC Input Requirement ...........................................................................................55  
AC Input Voltage Specification ..............................................................................55  
Efficiency ...............................................................................................................55  
Input Over-Current Protection................................................................................55  
Inrush Current........................................................................................................55  
Auto Restart...........................................................................................................56  
Power Factor Correction (PFC) .............................................................................56  
AC Input Connector ...............................................................................................56  
DC Output Requirements ......................................................................................56  
Hot Swap Functionality..........................................................................................57  
Output Current Rating............................................................................................57  
Over- and Under-Voltage Protection .....................................................................57  
Over-current Protection .........................................................................................58  
Short Circuit Protection..........................................................................................58  
Reset After Shutdown............................................................................................58  
Current Sharing .....................................................................................................59  
I2C Devices ............................................................................................................59  
Fan Speed Control.................................................................................................61  
5.2.1  
5.3  
5.3.1  
5.3.2  
5.3.3  
5.3.4  
5.3.5  
5.3.6  
5.3.7  
5.4  
5.4.1  
5.4.2  
5.4.3  
5.4.4  
5.4.5  
5.4.6  
5.4.7  
5.4.8  
5.4.9  
5.4.10 Power Supply Module LED indicators ...................................................................61  
6. Power Distribution Board..................................................................................................63  
6.1  
6.2  
Introduction............................................................................................................63  
Signal Descriptions and Pinouts............................................................................65  
Remote On/Off (-PS_ON)......................................................................................66  
Power Good Signal (POK or P_GOOD) ................................................................66  
VIN_GOOD............................................................................................................66  
6.2.1  
6.2.2  
6.2.3  
7. SCSI Backplane Board.......................................................................................................67  
7.1  
7.1.1  
Introduction............................................................................................................67  
Block Diagram .......................................................................................................67  
Architectural Overview...........................................................................................68  
Mechanical Specifcations ......................................................................................70  
Component Location..............................................................................................71  
Functional Architecture..........................................................................................73  
7.1.2  
7.1.3  
7.1.4  
7.2  
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7.2.1  
7.2.2  
7.2.3  
7.2.4  
7.2.5  
7.2.6  
7.2.7  
7.2.8  
SCSI Buses ...........................................................................................................73  
SCSI Drive Power Control .....................................................................................73  
SCSI Enclosure Management ...............................................................................75  
Server Management Interface ...............................................................................76  
Resets....................................................................................................................77  
Connector Interlocks..............................................................................................77  
Clock Generation...................................................................................................77  
Programmed Devices ............................................................................................78  
Signal Descriptions................................................................................................78  
Power from the Power Distribution Board..............................................................79  
Front Panel Power Connector ...............................................................................79  
Front Panel I/O Board Ribbon Cable Connector ...................................................79  
LVD SCSI 68-pin Connector..................................................................................80  
SCA2 80-pin Drive Connectors..............................................................................81  
Fans.......................................................................................................................82  
Internal Logic Signals ............................................................................................82  
Electrical, Environmental, and Mechanical Specifications.....................................83  
Electrical Specifications.........................................................................................83  
7.3  
7.3.1  
7.3.2  
7.3.3  
7.3.4  
7.3.5  
7.3.6  
7.3.7  
7.4  
7.4.1  
8. Front Panel I/O and Control Boards .................................................................................85  
8.1  
8.1.1  
Introduction............................................................................................................85  
Block Diagram .......................................................................................................85  
Architectural Overview...........................................................................................86  
Component Location..............................................................................................87  
Functional Architecture..........................................................................................88  
VGA .......................................................................................................................88  
USB .......................................................................................................................88  
NMI Button.............................................................................................................88  
Signal Descriptions................................................................................................89  
USB Connector......................................................................................................89  
Front Panel VGA Connector..................................................................................90  
Electrical, Environmental, and Mechanical Specifications.....................................90  
Electrical Specifications.........................................................................................90  
Connector Specifications.......................................................................................91  
Cooling Requirements ...........................................................................................91  
Front Panel Control Module...................................................................................92  
8.1.2  
8.1.3  
8.2  
8.2.1  
8.2.2  
8.2.3  
8.3  
8.3.1  
8.3.2  
8.4  
8.4.1  
8.4.2  
8.4.3  
8.5  
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8.5.1  
8.5.2  
8.5.3  
Button Control Panel..............................................................................................92  
Intel® Local Control Panel......................................................................................94  
System ID Buttons and LEDs ................................................................................95  
9. SATA-to-IDE Converter Board...........................................................................................97  
9.1 Mechanical Outline ................................................................................................97  
10. Regulatory Specifications .................................................................................................99  
10.1  
10.2  
10.3  
10.4  
10.5  
10.6  
10.7  
Important Safety Information .................................................................................99  
Intended Application Uses.....................................................................................99  
Product Safety .......................................................................................................99  
Electromagnetic Compatibility (EMC) – Emissions and Immunity .........................99  
Certifications / Registrations / Declarations.........................................................100  
Regulatory Compliance Markings........................................................................101  
Regional EMC Compliance Notices/Information..................................................102  
Glossary...................................................................................................................................105  
Reference Documents............................................................................................................107  
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List of Figures  
Intel® Server Platform SR6850HW4 TPS  
List of Figures  
Figure 1. Intel® Server Platform SR6850HW4, Bezel Removed..................................................4  
Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed...............5  
Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed...........................6  
Figure 4. Server Platform SR6850HW4 Chassis Block Diagram................................................7  
Figure 5. Rear View of the Server Platform SR6850HW4 ........................................................10  
Figure 6. Server Platform SR6850HW4 Rack and Pedestal Configurations .............................24  
Figure 7. Server Platform SR6850HW4, Bezel and Top Cover Removed................................24  
Figure 8. Rear of Server Platform SR6850HW4, Power Supplies Installed..............................25  
Figure 9. System Fan.................................................................................................................26  
Figure 10. Mainboard and Sheet Metal Tray, Assembly............................................................27  
Figure 11. Hot-Swap Hard Drive Carrier....................................................................................28  
Figure 12. Optical Drive Carrier with SATA-to-IDE Converter Board.........................................28  
Figure 13. Front Panel with Button Control Panel......................................................................29  
Figure 14. Front Panel with Intel® Local Control Panel ..............................................................29  
Figure 15. Front Bezels (Rack and Pedestal)............................................................................30  
Figure 16. Server Platform SR6850HW4 Interconnect Diagram...............................................32  
Figure 17. Dual Stacked Ethernet Connector ............................................................................38  
Figure 18. 68-Pin SCSI Connector Non-Shielded......................................................................40  
Figure 19. SCA2 80-Pin SCSI Connector..................................................................................41  
Figure 20. AC Power Input Connector.......................................................................................42  
Figure 21. 1570W Power Supply ...............................................................................................51  
Figure 22. Power Supply Mechanical Specification...................................................................53  
Figure 23. Power Supply Signal Sharing ...................................................................................63  
Figure 24. Power Distribution Board Layout ..............................................................................64  
Figure 25. Power Distribution Board to Power Supply Module Docking Connector Signals......65  
Figure 26. Mainboard Connector Signals ..................................................................................66  
Figure 27. Server Platform SR6850HW4 SCSI Backplane Board Board Block Diagram .........68  
Figure 28. SCSI Backplane Board Board Component Placement (Primary Side).....................70  
Figure 29. SCSI Backplane Board Board Component Placement (Primary Side).....................71  
Figure 30. SCSI Backplane Board Board Component Placement (Secondary Side) ................72  
Figure 31. Enclosure Management Signal Flow Diagram..........................................................75  
Figure 32. Front Panel I/O Board Block Diagram ......................................................................86  
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Figure 33. Front Panel I/O Board Placement Diagram ..............................................................87  
Figure 34. Front Panel I/O Board...............................................................................................88  
Figure 35. Button Control Panel Features .................................................................................92  
Figure 36. Local Control Panel Features ...................................................................................95  
Figure 37. SATA-to-IDE Converter Board Mechanical Outline..................................................97  
Figure 38. SATA-to-IDE Converter Board..................................................................................97  
Figure 39. SATA-to-IDE Converter Board with Attached Optical Drive......................................98  
Figure 40. SATA-to-IDE Converter Board with Attached Optical Drive......................................98  
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List of Tables  
Intel® Server Platform SR6850HW4 TPS  
List of Tables  
Table 1. Intel® Server Platform SR6850HW4 Feature List...........................................................3  
Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed.................................8  
Table 3. System Power Budget .................................................................................................15  
Table 4. Expansion Support.......................................................................................................20  
Table 5. Environmental Specifications Summary ......................................................................21  
Table 6. Physical Specifications ................................................................................................22  
Table 7. Cable Descriptions.......................................................................................................33  
Table 8. Connector Descriptions................................................................................................33  
Table 9. Video Connector Pinout...............................................................................................35  
Table 10. Dual USB Connector Pinout .....................................................................................36  
Table 11. TaDual Ethernet Stacked Connector .........................................................................37  
Table 12. Server Management Ethernet Connector ..................................................................38  
Table 13. Ultra320 SCSI VHDCI Connector Pinout...................................................................39  
Table 14. 68-Pin SCSI Connector Pinout ..................................................................................40  
Table 15. SCA2 Drive Connector Pinout ...................................................................................41  
Table 16. 3-pin Chassis Intrusion Connector.............................................................................42  
Table 17. Power Connector Pinout............................................................................................42  
Table 18. 30-pin Power Distribution Board to Mainboard Connector.........................................43  
Table 19. Front Panel I/O Board Connector Signal Description ................................................43  
Table 20. 100-pin Connector Pinout (Unused and Ground) ......................................................44  
Table 21. 100-pin Connector Pinout (Signals)...........................................................................44  
Table 22. Peripheral Power Connector......................................................................................45  
Table 23. 12-pin Fan Power and Control...................................................................................46  
Table 24. 24-pin Fan Power and Control J6E1..........................................................................46  
Table 25. Front Panel Control Module Connector Signal Description .......................................47  
Table 26. SATA-to-IDE Converter Board Connector .................................................................48  
Table 27. SATA-To-IDE Converter Board Power Connector.....................................................48  
Table 28. SATA Signal Connector.............................................................................................49  
Table 29. PowerBlade Pin Assignment......................................................................................54  
Table 30. AC Input Rating..........................................................................................................55  
Table 31. DC Output Voltage Regulation Limits ........................................................................56  
Table 32. 1570W Load Ratings .................................................................................................57  
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List of Tables  
Table 33. Over- and Under-voltage Limits.................................................................................57  
Table 34. Over-current Protection Limits ...................................................................................58  
Table 35. Output Current Sharing..............................................................................................59  
Table 36. I/O Port Expander Signals .........................................................................................60  
Table 37. I/O Port Expander Codes...........................................................................................60  
Table 38. Power Supply Fan Voltage ........................................................................................61  
Table 39. Hot-swap SCSI Hard Disk Drive LED Details ............................................................74  
Table 40. I2C Local Bus Addresses ...........................................................................................76  
Table 41. Global I2C Bus Addresses (IPMB Bus) ......................................................................77  
Table 42. I2C IO Bus Address....................................................................................................77  
Table 43. Power Interface Signals.............................................................................................79  
Table 44. Front Panel I/O Board Power Interface Signals.........................................................79  
Table 45. Front Panel I/O Board Ribbon Connector Signal Description....................................79  
Table 46. LVD SCSI Connector Signal Description...................................................................80  
Table 47. .LVD SCSI Bus Signals..............................................................................................81  
Table 48. Internal Logic Signals.................................................................................................82  
Table 49. Electrical Specifications .............................................................................................83  
Table 50. Maximum Power Consumption..................................................................................83  
Table 51. SCSI Backplane Board Board Power Limits per Drive ..............................................84  
Table 52. DC Voltage Regulation ..............................................................................................84  
Table 53. USB Connector..........................................................................................................89  
Table 54. VGA Connector Signal Description............................................................................90  
Table 55. Electrical Specifications .............................................................................................90  
Table 56. Maximum Power Consumption..................................................................................91  
Table 57. DC Voltage Regulation ..............................................................................................91  
Table 58. Server Platform SR6850HW4 Front Panel I/O Board Connector Specifications ......91  
Table 59. Button Control Panel Details......................................................................................92  
Table 60. System ID LED Details ..............................................................................................95  
Table 61. Product Regulatory Compliance Markings...............................................................101  
Table 62. Regional EMC Compliance Information...................................................................102  
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Intel® Server Platform SR6850HW4 TPS  
Product Overview  
1.  
Product Overview  
This product specification details the features of the Intel® Server Platform SR6850HW4.  
Reliability, low cost, time to market, modularity, high performance, and management features  
are primary considerations in the design.  
The Server Platform SR6850HW4 supports up to four 64-bit Intel® Xeon™ Processors MP with  
up to 8MB L3 cache and incorporates features that clearly differentiate it as a high availability  
server. Building on previous server platforms, the Server Platform SR6850HW4 introduces  
redundant memory and networking in addition to the enterprise features of hot-swap power,  
cooling, PCI slots, and hard disk drives. Advanced server management features are also  
included to remotely monitor and manage the server. Finally, the server has two optional mass  
storage expansion features.  
This document is organized into ten chapters:  
Chapter 1:  
Introduction  
An overview of this document.  
Chapter 2:  
System Overview  
An overview of the system hardware.  
Chapter 3:  
System Chassis and Sub-Assemblies  
An overview of the chassis and major sub-assemblies.  
Chapter 4:  
Cables and Connectors  
Describes the cables and connectors specific to the Server Platform SR6850HW4.  
Chapter 5:  
Power Supply  
Describes the power supplies used in the Server Platform SR6850HW4.  
Chapter 6:  
Power Distribution Board  
Describes the Power Distribution Board used in the Server Platform SR6850HW4 and  
Intel® Server Platform SR4850HW4.  
Chapter 7:  
SCSI Backplane Board  
Describes the SCSI Backplane Board used in the Server Platform SR6850HW4.  
Chapter 8:  
Front Panel I/O and Control Boards  
Describes the Front Panel I/O Board and Control Boards used in the Server Platform  
SR6850HW4.  
Chapter 9:  
SATA-to-IDE Converter Boards  
Describes the SATA-to-IDE Converter Board used in the Server Platform SR4850HW4  
and Server Platform SR6850HW4.  
Chapter 10: Regulatory Specifications  
Describes system compliance to regulatory specifications.  
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System Overview  
2.  
System Overview  
This chapter describes the features of the Intel® Server Platform SR6850HW4.  
2.1  
System Feature Overview  
Table 1 provides a list and brief description of the features of the Server Platform SR6850HW4,  
which utilizes the Intel® Server Board Set SE8500HW4.  
Table 1. Intel® Server Platform SR6850HW4 Feature List  
Feature  
Compact, high-density  
system  
Description  
Rack-mount server with a height of 6U (10.5 inches) and a depth of 28 inches (706mm)  
Configuration flexibility  
One to four 64-bit Intel® Xeon™ processors MP with up to 8MB L3 cache  
Two Ultra320* SCSI ports  
Two gigabit Ethernet ports  
Ten 1-inch hot-swap Ultra320 SCSI hard disk drives  
Seven PCI adapters (Four PCI Express* hot-plug, one PCI-X* 133MHz hot-plug, two PCI-X  
100Mhz)  
64GB Double Data Rate2 (DDR2) 400 MHz Synchronous Dynamic Random Access  
Memory (SDRAM), ECC Registered  
Customizable bezel  
Optional system-specific 2Gbps Fibre Channel Module  
Optional RAID On Motherboard (ROMB) with DDR2 DIMM for disk cache and optional  
RAID Smart Battery (RSB) for cache battery backup  
Either button or LCD front panel  
Either Intel® Management Module (IMM) – Professional or Advanced  
Tool-less design features  
Serviceability  
Front access to hot-swap hard disk drives  
Top access to hot-plug PCI slots, cooling, and Hot-Swap Memory Boards  
Rear access to hot-swap power supplies  
Status and fault indicator LEDs  
Front and rear viewable System ID switches and LEDs  
Top viewable memory configuration and status LEDs  
Processor failure LEDs  
Detailed configuration label on top cover  
Color-coded parts to identify hot-swap and non-hot-swap serviceable components  
Two 1570W power supplies in a redundant (1+1) configuration with separate power cords  
Four Hot-Plug Memory Boards  
Availability  
Manageability  
Remote management  
Intelligent Platform Management Interface (IPMI) 2.0 compliant  
Wired For Management (WfM) 2.0 compliant  
Emergency Management Port (EMP) – IPMI over serial or modem  
Extensive system sensors and monitoring  
Remote diagnostics support via serial and LAN ports  
Web management console  
With IMM Advanced:  
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System Overview  
Feature  
Intel® Server Platform SR6850HW4 TPS  
Description  
Dedicated Out-Of-Band management RJ45 port (telnet, embedded web server, DNS,  
DHCP)  
KVM console redirection and remote viewer  
Full SNMP access  
Front panel interface  
Switches: Power, Reset, NMI, System ID  
LEDs: Power, System ID, System status,  
LAN1 and LAN2 Activity, Hard drives status  
Ports: Video connector, Three USB 2.0  
Optional LCD  
2.2 Introduction  
The platform supports sockets for up to four 64-bit Intel Xeon processors MP, up to 64GB of  
memory, ten hot-swap hard disk drives, seven PCI slots, two different server management  
modules, two different front control panels, and two optional mass storage expansions. The  
server can be configured for use as either a rack, as shipped, or pedestal, with an optional  
accessory kit.  
Figure 1, Figure 2 and Figure 3 show front and rear views of the platform.  
Figure 1. Intel® Server Platform SR6850HW4, Bezel Removed  
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System Overview  
1
2
TP01504  
Figure 2. Server Platform SR6850HW4, Bezel and Pedestal Conversion Kit Installed  
The Server Platform SR6850HW4 includes the Intel® Server Board Set SE8500HW4 with  
the E8500 chipset. To provide structural support the Intel Server Board Set SE8500HW4  
Mainboard is mounted on a sheet metal tray that is installed at the rear of the chassis,  
above the power supplies.  
Up to four Memory Boards can be installed into the Server Board Set SE8500HW4  
Mainboard. The Memory Boards attach perpendicular to the Server Board Set SE8500HW4  
Mainboard. These contain four DDR2 400HMz SDRAM DIMM slots each. With four Memory  
Boards installed, the system supports up to 64GB of memory (using 4GB DIMMs).  
The hard drive bay, located at the front of platform, provides a bay for ten hot-swap 1-inch  
Ultra320* SCSI hard disk drives. SCSI hard disk drives plug into a vertical SCSI Backplane  
Board at the rear of hard disk drive bay. One Slimline (½-inch high) optical drive bay and  
one full-height 5¼-inch SCSI tape device bay are also located at the front of the platform.  
The cooling subsystem requires six hot-swap system fan modules. Each fan module  
contains a status LED that illuminates in the event of a fan failure. The fan modules are  
accessible from the top of the system when the top cover is removed and connected into the  
SCSI Backplane Board.  
The front control panel provides video, USB, buttons, status LEDs, and an optional LCD,  
that are used for monitoring and managing the platform. The front bezel is an optional  
cosmetic accessory that is installed with snap-on features. The bezel can be customized to  
meet integrator-specific industrial design requirements, including color and imprint.  
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Figure 3. Server Platform SR6850HW4, Rear View with Top Cover Removed  
The power supply modules are located at the rear of the system below the Server Board Set  
SE8500HW4 Mainboard and plug directly into connectors on the horizontally oriented Power  
Distribution Board. The system supports two hot-swap power supply modules in a 1+1  
redundant configuration or one hot-swap power supply and a power bay fan module in a  
non-redundant state.  
Upon removal of the top cover, the user has access to the processors, Memory Boards, PCI  
adapters, IMM Board and optional mass storage features.  
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Intel® Server Board SE8500HW4 Main Board  
CPU  
3
CPU  
2
CPU  
4
CPU  
1
Memrar
SE8500HW4 Memory Board  
DDR2 DIMM  
FSB 1  
FSB 0  
XMB  
DDR2 DIMM  
IMI D  
DDR2 DIMM  
IMI C  
IMI B  
IMI A  
E8500  
North Bridge  
(NB)  
DDR2 DIMM  
DDR2 RAID DIMM  
RAID Smart  
Battery  
RAID  
Act Key  
BRCM5704*  
Ethernet  
Controller  
Ethernet Port  
Ethernet Port  
IOP332  
Processor  
LSI*  
External SCSI  
Connector  
(optional)  
53C1030  
Ultra320*  
SCSI  
SCSI Channel B  
6700  
PXH  
Controller  
USB Port  
USB Port  
82801EB  
ICH5  
ATI*  
Radeon*  
7000  
Video Port  
Video  
Controller  
SIO  
COM1/EMP  
IMM  
FWH  
10/100  
GCM  
(optional)  
SCSI Cable  
(optional)  
Power and  
Signal  
SATA Cable  
SATA-to-IDE  
SCSI Cable  
Power  
Power  
Converter Board  
Dist Board  
SCSI  
Backplane Board  
Video Port  
USB Port  
USB Port  
USB Port  
Front  
Panel I/O  
Board  
Optical  
Drive  
Hot-swap SCSI Drives (10)  
Front Control Panel  
SCSI  
Tape  
Optional LCD  
Hot Swap Fans (6)  
Figure 4. Server Platform SR6850HW4 Chassis Block Diagram  
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2.3 External Chassis Features - Front  
Table 2 shows the front view of the Server Platform SR6850HW4 with the bezel removed.  
The front provides access to the following components:  
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Buttons and LEDs (with optional LCD)  
Video and USB connectors  
Hard drive bay, optical drive, SCSI tape device  
A
B
C
D
E
G
F
TP01508  
A
Video connector  
B
C
D
E
F
USB 2.0 ports (three)  
Front control panel (button control panel shown)  
Hot-swap fans (six)  
5 ¼ peripheral bay (full height)  
Optical drive bay  
G
Hot-swap SCSI hard disk drives (ten)  
Table 2. Front View of the Server Platform SR6850HW4, Bezel Removed  
2.3.1  
Front Control Panel  
The front control panel contains system control buttons and LED status indicators. It also  
contains one video connector, three USB 2.0 ports, NMI button, and the system speaker.  
The front bezel must be removed to access the front control panel switches and connectors.  
All LEDs are visible with the front bezel installed. See Chapter 8 or a description of the Front  
Panel Boards.  
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2.3.2  
Hot-swap Hard Disk Drive and Peripheral Device Bays  
The hard disk drive and peripheral device bays can accommodate the following devices:  
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Ten 1-inch hot-swap Ultra320 SCSI hard disk drives  
One ½-inch optical drive (installed with base system)  
Two half-height or one full-height 5¼-inch SCSI tape device  
Note:  
Cooling and EMI constraints do not allow installation of an IDE hard disk drive in  
the tape device bay.  
The SCSI Backplane Board supports Low Voltage Differential (LVD) SCSI drives only.  
Single-ended (SE) devices are supported off the secondary external SCSI channel on the  
Server Board Set SE8500HW4 Mainboard. SE devices are not supported in the hot-swap  
hard disk drive bays in the front of the system, or validated by Intel.  
The optical drive and SCSI tape device(s) are not hot-swap devices. System power must be  
turned off when installing or removing these drives.  
Because hard disk drives have different cooling, power, and vibration characteristics, Intel  
will validate specific hard disk drive types in the Server Platform SR6850HW4. See the Intel  
Server Board Set SE8500HW4 Tested Hardware and Operating System List for the qualified  
drives.  
The hard disk drive carriers supplied with the system accommodate 3½-inch x 1-inch SCSI  
hard disk drives. The hard disk drive is attached to the carrier with four Phillips*-head  
screws. The carrier is retained in the chassis by a locking handle.  
The SCSI Backplane Board contains a dual color LED for each hard drive to display status.  
The LED signal is transmitted to the front of the system via a light pipe integrated in the hard  
drive carrier.  
Due to the required cable length and bus performance, the Server Board Set SE8500HW4  
Mainboard contains a Serial ATA (SATA) connecter instead of a Parallel ATA (PATA)  
connector. The optical drive connects to the SATA-to-IDE Converter Board, which converts  
the SATA signal to an IDE signal for the 1/2-inch optical drive. The optical drive is installed  
in a sheet metal bracket and then installed in the Server Platform SR6850HW4.  
See Chapter 7 for a description of the SCSI Backplane Board. See Chapter 9 for  
descriptions of the SATA-to-IDE Converter Board.  
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Intel® Server Platform SR6850HW4 TPS  
2.4 External Chassis Features - Rear  
Figure 5 shows the rear view of the Server Platform SR6850HW4. The user-accessible  
connectors, PCI slots, and power supply modules located at the rear of the system are described  
in the following sections.  
D
C
A
B
F
E
1
2
3
4
5
6
7
P
I
N
G H  
J
K
L
M
O
TP01507  
A
B
C
Video connector  
Serial port connector  
PCI slots  
Slot 1  
Slot 2  
Slot 3  
Slot 4  
Slot 5  
Slot 6  
Slot 7  
PCI Express* x8 (hot-plug)  
PCI-X* 133Mhz, 64-bit (hot-plug)  
PCI Express x4 (hot-plug)  
PCI Express x4 (hot-plug)  
PCI Express x4 (hot-plug)  
PCI-X 100Mhz, 64-bit (not hot-plug)  
PCI-X 100Mhz, 64-bit (not hot-plug)  
D
E
F
G
H
I
External SCSI connector  
System ID LED (blue)  
Fibre Channel Module slot (optional accessory)  
Power supply unit  
USB 2.0 ports (two)  
LAN ports, RJ45 connector (LAN1 on top, LAN2 on bottom)  
AC input power connector  
J
K
L
Power supply unit status LEDs  
Power cord retention featurek  
Active fan power supply blank  
System ID button  
M
N
O
P
DC jack (not used)  
Dedicated server management port, RJ45 connector (used with the IMM Advanced)  
Figure 5. Rear View of the Server Platform SR6850HW4  
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2.5 Internal Chassis Features  
2.5.1  
Server Board Set SE8500HW4 Mainboard  
The Server Board Set SE8500HW4 Mainboard supports the following features:  
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Four sockets for 64-bit Intel Xeon processors MP with 1MB L2 cache or 64-bit Intel  
Xeon processors with up to 8MB L3 cache  
Four PCI Express* x16 Memory Board connectors  
-
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Four independent memory interface buses  
Supports hot-remove and hot-add operations  
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Dual 667 MT/s Front Side Buses (FSB)  
Intel E8500 chipset North Bridge (NB) with two shared 64-bit FSB interfaces  
configured for symmetric multiprocessing (SMP)  
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Intel E8500 chipset eXtended Memory Bridge (XMB) for support of memory hot-plug  
Intel® 6700 PXH 64-bit Hub which acts as the bridge between the NB and PCI-X bus  
Intel® 82801EB I/O Controller Hub 5 (ICH5) which provides USB 2.0 and SATA  
Intel® IOP332 storage I/O Processor for mass storage and PCI-X slots  
LSI Logic* 53C1030 Ultra320* SCSI Controller: provides two independent Ultra320  
SCSI interfaces  
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Broadcom* BRCM5704 NetXtreme* Gigabit Ethernet controller: provides two ports  
on the rear of the Mainboard  
ATI* Radeon* 7000 video controller  
-
-
16MB embedded SDRAM  
Mirrored to both the rear and front I/O ports by default  
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Advanced I/O slots including PCI Express and PCI-X and support circuits:  
-
-
-
-
One hot-plug PCI Express x8 slot  
Three hot-plug PCI Express x4 slots  
One hot-plug 64-bit PCI-X 133MHz slot  
Two 64-bit PCI-X 100MHz slots (not hot-plug)  
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Buttons and LED indicators for PCI hot-plug slots  
Low Pin Count (LPC) Super I/O* enables the serial port/EMP  
USB 2.0 support  
-
-
Two ports at the rear of chassis  
Three ports on front of the chassis  
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4MB Flash capacity to support rolling BIOS updates  
Optional ROMB support: provides two channels of RAID 0, 1, 5, 10 or 50  
Optional custom Fibre Channel Module: provides two optical connectors  
Server management support via the Intel Management Module (IMM) connector  
See the Intel Server Board Set SE8500HW4 Technical Product Specification for a  
description of this board.  
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Intel® Server Platform SR6850HW4 TPS  
2.5.2  
Server Board Set SE8500HW4 Memory Board  
Each Memory Board supports the following features:  
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PCI Express x16 card edge connector that plugs into the Server Board Set  
SE8500HW4 Mainboard  
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Intel E8500 chipset eXtended Memory Bridge (XMB)  
Four DDR2 400HMz DIMM slots for registered ECC memory  
Support for both single-rank and dual-rank DIMMs  
Two DDR2 400MT/s busses  
Independent Memory Interface (IMI), a high-speed differential bus  
LED error indicators for each DIMM and an attention LED for hot-plug events  
LED indicator for both memory mirroring and RAID configurations  
Memory hot-plug at the card level, based on the PCI hot-plug model  
Field Replaceable Unit (FRU) device  
Two temperature sensors  
Safety mechanism for instant power shut-down to the Memory Board when not  
properly removed or inserted  
See the Intel Server Board Set SE8500HW4 Technical Product Specification for  
descriptions of this board.  
2.5.3  
Power Distribution Board  
The Power Distribution Board is located horizontally, below the Server Board Set  
SE8500HW4 Mainboard in the middle-rear of the chassis. It has two connectors for the hot-  
swap power supply modules and provides 12V, standby power and server management  
signals to the Server Board Set SE8500HW4 Mainboard and SCSI Backplane Board. The  
power distribution circuitry reports quantity, quality, and location of the installed power  
supplies through I2C server management. See Chapter 6 for a description of this board.  
2.5.4  
SCSI Backplane Board Board  
The SCSI Backplane Board mounts vertically in the front of the system and contains ten  
industry-standard hot-swap Single Connector Attach 2 (SCA-2) connectors (80-pin).  
Ultra320 (or slower) Low Voltage Differential (LVD) SCSI hard disk drives can be installed in  
the system. The backplane accepts 15,000-RPM (and slower) hard disk drives. Single-  
Ended (SE) SCSI devices are not supported in the hot-swap hard disk drive bay.  
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The SCSI Backplane Board performs the tasks associated with hot-swapping of the hard  
disk drives and enclosure (chassis) monitoring and management, as specified in the SCSI  
Accessed Fault-Tolerant Enclosures (SAF-TE) Specification. The SAF-TE-specified features  
supported by the SCSI Backplane Board include, but are not limited to, the following:  
ƒ
Monitoring the SCSI bus for enclosure services messages, and acting on them  
appropriately. Examples of such messages include: activate a drive fault indicator;  
power down a drive that has failed; and report backplane temperature.  
SAF-TE intelligent agent acts as proxy for "dumb" I2C devices (that have no bus  
mastering capability) during intrachassis communications.  
ƒ
The SCSI Backplane Board connects to the Server Board Set SE8500HW4 Mainboard,  
provides power, and signals to the front of the chassis. See Chapter 7 for a description of  
this board.  
2.5.5  
Front Panel I/O Board  
The Front Panel I/O Board mounts horizontally in the front left of the system and  
communicates with the SCSI Backplane Board. The board contains a video connector, three  
USB ports and an NMI button. See Chapter 8 for a description of this board.  
2.5.6  
Front Panel Control Board  
Two different front panel Control Boards are supported, the standard control panel and the  
Intel Local Control Panel (LCP). Both mount vertically into the chassis and connect to the  
Front Panel I/O Board via a cable. Each module houses the system operating buttons, LEDs  
and the Local Control Panel has an LCD. See Chapter 8 for a description of these boards.  
2.5.7  
SATA-to-IDE Converter Board  
The SATA-to-IDE Converter Board attaches to the optical drive carrier, receives the SATA  
signal from the Server Board Set SE8500HW4 Mainboard via a SATA cable, and converts it to  
IDE signals routed to the optical drive. See Chapter 9 for a description of this board.  
2.5.8  
Intel® Management Module  
The Intel Management Module (IMM) mounts onto the Server Board Set SE8500HW4  
Mainboard and contains the Baseboard Management Controller (BMC) that provides server  
management support. There are two versions of the IMM, the Professional and Advanced.  
The Advanced module adds more support for remote management. The Server Platform  
SR6850HW4 will not boot without one of these modules installed. See the Intel Management  
Module Installation and User’s Guide or the Intel Management Module Technical Product  
Specification for a description of this part.  
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Intel® Server Platform SR6850HW4 TPS  
2.5.9  
Fibre Channel Module  
The Server Board Set SE8500HW4 Mainboard supports the Intel Fibre Channel Module as  
a mass storage expansion option. The card is based on the Qlogic* ISP2322 FC PCI-X  
controller and plugs into a reversed PCI Express x16 slot on the Server Board Set  
SE8500HW4 Mainboard. See the Intel Fibre Channel Module Users Guide for descriptions  
of this board.  
2.5.10  
RAID On Motherboard (ROMB)  
The Server Board Set SE8500HW4 Mainboard supports a RAID On Motherboard (ROMB)  
solution via the Intel IOP332 storage I/O Processor in conjunction with the LSI Logic*  
53C1030 SCSI controller. To enable this option the Intel RAID Activation Key and a DDR2  
400MHz DIMM are required. The optional Intel RAID Smart Battery is also available to  
maintain the contents of the DIMM in the event of power loss. See the Intel RAID Smart  
Battery Technical Product Specification for a description of the ROMB solution.  
2.5.11  
Power Supply Module  
Two hot-swap power supply modules are installed side by side at the rear of the chassis.  
Each supply has its own AC input power connector and is rated at 1570W over an input  
range of 100-240 VAC.  
The power subsystem is configured as follows:  
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With two power supply modules installed, a fully configured system has (1+1) power  
redundancy.  
With one supply module installed, the system does not have redundant power but  
will still run a fully configured system.  
Note: When only one power supply module is installed, the active fan module is required in  
the unpopulated power supply slot for proper system cooling.  
One power supply module is capable of handling the maximum power requirements for a  
fully configured Server Platform SR6850HW4, which includes four processors, 64 GB of  
memory, seven PCI add-in cards, ten hot-swap hard disk drives, an optical drive, a Fibre  
Channel Module, ROMB options installed, and a SCSI tape device.  
When two power supply modules are installed, the user can replace a failed power supply  
module without affecting the system functionality. Power supplies have three LEDs to  
identify failure, power good and AC OK.  
The power subsystem receives AC power through two power cords. When two power supply  
modules and two power cords are installed, the system has (1+1) power cord redundancy  
and can be powered by two separate AC sources. In this configuration, the system will  
continue to function without interruption if one of the AC sources fails. See Chapter 5 for  
more information.  
Note: The total power requirement for the Server Platform SR6850HW4 exceeds the 240  
VA energy hazard limits that define an operator accessible area. As a result, only  
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qualified technical individuals should access the processor and non-hot-plug I/O  
areas while the system is energized. Power cords should be removed from the  
system before accessing non-hot-plug areas.  
2.5.11.1  
System Power Budget  
Table 3 shows a summary of the system power budget. The power budget lists each major  
voltage rail in columns and each major subsystem of the product in rows. The worst-case  
power per subsystem is listed for each voltage rail. The total power per voltage rail, the  
power supply specification, and the margin available are shown at the bottom of the table.  
Table 3. System Power Budget  
Subsystem  
Mainboard  
Qty +3.3V  
49W  
+5V  
+12V (Total) +3.3Vstby  
1
27W  
147W  
2.5W  
15W  
SCSI Backplane Board  
Board  
1
2.5W  
Front Panel I/O Board  
and front panel  
1ea 2W  
2W  
Processors  
4
448W  
192W  
173W  
84W  
Memory  
16  
6
4W  
Fans  
Hard disk drives  
½inches optical drive  
SCSI tape device  
PCI-X* slots  
10  
1
28W  
1W  
6W  
1
3W  
7W  
3
45W  
PCI Express* slots  
Fibre channel module  
System Total  
Power subsystem spec  
Margin  
4
80W  
1
15W  
1189.5W  
1570W  
380.5W  
15W  
16.5W  
1.5W  
Notes:  
1. 3.3V and 5V are derived from the 12V single switched output of the power  
supply modules. The 12V column includes the 3.3V and 5V power.  
2. 3.3Vstby is the standby output of the power supply modules.  
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2.5.12  
Cooling Subsystem  
Primary cooling is generated by six fans, located at the top front of the chassis. It connects  
to the SCSI Backplane Board for power and server management. Air flows in through the  
front and exhausts out the rear of the chassis. The chassis has several air baffles to duct the  
air over critical parts, including processors, memory, and peripherals. Processor heat sinks  
or processor heat sink blanks, and Memory Boards or Memory Board blanks must be  
installed in each corresponding area to ensure proper airflow.  
The system fans are sized to provide cooling for a fully configured system. The cooling  
system is designed using a worst-case analysis and appropriate fan speeds were chosen to  
meet acoustic and thermal requirements. Server management controls fan speed based on  
ambient and component temperatures. To ensure proper cooling, failed fans should be  
replaced within 1 minute.  
2.6 New Platform Features  
2.6.1  
Advanced Memory Performance and Protection  
The Server Board Set SE8500HW4 supports several new memory features that allow  
flexibility in performance, redundancy and the ability to upgrade. The System BIOS can be  
configured as follows:  
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Maximum performance, where memory is up to four-way interleaved  
Maximum compatibility, where memory can be hot-added  
Memory mirroring, where two or four boards are used to keep a copy of system  
memory  
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Memory RAID, where four boards are used in a RAID4-like mode  
Memory sparing, where a portion of each Memory Board is reserved for failover.  
Hot-replace means the user can replace a Memory Board with another Memory Board of  
identical total size. This operation is supported in maximum compatibility, memory RAID and  
memory mirroring modes.  
Hot-add means the user can add a Memory Board to a previously unoccupied slot. This  
requires operating system support and is supported in memory compatibility and memory  
mirroring modes.  
Hot-removal means the user can remove a Memory Board. This operation is supported in  
memory RAID and memory mirroring modes.  
Hot upgrade means the user can replace an existing Memory Board with a Memory Board  
that contains more memory capacity. A hot upgrade is not a unique operation, it is  
implemented as a hot-remove followed by a hot-add. This requires operating system support  
and is supported by the memory RAID mode only.  
See the Intel Server Board Set SE8500HW4 Technical Product Specification for more  
details on these new features.  
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2.6.2  
Rolling BIOS  
The Server Board Set SE8500HW4 Mainboard supports two BIOS images to be stored in  
Flash. This provides a mechanism for BIOS updates without a system reboot as well as  
failover to an alternate image in the event of BIOS corruption. The system runs with the  
current BIOS until a reboot, after which time the updated BIOS is used. See the Intel Server  
Board Set SE8500HW4 Technical Product Specification for more details on this feature.  
2.7 Server Management  
The management subsystem conforms to the IPMI v2.0 Specification. The server  
management features are implemented using two microcontrollers: the Intel Management  
Module that plugs into the Server Board Set SE8500HW4 Mainboard, and the SCSI hot-swap  
controller on the SCSI Backplane Board. The functions of each component are summarized  
in the following sections.  
2.7.1  
Intel Management Module (IMM)  
The IMM has a Baseboard Management Controller (BMC) microcontroller and associated  
circuitry. The IMM contains flash memory that holds the operation code and the BMC  
configuration settings. The IMM monitors platform management events and logs their  
occurrence on the onboard non-volatile System Event Log (SEL). This includes events such  
as over-temperature and over-voltage conditions, fan failures, etc. The IMM also provides  
the interface to this monitored information so system management software can poll and  
retrieve the present status of the platform.  
The IMM also provides the interface to the non-volatile Sensor Data Record (SDR)  
repository. SDRs provide a set of information that system management software can use to  
automatically configure itself for the number and type of IPMI sensors (e.g., temperature  
sensors, voltage sensors, etc.) in the system.  
The following is a list of the major functions for the IMM:  
ƒ
System power control  
-
-
-
ACPI power control  
ACPI sleep support  
Minimum power off time  
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System reset control  
System initialization  
-
-
Processor temperature and voltage threshold setting  
Fault Resilient Booting (FRB)  
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Front panel user interface  
-
-
-
-
-
-
System status (green) LED control  
System status (amber) LED control  
System ID LED control  
Reset button control  
Power button control  
SDINT button control  
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-
System ID Button control  
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System fan management  
System management watchdog timer  
System Event Log (SEL) interface – up to 3,200 entries  
Sensor Data Record (SDR) repository interface  
SDR/SEL timestamp clock  
FRU inventory device  
Diagnostics and beep code generation  
Event message generation and reception  
Platform Event Paging and Platform Event Filtering (PEP and PEF)  
Dial page alerting  
Alert over LAN and serial/PPP  
Serial over LAN (SOL)  
Terminal Mode (TM)  
Battery monitoring  
Sensor monitoring  
-
-
-
-
-
Temperature  
Voltage  
Fan speed  
Processor status  
Power supplies  
ƒ
Processor Information ROM (PIROM) and Scratch Electrically Erasable  
Programmable ROM (SEEPROM) access  
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IPMB communication interface  
Emergency Management Port (EMP) interface - IPMI messaging over Serial/Modem.  
This feature is also referred to as DPC (Direct Platform Control) over Serial/Modem  
ƒ
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Inter-Chassis Management Bus (ICMB) interface - IPMI messaging between chassis  
Additional features with IMM Advanced installed:  
-
-
-
-
Dedicated (Out-Of-Band) LAN interface through the Generic Communication  
Module (GCM) on the rear of chassis (IMM Advanced)  
BMC-resident SNMP support for Out-Of-Band access using 3rd party applications  
such as HP* Openview*  
Embedded web server to access system health, view the SEL and issue IPMI  
commands  
Embedded Command Line Interface (using telnet server running on the BMC) to  
allow direct access to the BMC  
-
-
Alerting via email  
Keyboard, Video, Mouse (KVM) console redirection and remote viewer  
See the Management Module Technical Product Specification for more information.  
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System Overview  
2.7.2  
Hot Swap Controller  
Two hot-swap controllers are on the SCSI Backplane Board. The primary function of each  
hot-swap controller is as follows:  
ƒ
ƒ
ƒ
ƒ
Implements the SAF-TE command set  
Controls the SCSI hard disk drive power, activity and fault LEDs  
Provides a path for management information via the SCSI bus  
Retrieves hard disk drive fault status, SCSI Backplane Board temperature, and fan  
failure information via IPMB  
ƒ
ƒ
Queries the status of the Power Distribution Board by retrieving information from the  
IMM via IPMB  
Controls hard disk drive power-on and power-down, facilitating hot-swapping  
2.8 Reliability, Availability, Serviceability, Usability, Manageability  
(RASUM)  
The Server Platform SR6850HW4 supports the following reliability, availability,  
serviceability, usability and manageability (RASUM) features:  
ƒ
Reliability features  
-
-
-
-
-
-
Machine check architecture  
Error Checking Code (ECC) in main memory and processor caches  
ECC, parity, and protocol checking on the FSB  
Parity on the Hub Link (HL-1.5) interface  
Parity checking on PCI buses  
RAID On Motherboard (ROMB) with the Intel RAID Smart Battery which provides  
battery back-up to the DDR2 400MHz DIMM for disk cache  
-
Voltage and temperature monitoring throughout the system  
ƒ
Availability features  
-
-
-
-
-
-
-
Hot-plug PCI Express and PCI-X  
Hot-Plug Memory Boards  
Redundant hot-swap power supplies  
Redundant power cords  
Redundant hot-swap system fans  
Hot-swap SCSI hard drives  
Teaming and failover Ethernet ports  
ƒ
Serviceability features  
-
-
Tool-less installation and removal of major sub-assemblies  
Color-coded parts to identify serviceable components  
Green: Hot-swap or hot-plug components  
Blue: Non-hot-swap components  
-
System ID buttons and LEDs  
-
LED indicators for system health, configured options, and activity  
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Intel® Server Platform SR6850HW4 TPS  
ƒ
Usability features  
-
-
-
-
-
Tool-less design features  
External access to hot-swap hard disk drives, power supplies, LEDs and switches  
Front and rear viewable System ID switches and LEDs  
Detailed configuration label on top cover  
Color-coded parts to identify hot-swap and non-hot-swap serviceable components  
ƒ
Manageability features  
-
-
-
-
Remote management via serial and LAN  
IPMI 2.0 and WfM 2.0 compliance  
Remote diagnostics via serial and LAN  
Remote management via KVM and dedicated LAN (IMM Advanced)  
All boards are connected by a server management I2C bus to satisfy the system RASUM  
requirements.  
2.9 Expansion Support  
Table 4 summarizes the expansion support provided by the platform.  
Table 4. Expansion Support  
Quantity  
Type  
4
7
64-bit Intel® Xeon™ processors MP  
PCI expansion bus slots  
10  
1
Single connector attachment (SCA-2) Ultra320* SCSI hard disk drive bays  
5 1/4-inch full-height drive bay  
1
External SCSI connector  
16  
DDR2 400HMz SDRAM registered ECC DIMM module sockets (four per memory  
module)  
1
1
RAID On MotherBoard (ROMB) socket, DDR2 DIMM socket and battery connector  
Fibre Channel module connector (with two FCAL 2GBps connectors)  
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System Overview  
2.10 Specifications  
2.10.1  
Environmental Specifications Summary  
The Server Platform SR6850HW4 will be tested to the environmental specifications as indicated  
in Table 5.  
Table 5. Environmental Specifications Summary  
Environment  
Temperature operating  
Specification  
50°F to 95°F  
10°C to 35°C  
-40°C to 70°C  
-30 to 1,500 m  
Temperature non-operating  
Altitude  
-40°F to 158°F  
-100 to 5,000 ft  
Humidity non-operating  
Vibration non-operating  
Shock operating  
95%, non-condensing at temperatures of 25°C (77°F) to 30°C (86°F)  
2.2 Grms, 10 minutes per axis on each of the three axes  
Half-sine 2 G, 11 ms pulse, 100 pulses in each direction, on each of the three axes  
Trapezoidal, 25 G, two drops on each of six faces  
Shock non-operating  
∆V : 175 inches/sec on bottom face drop, 90 inches/sec on other 5 faces  
Safety  
UL60 950, CSA60 950, AS/NZS 3562, GB4943-1995, EN60 950 and 73/23/EEC, IEC 60  
950, EMKO-TSE (74-SEC) 207/94, GOST-R 50377-92  
Emissions  
Certified to FCC Class A; tested to CISPR 22 Class A, EN 55022 Class A and  
89/336/EEC, VCCI Class A, AS/NZS 3548 Class A, ICES-003 Class A, GB9254-1998,  
MIC Notice 1997-42 Class A, GOST-R 29216-91 Class A, BSMI CNS13438  
Immunity  
Verified to comply with EN55024, CISPR 24, GB9254-1998, MIC Notice 1997-41,  
GOST-R 50628-95  
Electrostatic discharge  
Acoustic  
Tested to ESD levels up to 15 kilovolts (kV) air discharge and up to 8 kV contact  
discharge without physical damage  
Sound pressure: < 55 dBA at ambient temperature < 23° C measured at bystander, floor  
standing position  
Sound power: < 7.0 BA at ambient temperature < 23° C measured using the Dome  
Method  
GOST MsanPiN 001-96  
See Chapter 10 for more information on environmental specifications.  
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Intel® Server Platform SR6850HW4 TPS  
2.10.2  
Physical Specifications  
Table 6 describes the physical specifications of the Server Platform SR6850HW4.  
Table 6. Physical Specifications  
Specification  
Height – 6U  
Value  
262 mm  
10.5inches  
17.6inches  
27.8inches  
3inches  
Width  
447 mm  
706 mm  
76 mm  
25 mm  
152 mm  
60 kg  
Depth  
Front clearance  
Side clearance  
Rear clearance  
Weight (full config)  
1inches  
6inches  
130 lbs  
Note: The system weight is an estimate for a fully configured system and will vary depending on number of  
peripheral devices and add-in cards, and the number of processors and DIMMs installed in the system.  
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Intel® Server Platform SR6850HW4 TPS  
Server System Chassis and Assemblies  
3. Server System Chassis and Assemblies  
This chapter provides an overview of the chassis and assembly pieces that reside within the  
platform. This chapter is divided into the following areas:  
Section 3.1: Chassis, Rails and Top Cover  
Section 3.2: Power and Fans  
Section 3.3: Fan Subsystem  
Section 3.4: Mainboard Assembly  
Section 3.5: Peripherals Bay and Front Panel  
Section 3.6: Front Bezel  
3.1 Chassis, Rails and Top Cover  
3.1.1 Chassis  
The Server Platform SR6850HW4 utilizes a standard 19-inch EIA chassis that is 6U high x 28  
inches deep. The chassis can be rack-mounted or used as a pedestal system. Rack mounting  
the platform requires a 6U x 19 inches x 34 inches deep space, with the extra six inches  
required for cable management. When used in a rack, the chassis can be mounted with an  
optional rail kit and cable management arm. Pedestal operation requires a pedestal conversion  
kit that consists of a different bezel, floor supports/wheels and a cosmetic cover.  
The 6U height is defined by standard EIA rack units where 1U = 1.75-inches. The 28-inch depth  
is measured from the front mounting flange to the back of the PCI slots. This measurement  
does not include cables or the bezel.  
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Figure 6. Server Platform SR6850HW4 Rack and Pedestal Configurations  
Memory Modules  
PCI Adapter Slots  
Slide Rail Mount Points  
(both sides of chassis)  
Figure 7. Server Platform SR6850HW4, Bezel and Top Cover Removed  
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Server System Chassis and Assemblies  
3.1.2 Slide Rails  
The Server Platform SR6850HW4 accommodates slide rails to mount the chassis into a  
standard 19-inch rack. The slide rails attach to studs on the sides of the chassis using keyhole  
features on the slide rails. No loose hardware is needed. Intel produces two accessories  
common to enterprise servers:  
ƒ
ƒ
AXXRAIL3U7U, which attach to the provided mounts, or any 3U to 7U server that has  
mounts in these locations  
AXXCMA3U7U, which attaches to the rail accessory to provide a cable management  
arm.  
3.1.3 Top Cover  
The top cover is a one-piece design. It attaches to the chassis with a series of slots in the sides  
of the chassis that align with tabs in the top cover. To install the top cover, the tabs drop into the  
slots and the cover slides forward. Two captive non-knurled screws on the faceplate secure the  
top cover in place. A tool is required to remove or install these screws. In addition, the cover has  
a label on the bottom side that describes system layout, jumpers and a summary of common  
tasks.  
3.2 Power and Fans  
The power bay provides space for two power supply modules/blanks and for the Power  
Distribution Board. It is an integral member of the chassis structure. Each power supply in the  
power bay is approximately 7.7-inches (W) x 14.2-inches (D) x 4.1-inches (H). The redundant  
AC power inputs are external to the system.  
The Power Distribution Board distributes the power in two ways. First, a connector on the back  
edge of the board mates to the power supplies. Second, a cable routes +12V power to the SCSI  
Backplane Board and +3.3Vstby,+12V power and signals to the Server Board Set SE8500HW4  
Mainboard. The AC power is filtered with a combination 15A power plug integrated with a filter.  
Figure 8. Rear of Server Platform SR6850HW4, Power Supplies Installed  
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3.3 Fan Subsystem  
The six system fans are accessible for hot-swap operations at the top of the chassis. The fan  
assembly has an integrated amber LED wired to the top of the assembly. This LED lights when  
the fan is not functioning within specification. The fan connector extends from the bottom of the  
fan assembly and mates into floating connectors routed to the Server Platform SR6850HW4  
SCSI Backplane Board.  
Failure LED  
Figure 9. System Fan  
3.4 Mainboard Assembly  
The Server Board Set SE8500HW4 Mainboard mounts to a sheet metal tray with four metal  
springs from the Intel Component Enabling Kit (CEK) and four non-captive screws. The Server  
Board Set SE8500HW4 Mainboard assembly is mounted in the chassis with slot and tab hooks.  
It is secured into the chassis by a single captive fastener.  
Memory Boards mount vertically on the left and right side of the board however, processors and  
heatsinks mount in the front.  
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Processors and  
Heat Sinks  
Figure 10. Mainboard and Sheet Metal Tray, Assembly  
3.5 Peripheral Bay and Front Panel  
The peripheral bay is a sheet metal enclosure with features to mount the hot-swap SCSI hard  
disk drives, 5¼-inch device, and an optical drive. The SCSI Backplane Board has slots on it that  
slide into hooks on the peripheral bay. A plunger and captive thumbscrew secure the SCSI  
Backplane Board and Front Panel I/O Board to the peripheral bay.  
3.5.1 Hot-Swap Hard Disk Drive Carrier  
The hot-swap hard disk drive carrier is an assembly that provides guides for installing hard disk  
drives. The carrier has an integrated light pipe to transfer the LED indicator from the SCSI  
Backplane Board to the front of the drive carrier and an insertion/extraction mechanism. The  
hard drive bezel can be customized to meet integrator-specific industrial design requirements,  
by changing the color and imprint.  
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Latch  
LED  
Figure 11. Hot-Swap Hard Drive Carrier  
3.5.2  
Optical Drive Carrier  
The optical drive is installed in a sheet metal bracket. The SATA-to-IDE Converter Board is  
plugged into the IDE connector at the back of the optical device. This assembly is then installed  
into the chassis.  
Figure 12. Optical Drive Carrier with SATA-to-IDE Converter Board  
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3.5.3  
Front Panel  
The Server Platform SR6850HW4 requires either a Button Control Panel, providing basic  
functionality, or an Intel® Server Platform Local Control Panel, which adds an LCD for integration  
with server management features. Both front panels contain switches and LED status indicators.  
The front panel is retained in the chassis by two clips and connects to the Front Panel I/O Board  
via a cable.  
In the upper left of the chassis front, there is also a video connector, NMI button, and three-port  
USB 2.0 connector.  
See Chapter 8 for more information on the front panel area.  
Figure 13. Front Panel with Button Control Panel  
Figure 14. Front Panel with Intel® Local Control Panel  
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3.6 Front Bezel  
The front bezel is an optional one-piece cosmetic accessory that is installed with snap-on  
features. The bezel can be customized to meet integrator-specific industrial design  
requirements, by changing the color and imprint. The bezel design allows adequate airflow to  
cool system components and has light pipes to allow front panel LEDs to be visible from the  
front of the server. Removing the bezel exposes peripherals, front panel switches and I/O  
connectors.  
Two black plastic pull handles cover the EIA mounting flanges and enable a user to slide the  
chassis in and out of a rack.  
Figure 15. Front Bezels (Rack and Pedestal)  
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Cables and Connectors  
4. Cables and Connectors  
This chapter describes cables and connectors specific to the Server Platform SR6850HW4.  
This chapter includes an overview diagram of the Server Platform SR6850HW4  
interconnections, and tables that describe the signals and pinouts for user accessible  
connectors. Chapters that follow will cover platform-specific board cables and connectors. See  
the Server Board Set SE8500HW4 Technical Product Specification for other connector signal  
descriptions and pinouts. This chapter is organized as follows:  
Section 4.1: Cable and System Interconnect Descriptions  
Provides a list of the connectors and cables in the system.  
Section 4.2: User-accessible I/O Connectors  
Describes the form-factor and pinout of user-accessible interconnects.  
The block diagram in Figure 16 provides an overview of the cables and their relation to System  
Boards in the platform.  
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Cables and Connectors  
Intel® Server Platform SR6850HW4 TPS  
Intel® Server Board SE8500HW4 Main Board  
CPU  
3
CPU  
2
CPU  
4
CPU  
1
Bd  
SE8500HW4 Memory Board  
DDR2 DIMM  
FSB 1  
FSB 0  
XMB  
DDR2 DIMM  
IMI D  
DDR2 DIMM  
IMI C  
IMI B  
IMI A  
E8500  
North Bridge  
(NB)  
DDR2 DIMM  
DDR2 RAID DIMM  
RAID Smart  
Battery  
RAID  
Act Key  
BRCM5704*  
Ethernet  
Controller  
Ethernet Port  
Ethernet Port  
IOP332  
Processor  
LSI*  
External SCSI  
Connector  
(optional)  
53C1030  
Ultra320*  
SCSI  
SCSI Channel B  
6700  
PXH  
Controller  
USB Port  
USB Port  
82801EB  
ICH5  
ATI*  
Radeon*  
7000  
Video Port  
Video  
Controller  
SIO  
COM1/EMP  
IMM  
FWH  
10/100  
GCM  
(optional)  
SCSI Cable  
(optional)  
Power and  
Signal  
SATA Cable  
SATA-to-IDE  
SCSI Cable  
Power  
Power  
Converter Board  
Dist Board  
SCSI  
Backplane Board  
Video Port  
USB Port  
USB Port  
USB Port  
Front  
Panel I/O  
Board  
Optical  
Drive  
Hot-swap SCSI Drives (10)  
Front Control Panel  
SCSI  
Tape  
Optional LCD  
Hot Swap Fans (6)  
Figure 16. Server Platform SR6850HW4 Interconnect Diagram  
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4.1 Cable and System Interconnect Descriptions  
Table 7 and Table 8 list cables and connectors used in the assembly of the Server Platform  
SR6850HW4.  
Table 7. Cable Descriptions  
Type  
Signal  
Qty  
1
From  
Mainboard  
To  
SCSI Backplane Board  
Board  
Cable Description  
100 Pin (multi-signal function)  
Signal  
SCSI  
1
2
SCSI Backplane Board Front Panel I/O Board  
Board  
30 Pin (multi-signal function)  
68 Pin internal SCSI  
Mainboard  
SCSI Backplane Board  
Board  
SCSI  
1
1
Mainboard  
Mainboard  
Rear panel  
68 Pin VHDCI SCSI (optional)  
7 Pin SATA  
SATA  
SATA-to-IDE converter  
board  
DC Power  
1
SCSI Backplane Board SATA-to-IDE Converter 4 Pin power (mini connector)  
Board  
Board  
SCSI tape device  
4 Pin power  
Signal  
Switch  
1
1
Front Panel I/O Board  
Mainboard  
Front panel  
50 Pin (multi-signal function)  
Chassis intrusion switch 3 Pin switch  
Table 8. Connector Descriptions  
System  
Type  
Qty  
From  
To  
Interconnect Description  
Component  
Mainboard  
Processors  
4
4
Mainboard  
Mainboard  
Processor  
604 Pin ZIF sockets  
PCI Express*  
Memory Board  
connector  
164 Pin Card Edge Connectors  
Memory  
PCI Express  
VRM  
1
1
1
2
3
4
1
1
1
1
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
Mainboard  
ROMB DIMM  
240 Pin Card Edge Connector  
Fibre Channel Module 164 Pin Card Edge Connector  
VRM9.1 module  
VRM10.2 module  
PCI-X adapters  
62 Pin Card Edge Connector  
54 Pin power connectors  
VRM  
PCI-X*  
PCI Express  
IMM  
188 Pin Card Edge Connectors  
PCI Express adapters 98 Pin Card Edge Connectors  
IMM  
120 Pin connector  
ICMB  
Internal interface  
Internal interface  
Top cover switch  
1 x 5 Header connector  
1 x 3 Header connector  
1 x 3 Header connector  
IPMB  
Chassis  
Intrusion  
USB  
1
Mainboard  
Rear panel  
1 x 4 Pin double stacked USB  
connector  
USB  
1
1
Mainboard  
Mainboard  
Internal interface  
1 x 4 Pin connector  
Video  
Rear panel, monitor  
15 Pin, monitor device  
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Cables and Connectors  
Intel® Server Platform SR6850HW4 TPS  
System  
Type  
Qty  
From  
To  
Interconnect Description  
Component  
COM1/EMP  
1
Mainboard  
Rear panel  
9 Pin Emergency Management  
Port (DB9)  
COM2  
1
1
Mainboard  
Mainboard  
Internal interface  
Rear panel  
2 x 5 Pin header  
Ethernet  
Double stacked RJ45 connector  
ports  
SCSI  
2
1
Mainboard  
Mainboard  
Internal SCSI  
channels  
68 Pin SCSI connectors  
Signal  
Ethernet  
SCSI Backplane  
Board Board  
100 Pin connector  
1
1
Mainboard  
Mainboard  
External interface  
RJ45 connector port, GCM  
2 x 10 Pin header  
DC power  
and signal  
RAID Smart Battery  
SATA signal  
DC power  
DC signal  
1
2
1
1
4
Mainboard  
SATA-to-IDE  
Converter Board  
1 x 7 Pin connector (standard  
SATA)  
Mainboard  
Power Distribution  
Board  
1 x 12 Pin connectors  
Mainboard  
Power Distribution  
Board  
2 x 15 Pin header  
Memory Board Memory  
Memory  
Memory Board  
Memory Board  
Mainboard  
164 Pin Card Edge Connector  
(x16 PCIe)  
DDR2 DIMMs  
240 Pin Card Edge Connector  
(4 per board)  
SCSI  
Backplane  
Board Board  
SCA2  
SCSI  
10  
2
SCSI Backplane Hot-swap hard disk  
Board Board drive  
80 Pin SCA2 connectors  
SCSI Backplane Mainboard  
Board Board  
68 pin SCSI connectors  
100 Pin connector  
2 x 14 Pin headers  
1 x 4 Pin header  
Signal  
1
SCSI Backplane Mainboard  
Board Board  
DC power  
and signal  
2
SCSI Backplane Fans  
Board Board  
DC power  
1
SCSI Backplane SATA-to-IDE  
Board Board  
Converter Board,  
Tape device  
Signal  
1
1
1
1
1
1
1
1
SCSI Backplane Front Panel I/O Board 34 Pin connector  
Board Board  
DC power  
Signal  
SCSI Backplane Power Distribution  
1 x 12 Pin connector  
Board Board  
Board  
Front Panel  
I/O Board  
Front Panel I/O  
Board  
SCSI Backplane  
Board Board  
30 Pin header  
Video  
Front Panel I/O  
Board  
Front panel, monitor  
15 Pin, monitor device  
USB  
Front Panel I/O  
Board  
Front panel  
1x4 Pin triple stacked USB  
connector  
Front panel  
Signal  
Front Panel I/O  
Board  
Button Control Panel  
or Local Control Panel  
50 Pin header  
SATA-to-IDE  
Converter  
Board  
SATA-to-IDE  
Optical device  
50 Pin JAE (IDE)  
Converter Board  
SATA  
SATA-to-IDE  
Converter Board  
Mainboard  
1 x 7 Pin connector (standard  
SATA)  
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Cables and Connectors  
System  
Type  
Qty  
From  
To  
Interconnect Description  
Component  
DC power  
1
SATA-to-IDE  
SCSI Backplane  
1 x 4 Pin header (mini connector)  
Converter Board Board Board  
Fan module  
DC power  
and signal  
6
1
Fan  
SCSI Backplane  
Board Board  
2 x 6 Pin header  
Button control Signal  
panel or Local  
control panel  
Button control  
panel or Local  
control panel  
Front Panel I/O Board 50 Pin header  
Power  
Distribution  
Board  
DC power  
and signal  
2
2
1
1
Power  
Distribution  
Board  
Power supply  
Mainboard  
Mainboard  
34-blade connector  
DC power  
Power  
Distribution  
Board  
1 x 12 Pin connector  
2 x 15 Pin header  
Signal  
Power  
Distribution  
Board  
DC power  
Power  
Distribution  
Board  
SCSI Backplane  
Board Board  
1 x 12 Pin connector  
Power Supply DC power  
and signal  
1
1
Power supply  
Power Distribution  
Board  
34-blade connector  
AC power  
Power supply  
External interface  
IEC filtered 15A receptacle  
4.2 User-accessible I/O Connectors  
4.2.1  
Video Connectors  
The Server Board Set SE8500HW4 Mainboard and Server Platform SR6850HW4 Front Panel  
I/O Board provide a video port interface with a standard VGA-compatible, 15-pin connector.  
Table 9. Video Connector Pinout  
Pin  
Signal Name and Description  
VID_R (analog color signal red)  
Video Connector  
1
5
1
2
VID_G (analog color signal green)  
10  
6
3
VID_B (analog color signal blue)  
4
No connection  
15  
11  
5
GND  
6
GND  
7
GND  
8
GND  
9
No connection  
10  
11  
12  
13  
14  
GND  
No connection  
MONID1 (to support DDCx, Display Data Channel* standard)  
VID_HSYNC (horizontal sync)  
VID_VSYNC (vertical sync)  
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Pin  
Intel® Server Platform SR6850HW4 TPS  
Video Connector  
Signal Name and Description  
15  
MONID2 (to support DDCx, Display Data Channel standard)  
4.2.2  
USB 2.0 Connectors  
The Server Board Set SE8500HW4 Mainboard provides a double-stacked USB port at the rear  
panel and one vertical USB port located in the middle of the Mainboard. The Server Platform  
SR6850HW4 Front Panel I/O Board provides three stacked USB port connectors via a USB hub  
controller. These built-in USB ports permit the direct connection of six USB peripherals without  
an external hub. If more devices are required, an external hub can be connected to any of the  
built-in ports.  
Table 10. Dual USB Connector Pinout  
Pin  
A1  
Signal  
USB Connectors  
Fused Voltage Controlled Current (VCC) (+5 V with over-  
current monitoring)  
1
2
A2  
A3  
A4  
B1  
B2  
B3  
B4  
USBPxM (differential data line)  
USBPxP (differential data line)  
GND (ground)  
Dual Stacked USB Connector on Rear Panel  
Fused VCC (+5 V with over-current monitoring)  
USBPxM (differential data line)  
USBPxP (differential data line)  
GND (ground)  
1
2
3
Triple Stacked USB Connector on Front Panel  
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4.2.3  
Etherent Connectors  
The Server Board Set SE8500HW4 Mainboard provides a dual-RJ45 connector for Ethernet  
connection.  
Table 11. TaDual Ethernet Stacked Connector  
Pin  
Signal  
Description  
LED Signals  
27  
28  
29  
30  
31  
32  
33  
34  
DNW_LINKB10_N  
DNW1_ACT_N_R  
DNW_LINKB100_N  
LANB1000_N_R  
DNW_LINKA10_N  
DNW0_ACT_N_R  
DNW_LINKA100_N  
LANA1000_N_R  
Lower (Port 1) green status LED cathode signal indicating Port 1 activity  
Lower (Port 1) green status LED anode to 100-ohm pullup to 3.3V Standby  
Lower (Port 1) green speed LED cathode, yellow LED anode  
Lower (Port 1) yellow speed LED cathode, green LED anode  
Upper (Port 2) green status LED cathode signal indicating Port 2 activity  
Upper (Port 2) green status LED anode to 100-ohm pullup to 3.3V Standby  
Upper (Port 2) green speed LED cathode, yellow LED anode  
Upper (Port 2) yellow speed LED cathode, green LED anode  
Ethernet Signals  
15  
21  
23  
16  
18  
24  
26  
19  
6
DNW_MDIB_DP<0>  
Port 1 transceiver 0 positive of differential pair  
Port 1 transceiver 0 negative of differential pair  
Port 1 transceiver 1 positive of differential pair  
Port 1 transceiver 1 negative of differential pair  
Port 1 transceiver 2 positive of differential pair  
Port 1 transceiver 2 negative of differential pair  
Port 1 transceiver 3 positive of differential pair  
Port 1 transceiver 3 negative of differential pair  
Port 2 transceiver 0 positive of differential pair  
Port 2 transceiver 0 negative of differential pair  
Port 2 transceiver 1 positive of differential pair  
Port 2 transceiver 1 negative of differential pair  
Port 2 transceiver 2 positive of differential pair  
Port 2 transceiver 2 negative of differential pair  
Port 2 transceiver 3 positive of differential pair  
Port 2 transceiver 3 negative of differential pair  
DNW_MDIB_DN<0>  
DNW_MDIB_DP<1>  
DNW_MDIB_DN<1>  
DNW_MDIB_DP<2>  
DNW_MDIB_DN<2>>  
DNW_MDIB_DP<3>  
DNW_MDIB_DN<3>  
DNW_MDIA_DP<0>  
DNW_MDIA_DN<0>  
DNW_MDIA_DP<1>  
DNW_MDIA_DN<1>  
DNW_MDIA_DP<2>  
DNW_MDIA_DN<2>  
DNW_MDIA_DP<3>  
DNW_MDIA_DN<3>  
13  
11  
5
3
10  
8
2
Power Signals  
4, 7, 9, 12, 14,  
17, 22, 25  
+1.8V Standby  
1, 20, 35, 36,  
37, 38  
Chassis  
Ground  
Ground  
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Figure 17. Dual Stacked Ethernet Connector  
The Mainboard also provides an RJ45 connector that connects to the IMM Advanced for out-of-  
band server management features. This out-of-band connector is also referred to as the  
Generic Communication Module (GCM), or server management Ethernet controller.  
Table 12. Server Management Ethernet Connector  
Pin  
Signal  
Description  
Server Management Ethernet  
Connector  
1
2
GCM_NIC_RDM  
GCM_NIC_RDP  
3
Magnetics Tap  
4
Magnetics Tap  
Magnetics Tap  
Magnetics Tap  
Green LED  
Yellow LED  
5
6
7
GCM_NIC_TDM  
8
GCM_NIC_TDP  
A1  
C1  
A2  
C2  
TP_GMC_RJ45_YEL_LED_A  
TP_GMC_RJ45_YEL_LED_C  
GMC_NIC_ACTLED_N  
GMC_NIC_ACTLED_R_N  
Yellow LED Anode  
Yellow LED Cathode  
Green LED Anode  
Green LED Cathode  
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4.2.4  
External 68-pin Ultra320 SCSI VHDCI Connector  
As an option, the Server Platform SR6850HW4 can support a shielded external SCSI  
connection. This SCSI port is controlled by the SCSI controller component located on the Server  
Board Set SE8500HW4 Mainboard. This interconnect is a VHDCI connector at the rear panel.  
Table 13. Ultra320 SCSI VHDCI Connector Pinout  
Pin  
Signal Name  
+DB(12)  
Ultra320 SCSI VHDCI Connector  
Pin  
35  
Signal Name  
-DB(12)  
1
2
3
4
5
6
7
8
9
+DB(13)  
+DB(14)  
+DB(15)  
+DB(P1)  
+DB(0)  
+DB(1)  
+DB(2)  
+DB(3)  
+DB(4)  
+DB(5)  
+DB(6)  
+DB(7)  
+P_CRCA  
GND  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
60  
61  
62  
63  
64  
65  
66  
67  
68  
-DB(13)  
-DB(14)  
-DB(15)  
-DB(P1)  
-DB(0)  
-DB(1)  
-DB(2)  
-DB(3)  
-DB(4)  
-DB(5)  
-DB(6)  
-DB(7)  
+P_CRCA  
GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
DIFFSENS  
TERMPWR  
TERMPWR  
NC  
GND  
TERMPWR  
TERMPWR  
NC  
GND  
GND  
+ATN  
-ATN  
GND  
GND  
+BSY  
-BSY  
+ACK  
-ACK  
+RST  
-RST  
+MSG  
-MSG  
+SEL  
-SEL  
+C/D  
-C/D  
+REQ  
-REQ  
+I/O  
-I/O  
+DB(8)  
+DB(9)  
+DB(10)  
+DB(11)  
-DB(8)  
-DB(9)  
-DB(10)  
-DB(11)  
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4.2.5 Internal 68-pin SCSI Connectors  
The Server Mainboard SE8500HW4 has two unshielded 68-pin SCSI connectors for SCSI  
channel A and B.  
SOCKET 1  
SOCKET 34  
SOCKET 68  
68 POSITION DEVICE CONNECTOR  
SOCKET 35  
Figure 18. 68-Pin SCSI Connector Non-Shielded  
Table 14. 68-Pin SCSI Connector Pinout  
Connector Pin  
Signal Name  
Connector Pin  
Signal Name  
1
2
3
4
5
6
7
8
9
SCSI(A:B)_DB_P12  
35  
SCSI(A:B)_DB_N12  
SCSI(A:B)_DB_P13  
SCSI(A:B)_DB_P14  
SCSI(A:B)_DB_P15  
SCSI(A:B)_DB_PP1  
SCSI(A:B)_DB_P0  
SCSI(A:B)_DB_P1  
SCSI(A:B)_DB_P2  
SCSI(A:B)_DB_P3  
SCSI(A:B)_DB_P4  
SCSI(A:B)_DB_P5  
SCSI(A:B)_DB_P6  
SCSI(A:B)_DB_P7  
SCSI(A:B)_DP0_P  
GND  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
56  
57  
58  
59  
SCSI(A:B)_DB_N13  
SCSI(A:B)_DB_N14  
SCSI(A:B)_DB_N15  
SCSI(A:B)_DB_NP1  
SCSI(A:B)_DB_N0  
SCSI(A:B)_DB_N1  
SCSI(A:B)_DB_N2  
SCSI(A:B)_DB_N3  
SCSI(A:B)_DB_N4  
SCSI(A:B)_DB_N5  
SCSI(A:B)_DB_N6  
SCSI(A:B)_DB_N7  
SCSI(A:B)_DP0_N  
GND  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
SCSI(A:B)_DIFFSENSE  
SCSI(A:B)_TERMPWR  
SCSI(A:B)_TERMPWR  
RESERVED (NC)  
GND  
GND  
SCSI(A:B)_TERMPWR  
SCSI(A:B)_TERMPWR  
RESERVED  
GND  
SCSI(A:B)_ATN_P  
GND  
SCSI(A:B)_ATN_N  
GND  
SCSI(A:B)_BSY_P  
SCSI(A:B)_ACK_P  
SCSI(A:B)_RST_P  
SCSI(A:B)_BSY_N  
SCSI(A:B)_ACK_N  
SCSI(A:B)_RST_N  
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Signal Name  
Connector Pin  
26  
Signal Name  
Connector Pin  
60  
SCSI(A:B)_MSG_P  
SCSI(A:B)_SEL_P  
SCSI(A:B)_CD_P  
SCSI(A:B)_REQ_P  
SCSI(A:B)_IO_P  
SCSI(A:B)_MSG_N  
27  
28  
29  
30  
31  
32  
33  
34  
61  
62  
63  
64  
65  
66  
67  
68  
SCSI(A:B)_SEL_N  
SCSI(A:B)_CD_N  
SCSI(A:B)_REQ_N  
SCSI(A:B)_IO_N  
SCSI(A:B)_DB_P8  
SCSI(A:B)_DB_P9  
SCSI(A:B)_DB_P10  
SCSI(A:B)_DB_P11  
SCSI(A:B)_DB_N8  
SCSI(A:B)_DB_N9  
SCSI(A:B)_DB_N10  
SCSI(A:B)_DB_N11  
4.2.6 80-pin SCA2 Hard Disk Drive Connectors  
The Server Platform SR6850HW4 SCSI Backplane Board has ten SCA2 connectors.  
80  
41  
40  
1
Figure 19. SCA2 80-Pin SCSI Connector  
Table 15. SCA2 Drive Connector Pinout  
Pin  
Signal Name  
+12V  
Pin  
21  
Signal Name  
LVD_DB7_N  
Pin  
41  
Signal Name  
GND  
Pin  
Signal Name  
LVD_DB7_P  
1
2
3
4
5
6
7
8
9
61  
62  
63  
64  
65  
66  
67  
68  
69  
70  
71  
72  
73  
74  
75  
+12V  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
LVD_DB6_N  
LVD_DB5_N  
LVD_DB4_N  
LVD_DB3_N  
LVD_DB2_N  
LVD_DB1_N  
LVD_DB0_N  
LVD_DBP1_N  
LVD_DB15_N  
LVD_DB14_N  
LVD_DB13_N  
LVD_DB12_N  
+5V  
42  
43  
44  
45  
46  
47  
48  
49  
50  
51  
52  
53  
54  
55  
GND  
LVD_DB6_P  
LVD_DB5_P  
LVD_DB4_P  
LVD_DB3_P  
LVD_DB2_P  
LVD_DB1_P  
LVD_DB0_P  
LVD_DBP1_P  
LVD_DB15_P  
LVD_DB14_P  
LVD_DB13_P  
LVD_DB12_P  
SCSI_MATED  
GND  
+12V  
GND  
+12V  
SCSI_MATED  
NC  
NC  
NC  
DIFFSENSE  
LVD_DB11_P  
LVD_DB10_P  
LVD_DB9_P  
LVD_DB8_P  
LVD_IO_P  
LVD_REQ_P  
LVD_CD_P  
LVD_SEL_P  
LVD_MSG_P  
LVD_DB11_N  
LVD_DB10_N  
LVD_DB9_N  
LVD_DB8_N  
LVD_IO_N  
LVD_REQ_N  
LVD_CD_N  
LVD_SEL_N  
LVD_MSG_N  
10  
11  
12  
13  
14  
15  
+5V  
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16  
17  
18  
19  
20  
LVD_RST_N  
LVD_ACK_N  
LVD_BSY_N  
LVD_ATN_N  
LVD_DBP_N  
36  
37  
38  
39  
40  
+5V  
56  
57  
58  
59  
60  
LVD_RST_P  
LVD_ACK_P  
LVD_BSY_P  
LVD_ATN_P  
LVD_DBP_P  
76  
77  
78  
79  
80  
GND  
NC  
SCSI_ACT  
NC  
GND  
SCSI_ID (0)  
SCSI_ID (2)  
SCSI_ID(1)  
SCSI_ID(3)  
4.2.7  
AC Power Input Connectors  
An IEC320 15A receptacle is located on each power supply. An appropriately sized power cord  
and AC main power source are required. See Chapter 5 for system voltage, frequency, and  
current draw specifications. An external AC cord retention feature is supported by the chassis  
but is not supplied by Intel. Please refer to the Server Platform SR6850HW4 Power Cord  
Enabling Specification to assist in the procurement of power cords for the platform.  
NEUTRAL  
LINE  
GND  
IEC 320 C19  
Figure 20. AC Power Input Connector  
4.2.8  
3-pin Chassis Intrusion Connector  
Please, see the table below for 3-pin Chassis Intrusion Connector information.  
Table 16. 3-pin Chassis Intrusion Connector  
Pin  
1
Signal  
Intrusion event  
2
3
GND  
Intrusion button attached  
4.2.9  
12-pin Power Distribution Board Power Connector  
The Server Platform SR4850HW4/SR6850HW4 Power Distribution Board has three power  
connectors, two for the Server Board Set SE8500HW4 Mainboard and one for the Server  
Platform SR6850HW4 SCSI Backplane Board.  
Table 17. Power Connector Pinout  
Pins  
Signal  
1-6  
GND  
42  
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7-12  
+12V  
4.2.10  
30-pin Power Distribution Board to Mainboard Connector  
See the table below for the 30-pin Power Distribution Board to Mainboard Connector  
information.  
Table 18. 30-pin Power Distribution Board to Mainboard Connector  
Pins  
1,17,25,30  
Signal Description  
GND  
6,7,10,12,14,15,24  
3.3Vstby  
2
PS1 present  
PS2 AC good  
PS Fan control  
PS1 AC good  
PS1 AC range  
PS on  
3
4
5
8
9
11  
13  
16  
18  
19  
20  
21  
22  
23  
26  
27  
28  
29  
I2C SCL  
I2C SDA  
12V Sense return  
PS 90% utilization  
PS 74% utilization  
PS 45% utilization  
PS 37% utilization  
Int alert  
PS2 AC range  
PS1 AC good  
12V Sense  
PS1 power OK  
PS2 present  
4.2.11  
30-pin SCSI Backplane Board Board to Front Panel I/O Board  
Connector  
Please, see the table below for the 30-pin SCSI Backplane Board to Front Panel I/O Board  
connector information.  
Table 19. Front Panel I/O Board Connector Signal Description  
Pins  
Signal Description  
1,7,10,26,28 Ground  
19,21,23,25  
5V  
2
3
USB Hub DPD1  
USB Hub DMD1  
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Pins  
Signal Description  
USB Hub DPD2  
5
6
USB Hub DMD2  
USB Hub DPD3  
USB Hub DMD3  
8
9
11  
12  
13  
14  
15  
16  
17  
18  
20  
22  
24  
27  
29  
30  
USB1 overcurrent output, active high  
USB2 overcurrent  
USB3 overcurrent  
NMI button, active low  
Video DCC out SCLCK  
Video DCC out SDA  
Video vertical sync  
Video horizontal sync  
Video red  
Video green  
Video blue  
Speaker drive, active high  
Monitor presence, active low  
Unused, keying pin  
4.2.12  
100-pin Mainboard to SCSI Backplane Board Board Connector  
Please, see the tables below for the 100-pin Mainboard to SCSI Backplane Board connector  
information.  
Table 20. 100-pin Connector Pinout (Unused and Ground)  
Pin Numbers  
Signal  
Descriptions  
1,3,7,10,14,20,27,42,51,52,54,58,62,65,73,77,79,82,83,85,87,89,91,93,95,100  
Ground  
Unused  
4,6,8,12,13,15,17,19,22,24,26,29,31,33,35,37,41,44,46,48,50,53,56,59,61,66,68,70,72  
Table 21. 100-pin Connector Pinout (Signals)  
Pin Number  
2
Signal Name  
GND – RESISTOR  
Signal Description  
Ground through zero ohm resistor  
5
GND – RESISTOR  
GND – RESISTOR  
GND – RESISTOR  
FAN1_TACH  
Ground through zero ohm resistor  
Ground through zero ohm resistor  
Ground through zero ohm resistor  
9
11  
16  
18  
21  
23  
25  
28  
Fan 1 Tachometer signal – edges per revolution  
Fan 2 Tachometer signal – edges per revolution  
Fan 3 Tachometer signal – edges per revolution  
Fan 4 Tachometer signal – edges per revolution  
Front panel reset button signal  
FAN2_TACH  
FAN3_TACH  
FAN4_TACH  
RESET_BTN  
FAN5_TACH  
Fan 5 Tachometer signal – edges per revolution  
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Pin Number  
30  
Signal Name  
FAN6_TACH  
Signal Description  
Fan 6 Tachometer signal – edges per revolution  
Zone 1 Fan PWM control signal  
5V standby to front panel  
Backplane D2D enable  
32  
34  
36  
38  
39  
40  
43  
45  
47  
49  
55  
57  
60  
63  
64  
67  
69  
71  
74  
75  
FAN_PWM1  
5VSTANDBY  
BP_D2D_EN  
5VSTANDBY  
5Vstandby to front panel  
ICH5_PDD8  
IDE primary disk data 8  
HD_ACT_N  
SATA Hard Drive Activity  
Backplane power good signal  
PCI reset to backplane  
BP_PWRGOOD  
PCI_RST_BP_N  
CP_PWR_LED  
CP_SPKR_OUT_N  
NIC1_LED  
Control Panel Power LED signal  
Speaker signal to front panel  
NIC 1 activity LED signal  
ID LED Signal  
ID_LED  
CP_BTN_PWR_ON  
SYS_STATUS_AMB_LED  
CD_PRES_N  
Control panel Power Button signal  
System Status amber LED signal  
CD drive presence signal  
Control panel ID button signal  
Control panel NMI button  
NIC2 activity LED signal  
CP_ID_BUTTON_RAW  
CP_BTN_NMI  
NIC2_LED  
I2C_IPMB_SCL  
BP_PRES_N  
IPMB I2C bus clock  
SCSI Backplane Board Board presence signal, indicates System  
Board interlock is achieved  
76  
78  
80  
81  
84  
86  
88  
90  
92  
94  
96  
97  
98  
99  
I2C_IPMB_SDA  
IPMB I2C bus data  
SYS_PWRGD4  
Mainboard power good signal to SCSI Backplane Board Board  
USB port 2 differential negative signal to front bezel  
USB port 2 differential positive signal to front bezel  
Video DAC 2 RED signal  
USB_FRONT_N  
USB_FRONT_P  
VID_RED_FRONT  
VID_BLUE_FRONT  
VID_GREEN_FRONT  
VID_HS_OUT_FRONT  
VID_VS_OUT_FRONT  
VID_DDC_OUT_SCLK_FRONT  
VID_DDC_OUT_SDA_FRONT  
I2C_CP_SDA  
Video DAC 2 BLUE signal  
Video DAC 2 GREEN signal  
Video DAC 2 Horizontal Synchronization signal  
Video DAC 2 Vertical synchronization signal  
Video Monitor detection I2C bus clock  
Video monitor detection I2C bus data  
Control panel I2C bus data (I2C segment 2)  
System status green LED signal  
SYS_STATUS_GRN_LED  
I2C_CP_SCL  
Control panel I2C bus data (I2C segment 2)  
4.2.13  
Peripheral Power Connector  
The Server Platform SR6850HW4 SCSI Backplane Board provides a standard power connector  
to drive both the SCSI tape device and optical drive.  
Table 22. Peripheral Power Connector  
Pins  
Signal  
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1
12V  
GND  
5V  
2,3  
4
4.2.14  
Fan Connectors  
Two fan power connectors on the Server Platform SR6850HW4 SCSI Backplane Board control  
and supply the power for the six system fans.  
Table 23. 12-pin Fan Power and Control  
Pins  
Signal  
7, 10  
12V  
1, 4, 9, 12  
GND  
8, 11  
FAN_PWM  
2
3
5
6
FAN1_TACH  
FAN1_AMB  
FAN2_TACH  
FAN2_AMB  
Table 24. 24-pin Fan Power and Control J6E1  
Pins  
Signal  
13, 16, 19, 22  
12V  
1, 4, 7, 10, 15, 18, 21 ,24  
GND  
14, 17, 20, 23  
FAN_PWM  
FAN3_TACH  
FAN3_AMB  
FAN4_TACH  
FAN4_AMB  
FAN5_TACH  
FAN5_AMB  
FAN6_TACH  
FAN6_AMB  
2
3
5
6
8
9
11  
12  
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4.2.15  
50-pin Front Panel Control Module Connector  
This connector is used between the Server Platform SR6850HW4 Front Panel I/O Board and  
standard button control panel or Local Control Panel.  
Table 25. Front Panel Control Module Connector Signal Description  
PIN  
Signal Description  
PIN  
26  
Signal Description  
1
2
3
4
5
6
7
8
9
+5V Standby  
+5V Standby  
+5V  
not used  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
37  
38  
39  
40  
41  
42  
43  
44  
45  
46  
47  
48  
49  
50  
LAN1 link  
LAN1 activity  
GND  
Hard drive activity,  
System status  
not used  
Front panel NMI button, not used  
not used  
not used  
not used  
not used  
not used  
not used  
not used  
not used  
not used  
not used  
GND  
System status  
+5V Standby  
+5V Standby  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
Power LED  
Hard drive activity pull up  
I2C IPMB SDA  
GND  
I2C IPMB SCL  
System ID LED  
Power button input, active low  
LAN2 link  
not used  
GND  
Hard drive fault  
LAN2 activity  
not used  
GND  
Front panel reset button, active low  
not used  
not used  
GND  
GND  
not used  
not used  
GND  
Front panel ID button, active low  
not used  
not used  
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4.2.16  
SATA-to-IDE Converter Board Connector  
The Server Platform SR4850HW4/SR6850HW4 SATA-to-IDE Converter Board connects to an  
optical drive with this connector.  
Table 26. SATA-to-IDE Converter Board Connector  
Pin  
Signal  
Audio L-Ch  
Audio GND  
RESET-  
DD7  
Signal  
Audio R-Ch  
GND  
Pin  
1
2
4
6
8
3
5
DD8  
7
DD9  
9
DD6  
DD10  
10  
12  
14  
16  
18  
20  
22  
24  
26  
28  
30  
32  
34  
36  
38  
40  
42  
44  
46  
48  
50  
11  
13  
15  
17  
19  
21  
23  
25  
27  
29  
31  
33  
35  
37  
39  
41  
43  
45  
47  
49  
DD5  
DD11  
DD4  
DD12  
DD3  
DD13  
DD2  
DD14  
DD1  
DD15  
DD0  
DMARQ  
/DIOR  
GND  
GND  
DIOW-  
IORDY  
INTRQ  
DA1  
/DMACK  
/IOCS16  
/PDIAG  
DA2  
DA0  
/CS1FX  
/DASP  
+5V  
/CS3FX  
+5V  
+5V  
+5V  
+5V  
GND  
GND  
GND  
GND  
CSEL  
RESERVED  
GND  
RESERVED  
4.2.17  
SATA-to-IDE Converter Board Power Connector  
Please, see the table below for the SATA-to-IDE Converter Board Power Connector information.  
Table 27. SATA-To-IDE Converter Board Power Connector  
Pin  
Signal  
1
2
3
4
+5 VDC  
Ground  
Ground  
+12V (Not used on adapter)  
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4.2.18 SATA Connector  
The Server Board Set SE8500HW4 Mainboard has a SATA connector that is routed via a cable  
to the Server Platform SR4850HW4/SR6850HW4 SATA-to-IDE Converter Board.  
Table 28. SATA Signal Connector  
Pin  
Signal  
1
2
3
4
5
6
7
Ground  
A+  
A-  
Ground  
B-  
B+  
Ground  
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5. Power Supply  
This chapter describes the Server Platform SR6850HW4 power supply. The Server Platform  
SR6850HW4 power supply is current sharing with auto ranging input. The Server Platform  
SR6850HW4 power supply is approximately 7.7 inches wide, 14.5 inches deep and 3.5 inches  
high. The unit mounts into the server with a latch.  
The output rating of the power supply is 1570W when operated between 170VAC and 264VAC.  
The platform can run with a single power supply installed. For redundancy, two power supplies  
must be installed.  
The Server Platform SR6850HW4 power supply is shown in Figure 21.  
Figure 21. 1570W Power Supply  
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5.1 Mechanical Outline  
The mechanical outline and dimensions are shown on the next page. The dimensions should be  
used only as a reference.  
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Figure 22. Power Supply Mechanical Specification  
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5.2 Power Supply Output Interface  
5.2.1  
Blade Connector  
The power supply output power and control signals interface to the system Power Distribution  
Board through an FCI PowerBlade* right-angle connector.  
Table 29. PowerBlade Pin Assignment  
P1  
Pin  
PB RH1  
Signal Name  
+12V return  
Amps per pin  
26  
FCI Powerblade* 51721-  
10002410AA or approved  
equivalent  
PB RH2  
PB RH3  
PB RH4  
PB RH5  
PB RH6  
PB RH7  
PB RH8  
PB RH9  
PB RH10  
A1  
+12V return  
+12V return  
+12V return  
+12V return  
+12V  
26  
26  
26  
26  
26  
26  
26  
26  
26  
Mates to FCI 51741-  
10002410CC on Power  
Distribution Board  
+12V  
+12V  
+12V  
+12V  
PS_KILL  
+12V current share  
Return  
A2  
A3  
A4  
+3.3Vstby  
PS A0  
A5  
A6  
+3.3Vstby  
Return  
B1  
B2  
Not used  
Return  
B3  
B4  
+3.3Vstby  
SDA  
B5  
B6  
-PS_ON  
Return  
C1  
C2  
Not used  
Return  
C3  
C4  
+3.3Vstby  
SCL  
C5  
C6  
VIN_GOOD  
-PS_Present  
+12V_Sense  
+12V_Rtn_Sense  
+3.3Vstby  
S_INT(Alert)  
POK  
D1  
D2  
D3  
D4  
D5  
D6  
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5.3 AC Input Requirement  
5.3.1  
AC Input Voltage Specification  
The power supply operates over the range and limits shown in Table 30.  
Table 30. AC Input Rating  
Parameter  
Minimum Nominal Maximum  
Unit  
Vin (voltage)  
85  
100/240  
264  
VACrms  
Vin (frequency)  
Iin (90VAC)  
47  
50/60  
63  
Hz  
16.7  
15.0  
16.0  
11.25  
85  
Arms  
Iin (100VAC)  
Iin (115VAC)  
Iin (180VAC)  
Vin (turn-on)  
Vin (turn-off)  
Arms  
Arms  
Arms  
80  
75  
VACrms  
VACrms  
80  
The main outputs of the power supply will turn off per Vin (turn-off). Any standby outputs may  
continue to operate at input AC voltages below Vin (turn-off).  
5.3.2  
Efficiency  
The power supply has a minimum efficiency of 78% when operated under the maximum loading  
conditions of 90VAC-264VAC, and environmental conditions. The minimum efficiency is 77%  
when operated between 85-90VAC.  
For loads less than maximum, the internal power dissipation cannot exceed 453W.  
5.3.3  
Input Over-Current Protection  
The power supply has internal primary over-current protection. A normal-blow (fast blow), high-  
breaking-capacity fuse is placed in the input circuit.  
5.3.4  
Inrush Current  
When input power is applied to the power supply, any initial current surge or spike of 10ms or  
less will not exceed 55A peak. Any additional inrush current surges or spikes in the form of AC  
cycles or multiple AC cycles greater than 10ms, and less than 150ms, will not exceed 25A peak.  
For any conditions during turn-on, the inrush current will not open the primary input fuse or  
damage any other components.  
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5.3.5  
Auto Restart  
Although the power supply may power off under the conditions mentioned in Sections 5.3.3 and  
5.3.4 it is capable of restarting, either automatically or under program control after the  
disturbance. In addition, the power supply will not be in a latched state such that any of the  
operator buttons/buttons do not operate correctly after the disturbance. At no time will the AC  
power cord have to be removed to clear an error condition.  
Auto restart conditions are tested from -40% to -100% AC under-voltage conditions for time  
intervals ranging from 25ms to 2sec. For each time interval, all of the under-voltage conditions  
listed below will be tested. These tests are performed at both the lowest and highest nominal  
operating voltages of the power supply.  
Time intervals: 25ms, 40ms, 60ms, 90ms, 130ms, 200ms, 280ms, 400ms, 600ms, 900ms,  
1.3sec, and 2.0sec  
Under-voltage deviation from nominal AC voltage: -40%, -50%, -60%, -70%, -80%, -90%, -  
100%  
5.3.6  
Power Factor Correction (PFC)  
The Power Factor Correction (PFC) is 0.97, or greater, for all specified AC input voltages with  
output loads greater than 90%.  
The PFC is 0.75, or greater, for all specified AC input voltages with output loads greater than  
50%.  
5.3.7  
AC Input Connector  
The AC input receptacle is an IEC-320 16A rated for 250VAC minimum.  
5.4 DC Output Requirements  
The DC output voltages will remain within the regulation ranges shown in the Table 31 when  
measured at the load end of the connector.  
Table 31. DC Output Voltage Regulation Limits  
Output Level  
+12V  
+3.3Vstby  
Minimum (V) Nominal (V) Maximum (V)  
11.64  
12.00  
12.60  
3.17  
3.30  
3.47  
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5.4.1  
Hot Swap Functionality  
Hot swapping is the process of inserting and extracting a power supply from an operating power  
bay. During this process, the output voltages will remain within the limits specified in Table 31,  
and the system will continue to operate normally.  
5.4.2  
Output Current Rating  
The combined continuous output power for all outputs will not exceed 1570W. Each output has  
a maximum and minimum current rating shown in Table 32.  
Table 32. 1570W Load Ratings  
Output Level  
+12V3  
+12V4  
+12V5  
Minimum (A)1  
Maximum (A)1  
91.66  
Peak (A)1  
1.0  
1.0  
1.0  
0.0  
95.672  
112.5  
130.8  
5.0  
117.002  
135.552  
+3.3Vstby  
1. Values are at the system level. For 1+1 redundant systems the load each supply provides is based on its  
current-sharing accuracy.  
2. Peak +12V output power not to exceed 15 seconds in duration. Maximum duty cycle is 5%.  
3. For 85-121VAC operation (100/110VAC rated).  
4. For 103.5-139VAC operation (115/120/127VAC rated).  
5. For 170VAC, and higher, operation (200/208/220/230/240VAC rated).  
5.4.3  
Over- and Under-Voltage Protection  
The power supply provides latch mode over and under voltage protection as defined in the  
following table. A fault on any output will cause the rest of the outputs to latch off. See note 3  
below the table.  
Table 33. Over- and Under-voltage Limits  
Output Level  
Under-Voltage  
Minimum (V) Maximum (V)  
Over Voltage  
Minimum (V) Maximum (V)  
+12V  
10.5  
2.77  
11.0  
3.00  
13.5  
3.76  
15.0  
4.3  
1,2,3  
+3.3Vstby  
1. In standby mode, the power supply does not latch off due to an under-voltage condition.  
2. In standby mode, the power supply may or may not latch off due to an over-voltage condition.  
3. A fault on any output other than +3.3Vstby will not cause the +3.3Vstby to turn off. A fault on +3.3V Standby  
causes the other outputs to turn off.  
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5.4.4  
Over-current Protection  
Over-current is a fault condition defined as a 10A/s current ramp starting from full load applied  
to the output under test. A fault on any output causes the rest of the outputs to latch off. See  
note 3 below the following table.  
Table 34. Over-current Protection Limits  
Output Level  
Minimum (A)2,4  
5.3  
Maximum (A)2,4  
6.2  
+3.3V Standby 1,3,5  
+12V6  
+12V7  
122  
142  
141  
163  
1. Output is Level III SELV and non-energy hazard complaint  
2. The above current limits will be satisfied throughout the entire operating temperature range  
3. A fault on any output other than +3.3Vstby will not cause the +3.3Vstby to turn off. A fault on +3.3Vstby will  
cause the other outputs to turn off.  
4. Dynamic loading must not cause a false over current when 2 supplies are in parallel.  
5. The +3.3Vstby output will not latch off. It must return to normal operation once the fault is removed. Current  
foldback method is preferred.  
6. +12V OC limits change base on the state of AC_RANGE. This helps protect the power supply from over-  
loading the PFC stage. AC_RANGE low.  
7. +12V OC limits change base on the state of AC_RANGE. This helps protect the power supply from over-  
loading the PFC stage. AC_RANGE high.  
5.4.5  
Short Circuit Protection  
A short circuit, which is defined as an impedance of 0.1Ω, or less, applied to any output during  
start-up or while running will not cause any damage to the power supply (connectors,  
components, PCB traces, etc.).  
When the +3.3Vstby is shorted the output may go into "hiccup mode". When the +3.3Vstby  
attempts to restart the maximum peak current from the output must be less than 8.0A. The  
maximum average current, taking into account the “hiccup" duty cycle, must be less than 4.0A.  
5.4.6  
Reset After Shutdown  
If the power supply latches into a shutdown state due to a fault condition on any output, the  
power supply will return to normal operation only after the fault has been removed and the  
power supply has been power-cycled. Power cycling is defined as either:  
ƒ
ƒ
Removing AC input power, waiting for +3.3Vstby to drop below 1.0V, then reapplying AC  
power. The time it takes for +3.3Vstby to drop below 1.0V shall not exceed 15 seconds.  
Cycling the state of PS_ON from on to off to on. The minimum cycle time is 1ms.  
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5.4.7  
Current Sharing  
Outputs of two supplies that are connected in parallel must meet the regulation requirements of  
a single supply. Under normal operation with two supplies running in parallel, the outputs must  
share the load current. If one of the supplies fails, the remaining supply must pick up the entire  
load without any of the outputs dropping out of regulation. A defective supply that is connected  
to the output voltage bus has no adverse effect on the operation of the remaining functional  
supply.  
Table 35. Output Current Sharing  
Output Level  
+3.3Vstby  
Output Sharing  
Not required  
Active  
+12V  
5.4.8  
I2C Devices  
All I2C devices are powered from the cathode side of the +3.3Vstby OR’ing diode. This allows the  
status and FRU data to be read from a power supply that is not powered on or has some other  
fault. Protection is provided so if a power supply fault occurs it does not take down the +3.3Vstby  
bus.  
Address locations will be determined by external settings through P1, pin A5. The 0xA1 and  
0xA2 address will be wired high on the power supply. (NE1617A does not have an 0xA2  
address). The alert signal from (only) the I/O port will be through P1, pin D5.  
5.4.8.1  
FRU Data  
The power supply contains a serial EEPROM. The address is either 0xAC or 0xAE, depending  
on address bit 0xA0.  
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5.4.8.2  
Intel® Server Platform SR6850HW4 TPS  
I/O Port Expander  
The power supply contains a serial I/O port expander, Philips* PCF8575 or approved  
equivalent. The address is either 0x4C or 0x4E, depending on address bit 0xA0.  
Table 36. I/O Port Expander Signals  
Signal Name  
-OC +12V  
I/O Port  
P0  
P1  
P2  
P3  
P4  
P5  
P6  
P7  
-Fan_Fault  
-UV  
-OV  
VIN_GOOD  
P_GOOD  
-PS_STATUS  
AC_PRFAIL  
-PFC_OTP  
POWER_LEVEL_1  
POWER_LEVEL_1  
POWER_LEVEL_1  
POWER_LEVEL_1  
High  
P10  
P11  
P12  
P13  
P14  
P15,P16,P17  
Table 37. I/O Port Expander Codes  
Signal Name  
-OC +12V  
Normal Off Normal On  
+12V OC  
0
AC Dropout  
1
Low AC  
1
No AC  
1
1
1
1
1
1
1
1
0
1
Not Used  
-UV  
1
1
1
1
0
1
1
1
1
1
1
1
0
0
1
1
1
1
1
0
0
1
1
1 or 0  
1
-OV  
1
1
0
1
1
1
VIN_GOOD  
P_GOOD  
-PS_STATUS  
-AC_PRFAIL  
1 or 0  
0
1
0
Note: The No AC column refers to the status of the I/O port when only the external +3.3stby bus voltage is  
available.  
5.4.8.3  
Temperature Sensors  
A Philips* NE1617A or equivalent temperature sensor is located near the air inlet of the supply.  
The address is either 0x34 or 0x9C depending on address bit 0xA0. A second sensor is near  
the exhaust outlet.  
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5.4.9 Fan Speed Control  
The power supply provides forced air-cooling through three DC fans that have intake through  
the circular grill. The cooling fans are 60mm in diameter and 38mm in depth. The fans are  
mounted to the front (output connector), and exhaust through the rear (AC Inlet connector) of  
the PS case.  
The power supply uses a fan speed controller that is based on the input Fan_Cntl. The input is  
an analog signal from 0.0V to 3.0V. Control of the fan is linear in relation to the Fan_Cntl signal.  
Table 38. Power Supply Fan Voltage  
Fan_Cntl Voltage Minimum Fan Voltage Maximum Fan Voltage  
0.00V  
1.50V  
3.00V  
7.00V  
9.55V  
11.50V  
7.50V  
10.05V  
12.60V  
A fan fault is defined as a fan RPM below 1,000 ±200 RPM during normal operation. This fault is  
inhibited for 15 ±5 seconds when the power supply outputs are first powered on. This allows  
time for the fan to come up to speed and the fan detects circuitry to stabilize.  
A fault on two fans turns off the power supply. See Section 5.2.  
Note: Fan speed control must operate even if no AC is applied to the power supply. Fan power  
comes from the 12V bus after the OR’ing diode. The control circuit power comes from either the  
12V bus and/or the 3.3Vstby bus.  
5.4.10  
Power Supply Module LED indicators  
There are three LEDs on the rear of the power supply, next to the AC input power connector.  
5.4.10.1 Power Supply Fail  
The amber power supply fail LED is driven by internal circuitry. It lights when a power rail has  
failed. The LED is not lit if the supply turns off due to PS_KILL. The LED illuminates even if the  
power supply is in a latched state. The only time during a fault when it does not illuminate is if  
the +3.3Vstby is lost.  
5.4.10.2  
Power Good  
The green power good LED is driven by internal circuitry. It lights whenever PWRGD is  
asserted.  
5.4.10.3  
AC OK  
The green AC OK LED is driven by internal circuitry. It lights whenever VIN_GOOD is asserted.  
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Power Distribution Board  
6. Power Distribution Board  
This chapter describes the Server Platform SR4850HW4/SR6850HW4 Power Distribution Board  
and is organized as follows:  
Section 6.1: Introduction  
An overview of the Server Platform SR4850HW4/SR6850HW4 Power  
Distribution Board and board layout.  
Section 0:  
Signal Descriptions and Pinouts  
Summarizes the Server Platform SR4850HW4/SR6850HW4 Power  
Distribution Board internal signals and connector signals, and the  
connector signal pin names and the signal descriptions.  
6.1 Introduction  
The Server Platform SR4850HW4/SR6850HW4 Power Distribution Board provides docking  
connectors for the hot-swap power supply modules. It distributes power to the Server Platform  
SR4850HW4 SCSI Backplane Board and Server Board Set SE8500HW4 Mainboard as well as  
power consumption information to the Server Board Set SE8500HW4 Mainboard via a group of  
comparators. The board contains EEPROM FRU information storage but has no logic on it; it is  
a pass-through board. The signals shared between the two power supplies are shown in the  
diagram below.  
INT_ALERT  
12V_SENSE  
12V_SENSE_RTN  
PS_ON_N  
PS2  
CURRENT_SHARE  
PS1  
PDB_FRU_SDA  
PDB_FRU_SCL  
Figure 23. Power Supply Signal Sharing  
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PS2  
PS1  
+12V GND  
Adobe Systems  
+12V  
GND  
Figure 24. Power Distribution Board Layout  
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6.2 Signal Descriptions and Pinouts  
+12V  
+12V  
+12V  
+12V  
+12V  
+12V  
P10_1  
P10_2  
P10_3  
P10_4  
P10_5  
P10_6  
P10_7  
P10_8  
+12V  
+12V  
+12V  
+12V  
P9_1  
P9_2  
P9_3  
P9_4  
P9_5  
P9_6  
P9_7  
P9_8  
P8_1  
P8_2  
P8_3  
P8_4  
P8_5  
P8_6  
P8_7  
P8_8  
P7_1  
P7_2  
P7_3  
P7_5  
P7_6  
P7_7  
P7_4  
P7_8  
P6_1  
P6_2  
P6_3  
P6_5  
P6_6  
P6_7  
P6_4  
P6_8  
P5_1  
P5_2  
P5_3  
P5_5  
P5_6  
P5_7  
P5_4  
P5_8  
P4_1  
P4_2  
P4_3  
P4_5  
P4_6  
P4_7  
P4_4  
P4_8  
P3_1  
P3_2  
P3_5  
P3_6  
P3_3  
P3_4  
P3_7  
P3_8  
P2_1  
P2_2  
P2_5  
P2_6  
P2_3  
P2_4  
P2_7  
P2_8  
+3.3V_AUX  
P1_1  
P1_2  
P1_3  
P1_4  
P1_5  
P1_6  
P1_7  
P1_8  
+3.3V_AUX  
A1  
A2  
C1  
C2  
A3  
A4  
A5  
C3  
C4  
C5  
A6  
C6  
B1  
B2  
B3  
D1  
D2  
D3  
B4  
B5  
B6  
D4  
D5  
D6  
FCI 51761-10002410AA  
Figure 25. Power Distribution Board to Power Supply Module Docking Connector Signals  
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+3.3V_AUX  
+3.3V_AUX  
Adobe Systems  
LATCH DIP PLUG  
Figure 26. Mainboard Connector Signals  
6.2.1  
Remote On/Off (-PS_ON)  
The power supply DC outputs are enabled when this signal is pulled low, below 0.8V. In the low  
state the input will not source more than 1mA of current. The DC outputs are disabled when the  
input is driven higher than 2.4V, or open circuited.  
Provisions for de-bouncing are included in the –PS_ON circuitry. This prevents the power  
supply from oscillating on and off at startup.  
6.2.2  
Power Good Signal (POK or P_GOOD)  
A power good signal is asserted or driven high by the power supply to indicate that all outputs  
are valid. If any of the outputs fails, this output is driven low.  
If AC main power is lost, or if a fan has failed, this signal must be driven low at least 1ms before  
any of the outputs go out of regulation.  
The output is an open collector/drain. It is capable of driving the output below 0.4V with a load  
of 4mA. The output has an internal pull-up resistor of 1KΩ between the output and +3.3Vstby  
.
The pull-up is connected to the anode side of the +3.3Vstby OR’ing diode.  
This output also goes to I2C port P5.  
6.2.3  
VIN_GOOD  
This signal is asserted, driven high, by the power supply to indicate that the input voltage meets  
the minimum requirements of the input voltage range. Within 12ms after falling outside the input  
voltage requirements, the output must be driven low.  
The output is an open collector/drain. It is capable of driving the output below 0.4V with a load  
of 4mA. The output has an internal pull-up resistor of 1KΩ between the output and +3.3Vstby  
.
The pull-up is connected to the anode side of the +3.3Vstby OR’ing diode.  
This output also goes to I2C port P4.  
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7. SCSI Backplane Board  
This chapter describes the Server Platform SR6850HW4 SCSI Backplane Board and is  
organized as follows:  
Section 1:  
Section 2:  
Section 3:  
Introduction  
Provides an overview of the Server Platform SR6850HW4 SCSI  
Backplane Board, showing functional blocks and the board layout.  
Functional Architecture  
Describes the Server Platform SR6850HW4 SCSI Backplane Board  
functional blocks.  
Signal Descriptions  
Summary of the Server Platform SR6850HW4 SCSI Backplane Board  
internal signals and connector signals, and the connector signal pin  
names and the signal descriptions.  
Section 4:  
Electrical, Environmental, and Mechanical Specifications  
Specifies operational parameters and considerations, and connector  
pinouts.  
7.1 Introduction  
The Server Platform SR6850HW4 SCSI Backplane Board supports up to ten hot-swap Ultra320  
SCSI hard disk drives mounted into the chassis. The board provides drive status information  
and allows adding, removing and replacing hard disk drives without powering down the system.  
The following block diagram, architectural overview, and placement diagram provide an  
overview of the Server Platform SR6850HW4 SCSI Backplane Board.  
7.1.1  
Block Diagram  
The block diagram divides SCSI Backplane Board into physical and functional blocks. Arrows  
represent buses and signals. Blocks represent the physical and functional blocks.  
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Figure 27. Server Platform SR6850HW4 SCSI Backplane Board Board Block Diagram  
7.1.2 Architectural Overview  
The SCSI Backplane Board provides the following functions for the platform.  
ƒ
Ultra320 SCSI bus passes SCSI signals between the hot-swap hard disk drives and the  
Server Board Set SE8500HW4 Mainboard  
-
Two standard 68-pin SCSI connector provides connection to the Server Board Set  
SE8500HW4 Mainboard  
-
Ten 80-pin SCA-2 blind-mate connectors connect to SCSI hard disk drives  
ƒ
ƒ
Fault tolerant enclosure management  
-
-
-
SAF-TE  
SCSI power control  
LED control logic  
Server management  
-
-
-
I2C interface  
I2C Serial CMOS EEPROM (FRU)  
Temperature sensors (primary ambient for system)  
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ƒ
Voltage regulators  
-
-
-
12VDC to 5VDC  
5VDC to 3.3VDC  
5VDC to 1.8VDC  
ƒ
ƒ
ƒ
ƒ
System fan control  
USB 2.0 Hub  
Driver circuit for the Server Platform SR6850HW4 Front Panel I/O Board speaker  
Buffering for the buttons on the Button Control Panel  
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7.1.3  
Mechanical Specifcations  
The board outline dimensions are 16.5inches x 6.380inches. The board thickness is  
0.093inches +.008/-.005inches. All dimensions are in inches.  
Figure 28. SCSI Backplane Board Board Component Placement (Primary Side)  
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7.1.4 Component Location  
Figure 29 and shows the placement of the major components and connectors on the SCSI  
Backplane Board.  
FRONT PANEL  
BOARD  
CONNECTOR  
FRONT PANEL  
I/O BOARD  
CONNECTOR  
OPTICAL  
DRIVE POWER  
CONNECTOR  
100-PIN MAIN  
BOARD  
CONNECTOR  
SCSI BUS A DRIVE CONNECTORS  
A0  
A1  
A2  
A3  
A4  
FANS 3 - 6  
CONNECTOR  
SCSI BUS A  
CONNECTOR  
FANS 1 - 2  
CONNECTOR  
SCSI BUS B  
CONNECTOR  
B10  
B11  
B12  
B13  
B14  
SCSI BUS B DRIVE CONNECTORS  
Figure 29. SCSI Backplane Board Board Component Placement (Primary Side)  
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USB HUB  
1.8V REGULATOR  
TEMP SENSE 1  
FRU  
POWER DISTRIBUTION  
BOARD CONNECTOR  
TAPE BAY POWER  
CONNECTOR  
SCSI BUS A SAF-TE  
CONTROLLER  
SCSI BUS A  
TERMINATORS (2)  
TEMP SENSE 1  
5V D2D  
CONTROLLER  
3.3V REGULATOR  
PLD  
SCSI BUS A SAF-TE  
CONTROLLER  
FLASH MEMORY  
10 MHZ  
OSCILLATOR  
SCSI BUS B  
TERMINATORS (2)  
SCSI BUS B SAF-TE  
CONTROLLER  
FLASH MEMORY  
SCSI BUS B SAF-TE  
CONTROLLER  
Figure 30. SCSI Backplane Board Board Component Placement (Secondary Side)  
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7.2 Functional Architecture  
This section provides an architectural description of the Server Platform SR6850HW4 SCSI  
Backplane Board functional blocks.  
7.2.1 SCSI Buses  
The SCSI Backplane Board passes the SCSI bus from the Server Board Set SE8500HW4  
Mainboard to the internal hot-swap SCSI hard disk drives. Each bus is Ultra320 SCSI low-  
voltage differential (LVD) capable. Single-ended (SE) drives are not supported in the hot-swap  
disk drive bay. Do not install an internal SE drive because the behavior of the drives is  
unpredictable and data corruption could result. This bus is comprised of 68 signals, operating at  
an 80MHz clock rate. The SCSI bus is capable of a 320MB data rate, from double transition  
(DT) data transfers on a two-byte wide bus. The bus attaches to the Server Board Set  
SE8500HW4 Mainboard with a standard 68-pin SCSI connector.  
320 MB/s = 2 byte bus * 80 MHz clock * double transitions.  
Note: Drives and the SCSI controller on the Server Board Set SE8500HW4 Mainboard  
negotiate the actual SCSI bus data rate.  
7.2.2 SCSI Drive Power Control  
SCSI power control is provided under control of the Programmable Logic Device (PLD). SCSI  
power control includes drive power switching, initial power-on charge pumping, over-current  
protection, system status notification, and drive status LEDs.  
The system is notified when a hot-swap SCSI hard disk drive is detected. The SCSI Backplane  
Board applies power to the designated hot-swap SCSI hard disk drive and illuminates the status  
LED to provide visual indication of the event.  
7.2.2.1  
Internal SCSI Drive Power Switching  
Each SCSI drive is supplied with +12V and +5V. Separate MOSFET switches are used to apply  
and remove +12V and +5V to each hot-swap SCSI hard disk drive.  
7.2.2.2  
Initial Power-on Charge Pumping  
An initial current surge (up to 20A) is applied when power is first applied to a hot-swap SCSI  
hard disk drive. To reduce this initial current surge the SCSI Backplane Board charge pumps  
the drives for ~700µs. Charge pumping the hard disk drives keeps the average power-on  
current to approximately 3A.  
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7.2.2.3  
Over-current Protection (OCP)  
If either power rail for a drive exceeds 6A on 12V or 4.5A on 5V, the MOSFET switch for the  
out-of-spec rail is turned off. Removing power protects the MOSFET and the platform from  
damage if a short occurs on one of the power rails. After one-third of a second, the MOSFET is  
turned on to see if the short has been removed. It will continue turning on and checking for a  
short every one-third of a second until the system instructs the SCSI Backplane Board to  
remove power or until the fault disappears.  
When the MOSFET is first enabled, the over current condition is not detected during the power-  
up period. This no-OCP period allows the initial current surge produced by many hot-swap SCSI  
hard disk drives. The power-up period is short enough to prevent damage to occur to the  
MOSFETS or the platform.  
7.2.2.4  
Power Control Interlock  
The power control interlock prevents drives from powering on at the same time. Since only one  
hot-swap SCSI hard disk drive can power on at once, the board power requirements can be  
kept lower. Drives power on at one-third second intervals.  
7.2.2.5  
System Status Notification  
Hot-swap SCSI hard disk drive status information is collected by the Qlogic* GEM359 SAF-TE  
controller for each bus. The controller passes the information to the server management via the  
global I2C bus and enclosure management information via the SCSI bus.  
7.2.2.6  
SCSI Status LEDs  
The status LEDs give the user a visual indication of the status of each hot-swap SCSI hard disk  
drive. A single bi-color (amber and green) LED is present for each drive. The LEDs use a  
combination of color and blinking frequency to indicate multiple conditions.  
The hot-swap SCSI hard disk drive status LEDs are located on the SCSI Backplane Board and  
projected out the front system by light pipes on the drive carrier. The states of the LEDs are  
described in Table 39.  
Table 39. Hot-swap SCSI Hard Disk Drive LED Details  
LED State  
Description  
Green on  
Drive is being initialized  
Drive is active  
Green blinking  
Amber on  
Drive/slot failure  
Amber slow blinking (~1Hz)  
Amber fast blinking (~2.5Hz)  
Predictive drive/slot failure or array rebuild is in process  
Array rebuild interrupted, rebuild on empty slot, or identify slot  
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7.2.3  
SCSI Enclosure Management  
SCSI enclosure management allows the SCSI Backplane Board to report hot-swap SCSI hard  
disk drive status via the SCSI bus. This information is normally consumed by a RAID controller  
that supports enclosure management; the optional ROMB accessory supports this feature. The  
SCSI enclosure management subsystem consists of a Qlogic GEM359 controller, flash, and  
PLD.  
THERMAL  
LVD SCSI BUS DATA 0..7  
SENSOR  
(DS75)  
ENCLOSURE  
MANAGEMENT  
CONTROLLER  
I2C  
(Qlogic* GEM359)  
LVD SCSI BUS CONTROL  
FRU  
(24C02)  
RESET  
PLD  
(LC4128V)  
FLASH  
Figure 31. Enclosure Management Signal Flow Diagram  
Qlogic GEM359 Enclosure Management Controller  
7.2.3.1  
The GEM359s send board and drive information to both the SCSI and IPMB bus. The GEM359s  
also act on requests from both the SCSI bus and global I2C bus. GEM359s GPIOs send LED  
information to the PLD.  
7.2.3.2  
4-Mb Flash  
The GEM359s code is stored in a 4-Megabit FLASH (512K x 8). The FLASH boot block is in the  
top 16k of the block. The boot block is write-protected. Non-protected FLASH can be updated  
through the IPMB bus.  
7.2.3.3  
PLD  
The PLD governs the SCSI power control circuit and controls the LEDs. The PLD is an In-System  
Programmable (ISP) with an 8-pin header connector.  
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7.2.4 Server Management Interface  
The SCSI Backplane Board supports the following server management features:  
ƒ
Local I2C Interface  
-
-
-
Field Replaceable Unit (FRU)  
Temperature sensor  
Microcontroller interface (Hot Swap Controller)  
ƒ
System I2C Interface  
-
-
Micro-controller IPMB interface  
I2C/SM Bus (for fan monitoring)  
7.2.4.1  
Local I2C Bus  
The Bus A local I2C bus connects the DS75 (or equivalent) thermal sensor and Atmel*  
AT24C02N (or equivalent) serial EEPROM (with FRU data) to the microcontroller. This thermal  
sensor is used by the BMC for the ambient temperature of the system.  
7.2.4.2  
Isolated Global I2C Bus (IPMB)  
The global I2C bus connects the controllers to the system. The global I2C bus is isolated from  
the system until the system PWRGRD reaches the SCSI Backplane Board.  
7.2.4.3  
I2C I/O Bus  
The I2C I/O bus connects the Server Board Set SE8500HW4 Mainboard microcontroller to the  
Server Platform SR6850HW4 Front Panel I/O Board, fan control and the USB hub.  
7.2.4.4  
I2C Addresses  
Four I2C devices and their addresses are listed in Table 40 and Table 41. The following I2C  
devices can be addressed on or through the SCSI Backplane Board:  
ƒ
ƒ
ƒ
ƒ
Hot Swap microcontroller (HSC)  
FRU EEPROM  
Temperature sensor  
Fan controller  
Table 40. I2C Local Bus Addresses  
Device  
AT24C02  
Address  
0xA0  
Bus/Location  
Legacy I2C/SCSI Backplane  
Board Board  
Description  
Private SCSI Backplane Board Board FRU  
EEPROM  
DS75  
0x90  
Legacy I2C /SCSI Backplane  
Board Board  
Private SCSI Backplane Board Board  
temperature sensor  
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Table 41. Global I2C Bus Addresses (IPMB Bus)  
Device  
Bus A GEM359  
Address  
0xC0  
Bus/Location  
Description  
Legacy I2C/SCSI Backplane Board Microcontroller public IPMB bus  
Board  
Bus B GEM359  
0xC2  
Legacy I2C/SCSI Backplane Board Microcontroller public IPMB bus  
Board  
Table 42. I2C IO Bus Address  
Device  
PCA9555  
Address  
0x42  
Bus/Location  
Legacy I2C/SCSI Backplane Board  
Board  
Description  
Microcontroller public I/O bus  
7.2.5  
Resets  
The PCI_RST_BP_N signal from the Server Board Set SE8500HW4 Mainboard via the 100-pin  
connector provides the principal reset for the logic on the SCSI Backplane Board. The signal  
resets the USB hub and SCSI drive power sequencing timing in the PLD. The PLD resets the  
GEM359s and their flash chips.  
The PCA9555 device used to control the fans has an internal power-on reset that configures all  
its I/O pins as inputs.  
7.2.6 Connector Interlocks  
7.2.6.1  
Mainboard Cable Connector  
The SCSI Backplane Board has an interlock on the 100-pin connector so the Server Board Set  
SE8500HW4 Mainboard can detect its presence.  
7.2.6.2  
SCA-2 Connector  
The SCSI Backplane Board uses an interlock to determine if a hot-swap SCSI hard disk drive is  
present. This interlock is defined by the SCSI_MATED# signals. Drive presence is used by  
enclosure management.  
7.2.7 Clock Generation  
The SCSI Backplane Board has a single, 10.0MHz, local clock. It supplies a 5V-rail clock input  
to the GEM359s and PLD. The clock is separately buffered by a 74LVT244.  
The SMSC* USB20H04 USB hub has its own built-in 24MHz crystal oscillator that uses an  
external crystal.  
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7.2.8  
Programmed Devices  
Four programmed devices are on the SCSI Backplane Board:  
ƒ
ƒ
ƒ
ƒ
FLASH: Flash contains program code to be run by the onboard microcontroller, the  
HSC. Memory configuration: 512 K x 8.  
Field Replaceable Unit (FRU): The FRU is programmed at the factory. Memory  
Configuration: 256 x 8 serial.  
USB hub circuit: The USB hub circuit has a serial EEPROM programmed with  
configuration data for the USB hub controller. Memory Configuration: 256 x 8 serial.  
Programmable Logic Device (PLD): The PLD governs the SCSI power control circuit,  
controls LEDs, and provides a deglitching function for the Flash chips. The PLD is  
independently In-System-Programmable (ISP) with an 8-pin header connector.  
7.3 Signal Descriptions  
The following notations are used to describe the signal type, from the perspective of the Server  
Platform SR6850HW4 SCSI Backplane Board:  
ƒ
ƒ
ƒ
ƒ
I
Input pin to the Server Platform SR6850HW4 SCSI Backplane Board  
Output pin from the Server Platform SR6850HW4 SCSI Backplane Board  
Bi-directional (input/output) pin  
O
I/O  
PWR  
Power supply pin  
The signal description also includes the type of buffer used for the particular signal:  
ƒ
ƒ
ƒ
ƒ
ƒ
LVD  
SE  
Low Voltage Differential SCSI  
Standard Single Ended SCSI  
5V TTL signals  
TTL  
CMOS 5V CMOS signals  
Analog Typically a voltage reference or specialty power supply  
ƒ hs  
This suffix is added to indicate high-speed requirements that make  
modifications subject to review  
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7.3.1  
Power from the Power Distribution Board  
The SCSI Backplane Board receives only +12V from the Power Distribution Board through a 12-  
pin connector. These pins are tied together and Table 43 provides a summary of the power  
connector pins.  
Table 43. Power Interface Signals  
Signal  
+12V  
Type  
Driver  
PWR  
Name and Description  
+12 Volt supply from Power Distribution Board  
I
7.3.2 Front Panel Power Connector  
Table 44 is a summary of the Server Platform SR6850HW4 Front Panel I/O Board power  
connector pins.  
Table 44. Front Panel I/O Board Power Interface Signals  
Signal  
+3.3Vstby  
Type  
Driver  
PWR  
Name and Description  
+3.3 Volt standby supply from Front Panel I/O Board  
I
+3.3V  
+5V  
O
O
PWR  
PWR  
+3.3 Volt supply to Front Panel I/O Board  
+5 Volt supply to Front Panel I/O Board  
7.3.3 Front Panel I/O Board Ribbon Cable Connector  
The 30-pin Server Platform SR6850HW4 Front Panel I/O Board ribbon cable connector carries  
signals to and from the SCSI Backplane Board. Table 45 provides a description of the Front  
Panel I/O Board ribbon cable connector. See Chapter 4 for pinouts.  
Table 45. Front Panel I/O Board Ribbon Connector Signal Description  
Signal  
Typ  
e
Driver  
Name and Description  
FP_ID_BTN_N  
I
Switch  
Switch  
Switch  
ID button, ground when pressed  
FP_PWR_BTN_N  
FP_RST_BTN_N  
I
Power button, ground when pressed  
Reset button, ground when pressed  
I
SYS_STATUS_GRN_  
LED_R_N  
O
Drives the front control panel system status green LED under  
Mainboard control  
SYS_STATUS_AMB_  
LED_R_N  
O
O
O
Drives the front control panel system status amber LED under  
Mainboard control  
FP_ID_LED_R_N  
Drives the front control panel ID blue LED under Mainboard  
control  
FP_PWR_LED_R_N  
Drives the front control panel power green LED under Mainboard  
control  
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HDD_LED_ACT_R_N  
HDD_LED_FLT_R_N  
NIC1_LINK_LED_R_N  
NIC2_LINK_LED_R_N  
I2C_IPMB_SCL  
O
Drives the front control panel drive active green LED when either  
a SCSI drive or an SATA drive is active  
O
Drives the front control panel drive fault amber LED to indicate a  
SCSI drive fault  
O
Drives the front control panel LAN1 green LED to indicate status  
of LAN1 on the Mainboard  
O
Drives the front control panel LAN22 green LED to indicate  
status of LAN2 on the Mainboard  
I/O  
I/O  
This pin supplies an isolated version of the global IPMB Bus  
clock to the front control panel.  
I2C_IPMB_SDA  
This pin supplies an isolated version of the global IPMB Bus data  
to the front control panel.  
+5V  
O
O
O
Power for the front control panel  
Power for the blue LED on the front control panel  
Ground, signal common  
+5V STBY  
GND  
7.3.4 LVD SCSI 68-pin Connector  
Each 68-pin LVD SCSI connector carries SCSI signals between the SCSI Backplane Board.  
The Server Board Set SE8500HW4 Mainboard is unshielded. Table 46 provides a description of  
the LVD SCSI connector.  
Table 46. LVD SCSI Connector Signal Description  
Signal  
Type  
Driver  
Name and Description  
LVD_DB[15..0]_[P, N]  
I/O  
LVD hs  
SCSI data bus. The data bits for the differential SCSI bus.  
LVD_DBP_[P, N]  
LVD_DBP1_[P, N]  
DIFFSENSE  
I/O  
I
LVD hs  
Analog  
SCSI data parity. Support parity on the SCSI bus. DB_P0[P/N] supports  
parity for data [7..0]. DB_P1[P/N] supports parity for data [15..8].  
Differential sense. The voltage level determines the operating mode of  
the target devices on the SCSI bus. If the voltage on the DIFFSENSE  
signal is from –0.35 V to +0.5 V the mode will be SE. If it is from +0.7 V  
to 1.9 V the mode will be LVD.  
LVD_ATN_[P, N]  
LVD_BSY_[P, N]  
LVD_ACK_[P, N]  
I/O  
I/O  
I/O  
LVD hs  
LVD hs  
LVD hs  
SCSI bus attention. Asserted by a SCSI device in initiator mode to alert  
the target that the initiator has a message to transfer.  
SCSI bus busy. Indicate that the SCSI bus is being used. Can be driven  
by both the initiator and the target device.  
SCSI bus acknowledge. Driven by an initiator, indicating an  
acknowledgement for a SCSI data transfer.  
LVD_RST_[P, N]  
LVD_MSG_[P, N]  
I/O  
I/O  
LVD hs  
LVD hs  
SCSI bus reset. Indicate a SCSI bus reset condition.  
SCSI bus message phase. Driven by a SCSI target to indicate it is in the  
Message Phase.  
LVD_SEL_[P, N]  
LVD_CD_[P, N]  
LVD_REQ_[P, N]  
I/O  
I/O  
I/O  
LVD hs  
LVD hs  
LVD hs  
SCSI bus select. Used by an initiator to select a target or by a target to  
reselect an initiator.  
SCSI bus control/data phase. Driven by a target, these pins indicate that  
control or data information is being transferred over the SCSI bus.  
SCSI bus request. Driven by a target, these pins indicate a request for a  
SCSI data-transfer handshake.  
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Signal  
Type  
Driver  
Name and Description  
LVD_IO_[P, N]  
I/O  
LVD hs  
SCSI bus I/O phase. Driven by the target, these pins control the  
direction of data transfer on the SCSI bus. When asserted, this signal  
indicates input to the initiator. When not asserted, this signal indicates  
output from the initiator.  
GND  
I/O  
PWR  
Ground. Provide secondary ground reference.  
7.3.5 SCA2 80-pin Drive Connectors  
The SCA2 connector carries power and signal between the SCSI Backplane Boardboard and  
hot-swap SCSI hard disk drives. The LVD SCSI bus signals are driven by either the Server  
Board Set SE8500HW4 Mainboard SCSI controller, the LVD transceiver, or the hot-swap SCSI  
hard disk drives. Table 47 provides a description of each signal on the SCSI connectors.  
Table 47. .LVD SCSI Bus Signals  
Signal  
LVD_DB[15..0]_[P, N]  
Type  
I/O  
Driver  
LVD hs  
Name and Description  
SCSI data bus. Along with the DBP[1/0][P/N] pins they form the bi-  
directional SCSI data bus.  
LVD_DBP_[P, N]  
LVD_DBP1_[P, N]  
I/O  
I
LVD hs  
SCSI data parity. Support parity on the SCSI bus.  
DBP[P/N] supports parity for data [7..0]  
DBP1[P/N] supports parity for data [15..8]  
DIFFSENSE  
Analog  
Differential sense. Monitor the DIFFSENSE signal from the  
terminator. The voltage level determines the operating mode of the  
target devices on the SCSI bus. If the voltage on the DIFFSENSE  
signal is from –0.35V to +0.5V the mode will be SE. If it is from  
+0.7V to 1.9V the mode will be LVD.  
LVD_ATN_[P, N]  
LVD_BSY_[P, N]  
I/O  
I/O  
LVD hs  
LVD hs  
SCSI bus attention. Asserted by a SCSI device in initiator mode to  
alert the target that the initiator has a message to transfer.  
SCSI bus busy. In SE mode, these pins are bi-directional and are  
asserted to gain use of the SCSI bus and to indicate that that SCSI  
bus is in use.  
LVD_ACK_[P, N]  
LVD_RST_[P, N]  
I/O  
I/O  
LVD hs  
LVD hs  
SCSI bus acknowledge. Asserted by a SCSI device in initiator mode  
to acknowledge the target’s request for a data transfer.  
SCSI bus reset. In SE mode, these pins are bi-directional and are  
asserted when all the SCSI devices attached to the SCSI bus need  
to be reset.  
LVD_MSG_[P, N]  
LVD_SEL_[P, N]  
I/O  
I/O  
LVD hs  
LVD hs  
SCSI bus message phase. Asserted by a SCSI device in target  
mode to indicate the Message In or Message Out phase.  
SCSI bus select. In SE mode, these pins are bi-directional and are  
asserted by the controller when attempting to select or reselect a  
SCSI device.  
LVD_CD_[P, N]  
LVD_REQ_[P, N]  
LVD_IO_[P, N]  
I/O  
I/O  
I/O  
LVD hs  
LVD hs  
LVD hs  
SCSI bus control/data phase. Asserted or de-asserted by a SCSI  
device in target mode to indicate that control or data information is  
being transferred over the SCSI bus  
SCSI bus request. Asserted by a SCSI device in target mode to  
indicate that the target is requesting a data transfer over the SCSI  
bus.  
SCSI bus I/O phase. Asserted by a SCSI device in target mode to  
indicate the direction of data movement on the SCSI bus between  
the target and the initiator.  
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Signal  
SCSI_ID  
Type  
O
Driver  
GND/OPEN  
Name and Description  
SCSI ID. Sets internal SCSI ID depending on slot. Drive 1 has SCSI  
address 0. Drive 2 has SCSI address 1 and so on.  
SCSI_MATED_L [1-5]  
I/O  
I/O  
O
TTL  
SCSI MATED. Determine if SCSI is present and has proper contact.  
Ground. Provide secondary ground reference.  
GND  
+12V  
+5V  
PWR  
PWR  
PWR  
+12 Volt supply. Max 1A of continuous current/6A peak current.  
+5 Volt supply. Max 1.4A of continuous current/6A peak current.  
O
7.3.6  
Fans  
Each fan has an integral amber LED with a grounded cathode. This provides a small current to  
a transistor that drives the FAN[10..1]_PRES signal. This signal is read by server management  
through U2P1, and the PCA9555 I2C Port. Server management can also use U2P1 to turn on a  
FAN[10..1]_LED signal. FET drivers boost the current through the LED to brighten it.  
The FAN_PWM signal from the Mainboard controls the fan speed. The FAN[10..1]_TACH signal  
is shaped by an FET buffer and driven to the Mainboard as FAN[10..1]_TACH_BUFF for  
determination of fan speed.  
7.3.7 Internal Logic Signals  
Table 48 is a summary of the signals that route between logic on the SCSI Backplane Board.  
Table 48. Internal Logic Signals  
Signal  
Type  
Driver  
Name and Description  
CLK_10MHz  
O
CMOS  
10-MHz clock that is used by the GEM359 and PLD.  
ADDR<16..0>  
PROM_VPP_L  
O
O
CMOS  
CMOS  
Address/bus. Address bus for the FLASH.  
FLASH PROGRAM VOLTAGE ENABLE. Driven by the  
GEM359 to all FLASH to be programmed.  
PROM_OE_L  
PROM_CE_L  
PROM_WE_L  
KCK_5V_L [1-10]  
O
O
I
CMOS  
CMOS  
CMOS  
Analog  
Analog  
CMOS  
CMOS  
Analog  
Analog  
FLASH output enable. Driven by the GEM359 to enable the  
FLASH for writing data on the bus.  
FLASH output enable. Driven by the PLD to enable the  
FLASH.  
FLASH chip enable. Driven by the GEM359 to enable  
writing to the FLASH.  
O
O
I
5 Volt kick start. Primes 5 Volt FET to start delivering power  
to a drive.  
KCK_12V_L [1-  
10]  
12 Volt kick start. Primes 12 Volt FET, to start delivering  
power to a drive.  
FLT_5V_L [1-10]  
FLT_12V_L [1-10]  
STP_5V_L[1-10]  
STP_12V_L[1-10]  
5 Volt hot-swap fault. Indicates greater than 5A of current  
drawn from 5V rail.  
I
12 Volt hot-swap fault. Indicates greater than 5A of current  
drawn from 12V rail.  
I
5 Volt stop. Stops 5 Volt FET from delivering power to a  
drive.  
I
12 Volt stop. Stops 12 Volt FET from delivering power to a  
drive.  
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Signal  
Type  
Driver  
Name and Description  
PWR_TIMER  
O
Analog  
Power timer. Starts one second timer for FET reset.  
Timer done. One second reset timer complete.  
Fan is present on system  
TMR_DONE  
I
I
I
Analog  
Analog  
Analog  
FAN_PRES[1-6]  
FAN_LED[1-6]  
LED signal when fan was off line  
FAN_TACH[1-6]  
I
Analog  
Fan speed  
7.4 Electrical, Environmental, and Mechanical Specifications  
This section specifies the operational parameters and physical characteristics for the Server  
Platform SR6850HW4 SCSI Backplane Board. Further topics in this section specify normal  
operating conditions, mechanical specifications and connector interfaces to the board.  
7.4.1  
Electrical Specifications  
The power budget for the SCSI Backplane Board and pinouts of the external interface  
connectors are defined in the following table.  
Table 49. Electrical Specifications  
Feature  
Absolute Maximum Rating  
Voltage of any signal with respect to ground  
-0.3V to Vcc1 to Vcc1+0.3V  
+3.3Vstby supply with respect to ground  
+3 .3V supply with respect to ground  
+5V supply with respect to ground  
+12V supply with respect to ground  
-0.3V to +3.465V  
-0.3V to +3.465V  
-0.3V to +5.25V  
-0.3V to +12.6V  
Note:  
1. Vcc refers to the supply voltage for the device.  
7.4.1.1  
Power Consumption  
Table 50 shows the power consumed on each supply line for the SCSI Backplane Board.  
Table 50. Maximum Power Consumption  
Devices  
Power  
Ext/Int  
Dissipation  
12V  
180W  
Ext  
Int  
5V  
100W  
0.5W  
0.5W  
0.2W  
3.3V  
3.3Vstby  
1.8V  
Int  
Ext  
Int  
Note:  
The numbers in the table are provided only to show design limits. Power consumption will  
vary, depending on the exact configuration.  
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7.4.1.2  
Hot-Swap SCSI Hard Disk Drive Supplied Power  
Hot-swap SCSI hard disk drives must fall within the power limits shown in Table 51. The SCSI  
Backplane Board works with drives that meet the following requirements.  
Table 51. SCSI Backplane Board Board Power Limits per Drive  
Device constraint  
Peak start current  
+5 V  
0.73A  
+12 V  
1.5A  
Max operating current  
Average idle  
0.81A  
0.68A  
1.15A  
0.61A  
7.4.1.3  
Power Supply Requirements  
The external and internal power supply must meet the following requirements:  
ƒ
ƒ
Rise time of less than 50ms (for all voltages).  
Delay of 5ms (minimum) from valid power to power good.  
See Table 52 for voltage regulation requirements.  
Table 52. DC Voltage Regulation  
DC Voltage  
+5V  
Acceptable Tolerance  
± 5%  
+12V  
± 5%  
± 5%  
± 5%  
± 5%  
+3.3V  
+3.3Vstby  
+1.8V  
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8. Front Panel I/O and Control Boards  
This chapter describes the Server Platform SR6850HW4 Front Panel I/O Board and is  
organized as follows:  
Section 8.1: Introduction  
Provides an overview of the Server Platform SR6850HW4 Front Panel  
I/O Board, showing functional blocks and board layout.  
Section 8.2: Functional Architecture  
Describes the Server Platform SR6850HW4 Front Panel I/O Board  
functional blocks.  
Section 8.3: Signal Descriptions  
Summary of the internal and connector signals, and the connector signal  
pin names and descriptions. Signal mnemonics appear throughout this  
chapter.  
Section 8.4: Electrical, Environmental and Mechanical Specifications  
Specifies operational parameters and considerations, and connector  
pinouts.  
Section 8.5: Front Panel Control Module  
Describes the two different front panel control modules available in the  
Server Platform SR6850HW4.  
8.1 Introduction  
The Server Platform SR6850HW4 Front Panel I/O Board provides access to the video and USB  
interfaces. It also interfaces to the front panel control module that contains the front control  
panel buttons, LEDs and optional LCD window. Circuitry on the Server Platform SR6850HW4  
Front Panel I/O Board consists of video filters, USB filters, USB port power bulk capacitors with  
fusing, and a speaker.  
8.1.1  
Block Diagram  
The following block diagram divides the Front Panel I/O Board into physical and functional  
blocks. Arrows represent buses and signals. Blocks represent the physical and functional  
circuits. Figure 32 illustrates the general architecture of the front panel.  
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Figure 32. Front Panel I/O Board Block Diagram  
8.1.2  
Architectural Overview  
The Front Panel I/O Board provides three main functions for the platform. The first function is to  
provide filtered video and USB signals to the front panel connector. The second is to provide a  
speaker. The third is to provide a system NMI button.  
Functional blocks are as follows:  
ƒ
USB ports  
-
-
-
External front control panel connector for three USB 2.0 ports  
Filtering for the USB signals  
Bulk capacitance and fused power for USB ports  
ƒ
Video connector  
-
-
External front control panel 15-pin VGA connector  
Required safety fusing and EMI filtering  
ƒ
ƒ
Speaker  
-
Audible beep-code and alarm speaker  
NMI button  
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8.1.3  
Component Location  
The following figure shows the placement of the major components and connectors on the Front  
Panel I/O Board. Figure 34 provides a three-dimensional view of the board.  
Speaker  
Connector for  
cable to SCSI  
Backplane Board  
USB  
ports  
Video port  
NMI  
button  
Figure 33. Front Panel I/O Board Placement Diagram  
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Figure 34. Front Panel I/O Board  
8.2 Functional Architecture  
This section provides an architectural description of the Server Platform SR6850HW4 Front  
Panel I/O Board functional blocks.  
8.2.1  
VGA  
The Front Panel I/O Board passes the VGA video signals from the Server Platform  
SR6850HW4 SCSI Backplane Board connector to the Front Panel I/O Board. The video signals  
originate on the Server Platform E8500HW4 Mainboard and route to the Server Platform  
SR6850HW4 SCSI Backplane Board through a 100-pin cable.  
Using the default operating system video driver options, the VGA signal is mirrored between the  
rear panel and the front panel of the platform. This design consideration was made to facilitate  
user debug of an operating system hard failure. When the system is in a failure state, a portable  
monitor could be attached to the front of the system to determine root cause. Since this is an  
enterprise server, Intel is not validating the video driver configured with the Front Panel I/O  
Board VGA connector in a non-mirrored, extended desktop state.  
8.2.2  
USB  
The Front Panel I/O Board passes the high-speed USB 2.0 signals from the Server Platform  
SR6850HW4 SCSI Backplane Board to the three USB ports on the front of the system.  
8.2.3  
NMI Button  
The Front Panel I/O Board has an NMI button; this signal is routed to the 30-pin Server Platform  
SR6850HW4 SCSI Backplane Board connector.  
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8.3 Signal Descriptions  
The following notations are used to describe the signal type, from the perspective of the Server  
Platform SR6850HW4 Front Panel I/O Board:  
ƒ
ƒ
ƒ
ƒ
I
Input pin to the Server Platform SR6850HW4 Front Panel I/O Board  
Output pin from the Server Platform SR6850HW4 Front Panel I/O Board  
Bi-directional (input/output) pin  
O
I/O  
PWR  
Power supply pin  
The signal description also includes the type of buffer used for the particular signal:  
ƒ
ƒ
ƒ
ƒ
ƒ
TTL  
5V TTL signals  
CMOS  
5V CMOS signals  
3.3V CMOS 3.3V CMOS signals  
Analog  
hs  
Typically a voltage reference or specialty power supply  
This suffix is added to indicate high-speed requirements that would make  
modifications subject to review  
8.3.1  
USB Connector  
Table 53 provides a summary of power connector pins, including the signal mnemonic, the  
name, and a brief description.  
Table 53. USB Connector  
Signal  
USB_FB_OC1  
Type  
Driver  
Name and Description  
Connector, TOP  
USB_P1_CONN_M  
USB_P1_CONN_P  
USB_P1_CABLE_GND  
USB_FB_OC2  
I/O  
I/O  
Connector, CENTER  
Connector, BOTTOM  
USB_P2_CONN_M  
USB_P2_CONN_P  
USB_P2_CABLE_GND  
USB_FB_OC3  
I/O  
I/O  
USB_P3_CONN_M  
USB_P3_CONN_P  
USB_P3_CABLE_GND  
I/O  
I/O  
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8.3.2  
Front Panel VGA Connector  
The Front Panel I/O Board provides a video port interface with a standard VGA-compatible, 15-  
pin connector. Onboard video is supplied by the ATI Radeon 7000 component, with 16MB of on-  
chip memory. The signal is mirrored between the Front Panel I/O Board and the rear panel of  
the Server Board Set SE8500HW4 Mainboard. See Chapter 4 for pinouts.  
Table 54. VGA Connector Signal Description  
Signal  
Type  
RED  
O
GREEN  
BLUE  
O
O
O
O
O
I/O  
I
HSYNC  
VSYNC  
VID_SCL  
VID_SDA  
V_PRES_L  
VIDPWR  
O
8.4 Electrical, Environmental, and Mechanical Specifications  
This section specifies the board-level operational parameters and physical characteristics for  
the Server Platform SR6850HW4 Front Panel I/O Board. Further topics in this section specify  
normal operating conditions for the front panel, mechanical specifications, and connector  
interfaces to the board.  
8.4.1  
Electrical Specifications  
The power budget for the Front Panel I/O Board are defined in Table 55.  
Table 55. Electrical Specifications  
Feature  
Absolute Maximum Rating  
Voltage of any signal with respect to ground  
-0.3V to Vcc1 to Vcc1+0.3V  
-0.3V to +5.25V  
+5V supply with respect to ground  
Note:  
1. Vcc means supply voltage for the device.  
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8.4.1.1  
Power Consumption  
The Front Panel I/O Board consumes no power. The +5 volt power consumption is for the three  
USB ports and is shown in Table 56.  
Note:  
The numbers in the table are provided only to show design limits. Power consumption  
will vary depending on the exact configuration.  
Table 56. Maximum Power Consumption  
Devices  
+5V  
Power Dissipation  
1.5W  
8.4.1.2  
Power Supply Requirements  
The power supply must meet the following requirements:  
ƒ
ƒ
ƒ
Rise time of less than 50ms (for all voltages).  
Delay of 5ms (minimum) from valid power to power good.  
See the following table for voltage regulation requirements.  
Table 57. DC Voltage Regulation  
DC Voltage  
Acceptable Tolerance  
± 5%  
+5V  
8.4.2  
Connector Specifications  
Table 58 shows the reference designators, quantity, manufacturer, and part numbers for  
connectors on the Front Panel I/O Board. See manufacturer’s documentation for information.  
Table 58. Server Platform SR6850HW4 Front Panel I/O Board Connector Specifications  
Item  
Reference Designator(s)  
Quantity Manufacturer and Part Number  
(or equivalent)  
Description  
1
J3  
1
1
1
Foxconn UB11123-M1  
Foxconn DZ11A91-G5  
Foxconn HL54157-E3  
USB Three Ports  
2
3
J2  
J1  
VGA DB-15 connector  
30-pin SCSI Backplane  
Board Board  
8.4.3  
Cooling Requirements  
The Front Panel I/O Board does not dissipate significant heat. Cooling is not required to  
maintain ambient temperatures.  
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8.5 Front Panel Control Module  
The Server Platform SR6850HW4 supports either the standard Button Control Panel, providing  
basic functionality, or a Local Control Panel, which adds an LCD and more server management  
features. Both front panels contain switches and LED status indicators. Both front panels are  
retained in the chassis sheetmetal by two clips and connect to the Server Platform SR6850HW4  
Front Panel I/O Board via a 30-pin flat cable.  
8.5.1 Button Control Panel  
Button Control Panel features are shown in Figure 35 and described in Table 59. Please refer to  
the Intel Button Control Panel Technical Product Specification for more information.  
A
B
C
D E  
G
H
F
I
K
J
L
TP01398  
Figure 35. Button Control Panel Features  
Table 59. Button Control Panel Details  
Item  
Feature  
Description  
Indicates hard drive activity and fault status.  
C
Hard Drive Activity LED  
(green/amber)  
LED  
State  
Description  
Green, on  
A hard drive is being  
initialized.  
Green, blinking  
Amber, on  
A hard drive is active.  
Hard drive/slot failure.  
Amber, slow blinking  
(~1Hz)  
A predictive hard  
drive/slot failure or  
rebuild in process.  
Amber, fast blinking  
(~2.5Hz)  
Hard drive rebuild  
interrupted or rebuild on  
empty slot.  
D,  
E
LAN1, LAN2 Status LEDs  
(green)  
Indicates LAN activity status.  
LED State  
Description  
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Front Panel I/O and Control Boards  
Description  
Item  
Feature  
Off  
Idle  
On  
Inactive  
Active  
No access  
Access  
Blinking  
F
System Status/Fault LED  
(green/amber)  
Indicates system status.  
LED  
State  
Description  
Off  
Not ready  
AC Power Off, POST  
error  
Green, on  
Ready  
System booted and  
ready  
Green, blinking  
Amber, on  
Degraded  
Critical Alarm  
Processor or DIMM  
disabled  
Critical power supply,  
blower, voltage, or  
temperature failure.  
Amber, blinking  
Non-Critical  
Alarm  
Redundant power supply  
or blower failure. non-  
critical blower, voltage,  
and temperature failure.  
G
System Power LED  
(green)  
Indicates system power status.  
LED  
Off  
State  
Power off  
Power on  
S5  
ACPI  
No  
On  
No  
Off  
Yes  
Yes  
Yes  
Blinking  
On  
S1  
S0  
H
System ID LED (blue)  
Identifies the system via server management or locally.  
Off  
On  
Not active  
Active via switch  
Cannot be turned off by  
Server Management  
Blinking  
Active via Server  
Management  
Cannot be turned off by  
switch  
I
NMI button  
Asserts NMI.  
J
K
L
System reset button  
System power button  
System ID button  
Press to reset the system.  
Press to turn the system power on or off.  
Press to turn the system ID LED on or off.  
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Front Panel I/O and Control Boards  
SR6850HW4 TPS  
Intel® Server Platform  
8.5.2  
Intel® Local Control Panel  
Intel® Local Control Panel features are shown in Figure 36 and described in the table below.  
Please refer to the Intel Local Control Panel Technical Product Specification for more  
information.  
A
B
C
D
E
M L K J I H G F  
TP01399  
A
B
C
D
E
F
LCD  
Display of text  
Scroll up button  
Scroll down button  
Back button  
Press to scroll up on the LCD  
Press to scroll down on the LCD  
Press to move to the previous LCD screen  
Press to enter a command or select an option on the LCD  
Helps identify the system via server management or locally  
Select button  
System ID LED (Blue)  
Off  
On  
Not active  
Active via switch  
Cannot be turned off by Server  
Management  
Blinking  
Active via Server  
Management  
Cannot be turned off by switch  
G
System Power LED (green)  
Indicates system power status.  
Off  
Power off  
Power on  
S4 / S5  
S1  
ACPI: No  
ACPI: No  
ACPI: Yes  
ACPI: Yes  
Yes  
On  
Off  
Blinking  
On  
S0  
H
I
System Power button  
Toggles system power  
Indicates system status  
System Status/Fault LED  
(green/amber)  
Off  
Not ready  
AC power off, POST error  
System booted and ready  
Green, on  
Green, blinking  
Ready  
Degraded  
Processor or DIMM  
disabled  
Amber, on  
Critical Alarm  
Critical power supply,  
blower, voltage, or  
temperature failure  
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Amber, blinking  
Non-Critical  
Alarm  
Redundant power supply  
or blower failure.  
Non-critical blower,  
voltage, or temperature  
failure.  
J, K  
LAN1, LAN2 Status LEDs  
(green)  
Indicates LAN activity status  
Off  
Idle  
On  
Inactive  
Active  
No access  
Access  
Blinking  
L
Hard Drive Status LED  
(green/amber)  
Indicates hard drive activity and fault status.  
Green  
On  
A hard drive is being  
initialized  
Green  
Amber  
Amber  
Blinking  
On  
A hard drive is active  
Hard drive/slot failure  
Slow blinking  
(~1 Hz)  
A predictive hard drive/slot  
failure or rebuild in  
process  
Amber  
Fast blinking  
(~2.5 Hz)  
Hard drive rebuild  
interrupted or rebuild on  
empty slot  
M
System Reset button  
Resets the system  
Figure 36. Local Control Panel Features  
8.5.3 System ID Buttons and LEDs  
The system contains two system ID buttons and two blue system ID LEDs. The LEDs are used  
to easily identify a platform. It is useful when several platforms are racked or installed near each  
other and a specific system needs to be serviced. One button/LED pair is located on the front  
control panel and a second button/LED pair is located at the rear of the platform.  
The system ID LEDs can be turned on and off either by the system ID buttons or remotely  
through server management software. If the LEDs are activated by the system LED button, they  
must be turned off with the button; they cannot be turned off remotely through software. If the  
LEDs are activated through software, they must be turned off through software, not by pressing  
the system LED button.  
Table 60. System ID LED Details  
LED State  
Off  
Description  
System ID inactive.  
On  
System ID active via button.  
Blinking  
System ID active via remote command.  
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SR6850HW4 TPS  
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Intel® Server Platform SR6850HW4 TPS  
SATA-to-IDE Converter Board  
9. SATA-to-IDE Converter Board  
This chapter describes the Server Platform SR4850HW4/SR6850HW4 SATA-to-IDE Converter  
Board to support an optical drive. This board connects a JAE Slimline peripheral 50-pin Slimline  
Form Factor (SFF) IDE connector on an optical drive to a 7-position SATA signal connector. The  
power for the optical drive and the Converter Board is delivered through a 4-pin mini-power  
connector. The SATA-to-IDE Converter Board will be removed when a SATA optical device has  
been qualified for the system.  
Please refer to the Tested Hardware Operating System List (THOL) for more information on the  
specific optical drives Intel has validated in the platform. DVD-ROM drives will be qualified for the  
platform, but since this is an enterprise server, DVD video playback will not be validated.  
9.1 Mechanical Outline  
The following figures show mechanical outline drawings of the Server Platform  
SR4850HW4/SR6850HW4 SATA-to-IDE Converter Board and an optical drive.  
Figure 37. SATA-to-IDE Converter Board Mechanical Outline  
Figure 38. SATA-to-IDE Converter Board  
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SATA-to-IDE Converter Board  
TPS  
Intel® Server Platform SR6850HW4  
SATA Signal  
Power  
Slimline DVD-ROM  
SATA to IDE  
Bridge Adapter  
Slimline SFF 50 Position  
Figure 39. SATA-to-IDE Converter Board with Attached Optical Drive  
Figure 40. SATA-to-IDE Converter Board with Attached Optical Drive  
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Regulatory Specifications  
10. Regulatory Specifications  
This server platform meets the specifications and regulations for safety and EMC defined in this  
chapter.  
10.1 Important Safety Information  
Only a technically qualified person shall access, integrate, configure, and service this product.  
10.2 Intended Application Uses  
This product was evaluated as Information Technology Equipment (ITE), which may be installed  
in offices, schools, computer rooms, and similar commercial type locations. The suitability of this  
product for other Product Categories and Environments (such as medical, industrial, alarm  
systems, and test equipment), other than an ITE application, may require further evaluation.  
10.3 Product Safety  
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UL60950 – CSA 60950(USA / Canada)  
EN60950 (CENELEC Europe)  
IEC60950 (International)  
CB Certificate and Report, IEC60950 (report to include all country national deviations)  
GS License (Germany)  
GOST R 50377-92 - License (Russia)  
Belarus License (Belarus)  
Ukraine License (Ukraine)  
CE - Low Voltage Directive 73/23/EEE (CENELEC Europe)  
IRAM Certification (Argentina)  
GB4943 – CNCA Certification (China)  
10.4 Electromagnetic Compatibility (EMC) – Emissions and Immunity  
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FCC /ICES-003, Class A Emissions (USA/Canada) Verification  
CISPR 22 - Class A Emissions (International)  
EN55022 - Class A Emissions (CENELEC Europe)  
EN55024 - Immunity (CENELEC Europe)  
EN61000-3-2 - Harmonics (CENELEC Europe)  
EN61000-3-3 - Voltage Flicker (CENELEC Europe)  
CE – EMC Directive 89/336/EEC (CENELEC Europe)  
VCCI Class A Emissions (Japan)  
AS/NZS 3548 Class A Emissions (Australia/New Zealand)  
BSMI CNS13438 Class A Emissions (Taiwan)  
GOST R 29216-91 Class A Emissions (Russia)  
GOST R 50628-95 Immunity (Russia)  
Ukraine License (Ukraine)  
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Intel® Server Platform SR6850HW4 TPS  
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RRL MIC Notice No. 1997-41 (EMC) and 1997-42 (EMI) (Korea)  
GB 9254 - CNCA Certification (China)  
GB 17625 - (Harmonics) CNCA Certification (China)  
10.5 Certifications / Registrations / Declarations  
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UL Certification (US/Canada)  
CE Declaration of Conformity (CENELEC Europe)  
FCC/ICES-003 Class A Attestation (USA/Canada)  
VCCI Certification (Japan)  
C-Tick Declaration of Conformity (Australia)  
MED Declaration of Conformity (New Zealand)  
BSMI Certification (Taiwan)  
GOST R Certification/License (Russia)  
Belarus Certification/License (Belarus)  
RRL Certification (Korea)  
IRAM Certification (Argentina)  
CNCA Certification (China)  
Ecology Declaration (International)  
Note: The use of telecommunication devices such as modems and/or wireless devices, have  
not been planned for with respect to these systems. If there is any change of plan to use such  
devices, then telecommunication type certifications will require additional planning. If NEBS  
compliance is required for system level products, additional certification planning and design will  
be required.  
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Regulatory Specifications  
10.6 Regulatory Compliance Markings  
Table 61. Product Regulatory Compliance Markings  
Markings on Product or  
Packaging  
Country  
Marking Description  
EMC Compliance Mark. Note: As shown  
indicates that the compliance folder is held in  
Australia  
Australia/New Zealand  
CCC EMC and Safety Compliance Marking  
EMC Class A Warning  
China  
System Compliance Safety Mark (same for  
USA)  
Canada  
CANADA ICES-003 CLASS A  
EMC Compliance Mark  
European Union /  
Nordics  
Declaration of Conformity Mark  
Germany  
Japan  
System Safety Compliance Mark  
EMC Compliance Mark – Class A  
Korea  
EMC Compliance Mark  
Russia  
Safety and EMC Compliance Mark  
BSMI Certification Number, RPC Marking  
BSMI EMC Warning for Class A Devices  
Taiwan  
USA  
System Compliance Safety Mark (same for  
Canada)  
EMC Compliance Marking Statement – Class  
A Products  
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10.7 Regional EMC Compliance Notices/Information  
Table 62. Regional EMC Compliance Information  
Country  
Compliance Information  
FCC Verification Notice (Class A)  
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two  
conditions: (1) this device may not cause harmful interference, and (2) this device must accept  
any interference received, including interference that may cause undesired operation.  
For questions related to the EMC performance of this product, contact:  
Intel Corporation  
5200 N.E. Elam Young Parkway  
Hillsboro, OR 97124  
1-800-628-8686  
This equipment has been tested and found to comply with the limits for a Class A digital device,  
pursuant to Part 15 of the FCC Rules. These limits are NOT designed to provide reasonable  
protection against harmful interference in a residential installation. This equipment generates,  
uses, and can radiate radio frequency energy and, if not installed and used in accordance with  
the instructions, may cause harmful interference to radio communications. However, there is no  
guarantee that interference will not occur in a particular installation. If this equipment does cause  
harmful interference to radio or television reception, which can be determined by turning the  
equipment off and on, the user is encouraged to try to correct the interference by one or more of  
the following measures:  
USA  
Reorient or relocate the receiving antenna.  
Increase the separation between the equipment and the receiver.  
Connect the equipment to an outlet on a circuit other than the one to which the receiver is  
connected.  
Consult the dealer or an experienced radio/TV technician for help.  
INDUSTRY CANADA (Class A)  
CANADA  
CHINA  
This Class A digital apparatus complies with Canadian ICES-003.  
Cet appereil numérique de la classe A est conforme à la norme NMB-003 du Canada.  
CE Declaration of Conformity  
This product has been tested in accordance to, and complies with the European Low Voltage  
Directive (73/23/EEC) and European EMC Directive (89/336/EEC). The product has been  
marked with the CE Mark to illustrate its compliance.  
EUROPE  
VCCI (Class A)  
JAPAN  
English translation of the notice above is as follow:  
This is a Class A product based on the standard of the Voluntary Control Council For  
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or  
television receiver in a domestic environment, it may cause radio interference. Install and use  
the equipment according to the instruction manual.  
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Regulatory Specifications  
Country  
Compliance Information  
BSMI Certification Information  
The following BSMI Certification information is marked on the product  
TAIWAN  
BSMI EMC Class A Warning  
RRL Certification Information  
The English translation for the above is as follows:  
KOREA  
1. Type of Equipment (Model Name):  
2. Certification No.: Contact Intel representative.  
3. Name of Certification Recipient: Intel Corporation.  
4. Date of Manufacturer: See date code on product.  
5. Manufacturer/Nation: Intel/See manufacturing label on product.  
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Glossary  
Glossary  
This appendix contains important terms used in the preceding chapters. Acronyms are then  
entered in their respective place, with non-acronyms following.  
Word / Acronym  
ACPI  
Definition  
Advanced configuration and power interface  
BIOS  
BMC  
CE  
Basic Input / Output System  
Baseboard management controller  
Community European  
CISPR  
CMOS  
CSA  
DB  
International Special Committee on Radio Interference  
Complementary metal-oxide semiconductor  
Canadian Standards Organization  
Data bus  
dBA  
Deciel acoustic  
DDR2  
DIMM  
DMA  
ECC  
EEPROM  
EMI  
Double data rate  
Dual in-Line memory module  
Direct memory access  
Error checking and correcting  
Electrically erasable programmable ROM  
Electromagnetic interference  
Emergency Management Port  
External Product Specification  
Electro static discharge  
EMP  
EPS  
ESD  
FCC  
FRB  
FRU  
FSB  
FWH  
GND  
GUI  
Federal Communications Commission  
Fault resilient booting  
Field replaceable unit  
Front side bus  
Firmware hub  
Ground  
Graphical user interface  
Hard disk drive  
HDD  
HL  
Hub-link  
HSC  
I/O  
Hot swap controller  
Input / Output  
ICMB  
IDE  
Intelligent Chassis Management Bus  
Integrated device electronics  
International Electrotechnical Commission  
Intelligent management bus  
Intelligent platform management bus  
Intelligent platform management interface  
In-system programmable  
Information technology equipment  
In-target probe  
IEC  
IMB  
IPMB  
IPMI  
ISP  
ITE  
ITP  
JTAG  
Joint Test Action Group  
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Glossary  
Intel® Server Platform SR6850HW4 TPS  
Word / Acronym  
Definition  
LAN  
Local area network  
LED  
Light emitting diode  
LPC  
Low pin count  
LVDS  
NIC  
Low voltage differential SCSI  
Network interface card  
OEM  
OS  
Original equipment manufacturer  
Operating system  
OTP  
PCI  
Over-temperature protection  
Peripheral component interconnect  
Power Distribution Board  
Platform event filtering  
PDB  
PEF  
PEP  
Platform event paging  
PFC  
Power factor correction  
Processor information ROM  
Programmable logic device  
Pulse width modulator  
PIROM  
PLD  
PWM  
RAID  
RAS  
RPM  
SAF-TE  
SCA  
SCL  
Redundant array of independent disks  
Reliability, availability, and serviceability  
Revolutions per minute  
SCSI accessed fault-tolerant enclosure  
Single connector attachment  
Serial clock  
SCSI  
SDA  
SDINT  
SDR  
SDRAM  
SE  
Small computer systems interface  
Serial data  
System diagnostic interrupt  
Sensor data record  
Synchronous dynamic RAM  
Single-ended  
SEEPROM  
SEL  
Serial dlectrically erasable programmable read-only memory  
System event log  
SMP  
TTL  
Symmetric multiprocessing  
Transistor-transistor logic  
USB  
UV  
Universal serial bus  
Under-voltage  
VAC  
VCC  
VCCI  
VGA  
VID  
Alternating current (AC) voltage  
Voltage controlled current  
Voluntary Control Council for Interference by Information Technology Equipment  
Video graphics array  
Voltage ID  
VRM  
VSB  
Voltage regulator module  
Voltage standby  
WfM  
Wired for management  
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Reference Documents  
Reference Documents  
See the following documents for additional information:  
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Intel® Server Board Set SE8500HW4 Technical Product Specification  
Intel® Server Platform SR6850HW4 Power Cord Enabling Specification  
SCSI Accessed Fault-Tolerant Enclosures Interface Specification (SAF-TE)  
Intel® Server Board SE8500HW4 Tested Hardware and Operating System List  
(THOL)  
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Intel® Local Control Panel Technical Product Specification  
Intel® Button Control Panel Technical Product Specification  
Intel® Management Module Installation and User’s Guide  
IPMI Specification, Version 2.0  
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