Intel® Server Board S5000PAL /
S5000XAL
Technical Product Specification
Intel order number: D31979-007
Revision 1.4
May 2007
Enterprise Platforms and Services Division - Marketing
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Disclaimers
Intel® Server Board S5000PAL / S5000XAL TPS
Disclaimers
Information in this document is provided in connection with Intel® products. No license, express or implied,
by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as
provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever,
and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including
liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any
patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications. Intel may make changes to specifications and product descriptions
at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked
"reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility
whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel® Server Board S5000PAL and the Intel® Server Board S5000XAL may contain design defects or
errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Intel Corporation server baseboards support peripheral components and contain a number of high-
density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are
designed and tested to meet the intended thermal requirements of these components when the fully
integrated system is used together. It is the responsibility of the system integrator that chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2007.
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Intel® Server Board S5000PAL / S5000XAL TPS
Table of Contents
Table of Contents
1. Introduction ........................................................................................................................12
1.1
1.2
Chapter Outline......................................................................................................12
Server Board Use Disclaimer ................................................................................12
2. Product Overview...............................................................................................................13
2.1
2.2
Intel® Server Board S5000PAL / S5000XAL Feature Set......................................13
Server Board Layout..............................................................................................14
Connector and Component Locations ...................................................................15
Light Guided Diagnostic LED Locations ................................................................17
External I/O Connector Locations..........................................................................18
Server Board Mechanical Drawings ......................................................................19
2.2.1
2.2.2
2.2.3
2.2.4
3. Functional Architecture.....................................................................................................24
3.1
3.1.1
Intel® 5000P and 5000X Memory Controller Hubs (MCH).....................................25
System Bus Interface.............................................................................................25
Processor Support.................................................................................................25
Memory Sub-system..............................................................................................27
Snoop Filter (5000X MCH only).............................................................................33
ESB-2 IO Controller...............................................................................................33
PCI Sub-system.....................................................................................................34
Serial ATA Support................................................................................................36
Parallel ATA (PATA) Support ................................................................................37
USB 2.0 Support....................................................................................................37
Video Support........................................................................................................37
Network Interface Controller (NIC) ........................................................................39
Intel® I/O Acceleration Technology ........................................................................39
MAC Address Definition.........................................................................................39
Super I/O ...............................................................................................................40
3.1.2
3.1.3
3.1.4
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.3
3.4
3.4.1
3.4.2
3.5
4. Platform Management........................................................................................................43
5. Connector / Header Locations and Pin-outs....................................................................44
5.1
5.2
5.3
Board Connector Information.................................................................................44
Power Connectors .................................................................................................45
System Management Headers ..............................................................................46
Intel® Remote Management Module (RMM) Connector ........................................46
Intel® RMM NIC Connector....................................................................................47
LCP/AUX IPMB Header.........................................................................................48
5.3.1
5.3.2
5.3.3
5.3.4
IPMB Header .........................................................................................................48
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Table of Contents
Intel® Server Board S5000PAL / S5000XAL TPS
5.4
5.5
5.6
5.7
Riser Card Slots.....................................................................................................48
SSI Control Panel Connector.................................................................................53
Bridge Board Connector ........................................................................................53
I/O Connector Pin-out Definition............................................................................55
VGA Connector......................................................................................................55
NIC Connectors .....................................................................................................55
IDE Connector .......................................................................................................56
Intel® I/O Expansion Module Connector ................................................................56
SATA Connectors..................................................................................................57
Serial Port Connectors...........................................................................................58
Keyboard and Mouse Connector...........................................................................58
USB 2.0 Connectors..............................................................................................59
Fan Headers..........................................................................................................60
5.7.1
5.7.2
5.7.3
5.7.4
5.7.5
5.7.6
5.7.7
5.7.8
5.8
6. Jumper Block Settings ......................................................................................................61
6.1
6.1.1
6.1.2
6.2
6.3
Recovery Jumper Blocks.......................................................................................61
CMOS Clear and Password Reset Usage Procedure ...........................................62
BMC Force Update Procedure ..............................................................................62
BIOS Select Jumper ..............................................................................................63
External RJ45 Serial Port Jumper Block................................................................64
7. Light Guided Diagnostics..................................................................................................65
7.1
7.2
5-Volt Standby LED ...............................................................................................65
System ID LED and System Status LED ...............................................................66
System Status LED – BMC Initialization................................................................67
DIMM Fault LEDs ..................................................................................................68
Processor Fault LED..............................................................................................68
Post Code Diagnostic LEDs ..................................................................................69
7.2.1
7.3
7.4
7.5
8. Power and Environmental Specifications........................................................................70
8.1
8.2
Intel® Server Board S5000PAL / S5000XAL Design Specifications ......................70
Server Board Power Requirements.......................................................................71
Processor Power Support......................................................................................71
Power Supply Output Requirements .....................................................................72
Turn On No Load Operation ..................................................................................72
Grounding..............................................................................................................73
Standby Outputs....................................................................................................73
Remote Sense.......................................................................................................73
Voltage Regulation ................................................................................................73
Dynamic Loading...................................................................................................74
Capacitive Loading ................................................................................................74
Revision 1.4
8.2.1
8.2.2
8.2.3
8.2.4
8.2.5
8.2.6
8.2.7
8.2.8
8.2.9
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Table of Contents
8.2.10 Closed-Loop Stability.............................................................................................74
8.2.11 Common Mode Noise............................................................................................74
8.2.12 Ripple / Noise ........................................................................................................75
8.2.13 Soft Starting...........................................................................................................75
8.2.14 Timing Requirements.............................................................................................75
8.2.15 Residual Voltage Immunity in Standby Mode........................................................78
9. Regulatory and Certification Information.........................................................................79
9.1
9.1.1
9.2
9.2.1
Product Regulatory Compliance............................................................................79
Product Safety & Electromagnetic (EMC) Compliance..........................................79
Electromagnetic Compatibility Notices ..................................................................80
FCC Verification Statement (USA) ........................................................................80
ICES-003 (Canada) ...............................................................................................80
Europe (CE Declaration of Conformity) .................................................................80
BSMI (Taiwan).......................................................................................................81
RRL (Korea)...........................................................................................................81
Product Ecology Compliance.................................................................................82
Other Markings ......................................................................................................83
9.2.2
9.2.3
9.2.4
9.2.5
9.3
9.4
Appendix A: Integration and Usage Tips................................................................................84
Appendix B: BMC Sensor Tables............................................................................................85
Appendix C: POST Code Diagnostic LED Decoder .............................................................101
Appendix D: POST Error Messages and Handling ..............................................................105
Appendix E: Supported Intel® Server Chassis.....................................................................108
Glossary...................................................................................................................................111
Reference Documents............................................................................................................114
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List of Figures
Intel® Server Board S5000PAL / S5000XAL TPS
List of Figures
Figure 1. Components & Connector Location Diagram ..............................................................16
Figure 2. Light Guided Diagnostic LED Location Diagram .........................................................17
Figure 3. Intel® Server Board S5000PAL / S5000XAL ATX I/O Layout ......................................18
Figure 4. Intel® Server Board S5000PAL / S5000XAL – Hole and Component Positions (1 of 2)19
Figure 5. Intel® Server Board S5000PAL / S5000XAL – Hole and Component Positions (2 of 2)20
Figure 6. Intel® Server Board S5000PAL / S5000XAL – Restricted Areas on Side 1.................21
Figure 7. Intel® Server Board S5000PAL / S5000XAL – Restricted Areas on Side 2.................22
Figure 8. Intel® Server Board S5000PAL / S5000XAL - Primary Side Duct and VR Restrictions23
Figure 9. Server Board Functional Block Diagram......................................................................24
Figure 10. CEK Processor Mounting ..........................................................................................27
Figure 11. Memory Layout..........................................................................................................27
Figure 12. Recommended Minimum Two DIMM Memory Configuration ....................................30
Figure 13. Recommended Four DIMM Configuration.................................................................31
Figure 14. Single Branch Mode Sparing DIMM Configuration....................................................32
Figure 15. Serial Port Configuration Jumper Location................................................................41
Figure 16. SMBUS Block Diagram..............................................................................................43
Figure 17. Recovery Jumper Blocks (J1D1, J1D2, J1D3) .........................................................61
Figure 18. BIOS Select Jumper (J3H1) ......................................................................................63
Figure 19. External RJ45 Serial Port Configuration Jumper.......................................................64
Figure 20. 5V Standby Status LED Location ..............................................................................65
Figure 21. System ID LED and System Status LED Locations...................................................66
Figure 22. DIMM Fault LED Locations........................................................................................68
Figure 23. Processor Fault LED Location...................................................................................68
Figure 24. POST Code Diagnostic LED Location.......................................................................69
Figure 25. Power Distribution Block Diagram .............................................................................71
Figure 26. Output Voltage Timing...............................................................................................76
Figure 27. Turn On/Off Timing (Power Supply Signals)..............................................................77
Figure 28. Diagnostic LED Placement Diagram .......................................................................101
Figure 29. 1U – Intel® Server Chassis SR1500 Overview ........................................................108
Figure 30. 1U – Intel® Server Chassis SR1550 Overview ........................................................109
Figure 31. 2U – Intel® Server Chassis SR2500 Overview ........................................................110
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List of Tables
List of Tables
Table 1. Processor Support Matrix .............................................................................................26
Table 2. I2C Addresses for Memory Module SMB .....................................................................28
Table 3. Maximum 8 DIMM System Memory Configuration – x8 Single Rank ...........................28
Table 4. Maximum 8 DIMM System Memory Configuration – x4 Dual Rank..............................28
Table 5. PCI Bus Segment Characteristics.................................................................................34
Table 6. Video Modes.................................................................................................................38
Table 7. NIC2 Status LED...........................................................................................................39
Table 8. Serial A Header Pin-out ................................................................................................40
Table 9. Rear Serial B Port Adapter Pin-out...............................................................................41
Table 10. Board Connector Matrix..............................................................................................44
Table 11. Power Connector Pin-out (J3K3) ................................................................................45
Table 12. 12V Power Connector Pin-out (J3K4).........................................................................45
Table 13. Power Supply Signal Connector Pin-out (J1K1) .........................................................45
Table 14. Intel® RMM Connector Pin-out (J1C5) ........................................................................46
Table 15. 30-pin Intel® RMM NIC Module Connector Pin-out (J1B2) .........................................47
Table 16. LPC/AUX IPMB Header Pin-out (J1C2)......................................................................48
Table 17. IPMB Header Pin-out (J1C3) ......................................................................................48
Table 18. Low-profile Riser Slot Pin-out (J5B1)..........................................................................48
Table 19. Full-height Riser Slot Pin-out (J4F1)...........................................................................49
Table 20. Front Panel SSI Standard 24-pin Connector Pin-out (J3H2) ......................................53
Table 21. 120-pin Bridgeboard Connector Pin-out (J4G1) .........................................................53
Table 22. VGA Connector Pin-out (J6A1)...................................................................................55
Table 23. RJ-45 10/100/1000 NIC Connector Pin-out (JA8A1, JA8A2)......................................55
Table 24. 44-pin IDE Connector Pin-out (J3G1).........................................................................56
Table 25. 50-pin Intel® I/O Expansion Module Connector Pin-out (J3B1)...................................57
Table 26. SATA Connector Pin-out (J1H1, J1G2, J1G1, J1F2, J1E3) .......................................57
Table 27. External RJ-45 Serial ‘B’ Port Pin-out (J9A2) .............................................................58
Table 28. Internal 9-pin Serial ‘A’ Header Pin-out (J1B1)...........................................................58
Table 29. Stacked PS/2 Keyboard and Mouse Port Pin-out (J9A1) ...........................................58
Table 30. External USB Connector Pin-out (J5A1, J6A2)...........................................................59
Table 31. Internal USB Connector Pin-out (J1J1).......................................................................59
Table 32. SSI Fan Connector Pin-out (J9K1,J5K1,J3K1,J3K2,J7A2,J7A1) ...............................60
Table 33. Recovery Jumpers (J1D1, J1D2, J1D3) .....................................................................61
Table 34: Server Board Design Specifications ...........................................................................70
Table 35. Dual-Core Intel® Xeon® Processor 5000 Sequence TDP Guidelines per processor ..71
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List of Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Table 36. 600W Load Ratings ....................................................................................................72
Table 37: No load operating range ...........................................................................................72
Table 38. Voltage Regulation Limits ...........................................................................................73
Table 39. Transient Load Requirements.....................................................................................74
Table 40. Capacitive Loading Conditions ...................................................................................74
Table 41. Ripple and Noise.........................................................................................................75
Table 42. Output Voltage Timing ................................................................................................76
Table 43. Turn On/Off Timing .....................................................................................................77
Table 44. BMC Sensors..............................................................................................................87
Table 45: POST Progress Code LED Example ........................................................................101
Table 46. Diagnostic LED POST Code Decoder ......................................................................102
Table 47. POST Error Messages and Handling........................................................................105
Table 48. POST Error Beep Codes ..........................................................................................107
Table 49. BMC Beep Codes .....................................................................................................107
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List of Tables
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Introduction
Intel® Server Board S5000PAL / S5000XAL TPS
1. Introduction
This Technical Product Specification (TPS) provides board specific information detailing the features,
functionality, and high level architecture of the Intel® Server Board S5000PAL and Intel® Server Board
S5000XAL. The Intel® S5000 Series Chipsets Server Board Family Datasheet should also be referenced
for more in depth detail of various board sub-systems including chipset, BIOS, System Management, and
System Management software.
In addition, design level information for specific sub-systems can be obtained by ordering the External
Product Specifications (EPS) or External Design Specifications (EDS) for a given sub-system. EPS and
EDS documents are not publicly available. They are only made available under NDA with Intel and must
be ordered through your local Intel representative.
The Intel® Server Board S5000PAL/XAL may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Refer to the Intel® Server Board
S5000PAL/XAL Specification Update for published errata.
1.1 Chapter Outline
This document is divided into the following chapters
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Chapter 1 – Introduction
Chapter 2 – Server Board Overview
Chapter 3 – Functional Architecture
Chapter 4 – Platform Management
Chapter 5 – Connector & Header Location and Pin-out
Chapter 6 – Configuration Jumpers
Chapter 7 – Light Guided Diagnostics
Chapter 8 – Power and Environmental Specifications
Chapter 9 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – BMC Sensor Tables
Appendix C – POST Code Diagnostic LED Decoder
Appendix D – Post Code Errors
Appendix E – Supported Intel® Server Chassis
1.2 Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of high-density VLSI
and power delivery components that need adequate airflow to cool. Intel ensures through its own chassis
development and testing that when Intel server building blocks are used together, the fully integrated
system will meet the intended thermal requirements of these components. It is the responsibility of the
system integrator who chooses not to use Intel developed server building blocks to consult vendor
datasheets and operating parameters to determine the amount of air flow required for their specific
application and environmental conditions. Intel Corporation cannot be held responsible if components fail
or the server board does not operate correctly when used outside any of their published operating or non-
operating limits.
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Intel® Server Board S5000PAL / S5000XAL TPS
Product Overview
2. Product Overview
The Intel® Server Board S5000PAL and Intel® Server Board S5000XAL are monolithic printed circuit
boards with features that were designed to support the high-density 1U and 2U server markets.
2.1 Intel® Server Board S5000PAL / S5000XAL Feature Set
Feature
Processors
Description
771-pin LGA sockets supporting 1 or 2 Dual-Core Intel® Xeon® processors 5000 sequence,
with system bus speeds of 667 MHz, 1066 MHz, or 1333 MHz
Memory
Chipset
8 Keyed DIMM slots supporting fully buffered DIMM technology (FBDIMM) memory. 240-pin
DDR2-533 and DDR2-677 FBDIMMs must be used.
Intel® 5000 Chipset Family which includes the following components:
Intel® 5000P Memory Controller Hub or Intel® 5000X Memory Controller Hub
®
1
Intel 6321ESB I/O Controller Hub
Note: Intel will only make available an OEM SKU of this server board using the Intel® 5000X
Memory Controller Hub.
On-board
External connections:
Connectors/Headers
ƒ Stacked PS/2* ports for keyboard and mouse
ƒ RJ45 Serial B port
ƒ Two RJ45 NIC connectors for 10/100/1000 Mb connections
ƒ Two USB 2.0 ports
ƒ Video Connector
Internal connectors/headers:
ƒ One USB port header, capable of providing two USB 2.0 ports
ƒ One DH10 Serial A header
ƒ Six SATA ports via the ESB-2 supporting 3Gb/s and integrated SW RAID 0/1/10 support
ƒ One 44pin (power + I/O) ATA/100 connector for optical drive support
ƒ One Intel® Remote Management Module (Intel® RMM) connector (Intel® RMM use is
optional)
ƒ One Intel® I/O Expansion Module Connector supporting:
ƒ Dual GB NIC Intel® I/O Expansion Module (Optional)
ƒ External SAS Intel® I/O Expansion Module (Optional)
ƒ Infiniband* I/O Expansion Module (Optional)
ƒ SSI-compliant 24-pin control panel header
ƒ SSI-compliant 24-pin main power connector, supporting the ATX-12V standard on the first
20 pins
ƒ 8-Pin +12V Processor Power Connector
Add-in PCI, PCI-X*, PCI
Express* Cards
ƒ
ƒ
One low profile riser slot supporting 1U or 2U PCIe* riser cards
One full height riser slot supporting 1U or 2U PCI-X* and PCIe* riser cards
On-board Video
ATI* ES1000 video controller with 16MB DDR SDRAM
On-board Hard Drive
Controller
ƒ
ƒ
Six ESB-2 3Gb/s SATA ports.
Intel® Embedded Server RAID Technology II with SW RAID levels 0/1/10.
2
ƒ
Optional support for SW RAID 5 with activation key.
LAN
Two 10/100/1000 Intel® 82563EB PHYs supporting Intel® I/O Acceleration Technology
Six 4-pin Fan Headers supporting two processor fans, and four system fans
Support for Intel® System Management Software
System Fans
System Management
®
1
For the remainder of this document, the Intel 6321ESB I/O Controller Hub will be refferred to as ESB-2.
Onboard SATA SW RAID 5 support provided as a post-launch product feature.
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Product Overview
Intel® Server Board S5000PAL / S5000XAL TPS
2.2 Server Board Layout
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Intel® Server Board S5000PAL / S5000XAL TPS
Product Overview
2.2.1
Connector and Component Locations
The following figure shows the board layout of the server board. Each connector and major component is
identified by a number or letter, and a description is given below the figure.
B
F
C
D E
A
I
G
H
QQ
PP
J
K
L
OO
NN
MM
LL
M
N
KK
JJ
II
HH
GG
FF
EE
O
P
DD
CC
BB
AA
Q
Z
Y
W V U TS
X
R
TP02071
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Product Overview
Intel® Server Board S5000PAL / S5000XAL TPS
Description
Description
A
B
C
D
E
F
G
H
I
BIOS Bank Select Jumper
V
System Fan #2 Header
Intel® ESB-2 IO Controller Hub
IO Module Option Connector
POST Code Diagnostic LEDs
Intel® Adaptive Slot – Full Height
PCI Express* Riser Slot – Low Profile
System Identification LED - Blue
External IO Connectors
W
CPU Power Connector
Main Power Connector
Battery
X
Y
Z
Power Supply Management Connector
Dual Port USB 2.0 Header
System Fan #1 Header
SSI 24-pin Control Panel Header
SATA 0
AA
BB
CC
DD
EE
FF
Status LED – Green / Amber
Serial ‘B’ Port Configuration Jumper
System Fan #4 Header
J
SATA 1
K
L
SATA 2
System Fan #3 Header
GG SATA 3
M
N
FBDIMM Slots
HH
II
SATA 4
SATA 5
Intel® 5000P Memory Controller Hub (MCH) or
Intel® 5000X Memory Controller Hub (MCH)
O
P
CPU #1 Connector
CPU #2 Connector
JJ
SATA SW RAID 5 Activation Key Connector
Intel® Remote Management Module (RMM)
Connector
KK
Q
R
S
T
CPU #1 Fan Header
LL
System Recovery Jumper Block
Voltage Regulator Heat Sink
CPU #2 Fan Header
MM Chassis Intrusion Switch Header
NN 3-pin IPMB Header
OO Intel® Local Control Panel Header
PP Serial ‘A’ Header
QQ Intel® RMM NIC Connector
Bridge Board Connector
U
ATA-100 Optical Drive Connector (Power+IO)
Figure 1. Components & Connector Location Diagram
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Product Overview
2.2.2
Light Guided Diagnostic LED Locations
B
C
A
D
I J K L M N O P
S
G
QE
R
F
TP02317
Description
Post Code Diagnostic LEDs
Description
CPU Fault LED
CPU Fault LED
A
E
F
B
C
System Identification LED – Blue
System Status LED – Green / Amber
G
5-Volt Stand-by Present
LED
D
DIMM Fault LEDs
Figure 2. Light Guided Diagnostic LED Location Diagram
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Product Overview
Intel® Server Board S5000PAL / S5000XAL TPS
2.2.3
External I/O Connector Locations
The drawing below shows the layout of the rear I/O components for the server board.
A
B
C
D
E
F
G
H
TP02296
A
B
C
D
PS/2 Mouse
E
F
NIC port 2 (1 Gb)
Video
PS/2 Keyboard
Serial Port B
G
H
USB port 1
USB port 2
NIC port 1 (1 Gb)
Figure 3. Intel® Server Board S5000PAL / S5000XAL ATX I/O Layout
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Product Overview
2.2.4
Server Board Mechanical Drawings
10.16 [0.400]
2 x 0.00 [0.000]
0.91 [0.036]
0.16 [0.006]
15.24 [0.600]
21.59 [0.850]
22.86 [0.900]
Lotes B2515BB2M
6012A0019603
45.59 [1.795]
7 x Ø 3.96 [0.156]
2 x 49.35 [1.943]
62.66 [2.467]
67.31 [2.650]
Molex 877715-3205
6012A0100101
Molex 22-44-7031
6012A0099701-HDR4P
5 x Ø 8.00 [0.315]
Silkscreen on secondary
side for spacer
AMP 177983-5
6012A0103201
Molex 22-44-7031
6012A0099701
FCI 10027747-114101
6012A0105001
2 x 101.60 [4.000]
9 x Ø 0.125 [3.18] Typ.
124.26 [4.892]
127.43 [5.017]
152.40 [6.000]
6 x Betterment
BTM-PP02.2F1611.007X
6012B0018302
4 x 187.93 [7.399]
Lotes AAA-PCI-033-K02
6012B0051002
227.33 [8.950]
228.60 [9.000]
Lotes B2515BB2M
6012A0019603
Lotes B4L60BB2L
6012A0105401
8 x Ø 10.16 [0.400]
3 x 312.42 [12.300]
320.04 [12.600]
38.10
[1.500] Typ.
TP02316
Figure 4. Intel® Server Board S5000PAL / S5000XAL – Hole and Component Positions (1 of 2)
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Product Overview
Intel® Server Board S5000PAL / S5000XAL TPS
10.16 [0.400]
5 x 6.99 [0.275]
6.27 [0.247]
2.67 [0.105]
0.00 [0.000]
3.45 [0.136]
2 x 1.83 [0.072]
3.35 [0.132]
8.64 [0.340]
35.28 [1.389]
11.96 [0.471]
19.76 [0.778]
30.91 [1.217]
35.05 [1.380]
49.68 [1.956]
1st Pin
1st Pin
8 x 40.39 [1.590]
7 x 10.67 [0.420]
62.99 [2.480]
67.39 [2.653]
76.45 [3.010]
86.11 [3.390]
1st Pin
119.16 [4.692]
119.59 [4.708]
143.00 [5.630]
160.77 [6.330]
174.17 [6.857]
178.56 [7.030]
196.33 [7.730]
211.02 [8.308]
214.12 [8.430]
214.63 [8.450]
230.38 [9.070]
231.89 [9.130]
243.83 [9.600]
265.41 [10.449]
297.84 [11.726]
308.74 [12.155]
298.51 [11.752]
309.042 [12.167]
R1.52 [0.060]
TP02292
Figure 5. Intel® Server Board S5000PAL / S5000XAL – Hole and Component Positions (2 of 2)
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Intel® Server Board S5000PAL / S5000XAL TPS
Product Overview
H < 30 mm [1.181"]
PCI BKT Drop Down
H < 11.65 mm [0.459"]
Under Rear Panel Tab
H < 5 mm [0.196"]
PCI BKT Drop Down
No Components Allowed
for Retention Pins
H < 12.7 mm [0.499"]
Under LP PCI Option Card
2 x 5.08 [0.200]
10.16 [0.400]
3.81 [0.150]
3 x 5.08 [0.200]
H < 3.5 mm [0.138"]
0.00 [0.000]
0.18 [0.007]
10.80 [0.425]
for Three Boards
2 x 3.07 [0.121]
21.23 [0.836]
28.17 [1.109]
41.96 [1.652]
18.97 [0.747]
46.76 [1.841]
53.34 [2.100]
60.15 [2.368]
9 x No Components 5.0 dia. on Top
No Components 3.5 dia. on Bottom
102.77 [4.046]
H < 12.4 mm [0.488"]
Under Riser PCIe Conn.
130.00 [5.118]
H < 10mm [0.394"]
PCI BKT DROP DOWN
H < 26 mm [1.023"]
Under Riser PCI-X Conn.
169.98 [6.692]
170.64 [6.718]
184.12 [7.249]
177.47 [6.987]
180.92 [7.123]
188.72 [7.430]
H < 11.8 mm [0.465"]
Under Riser Card
H < 3mm [0.118"]
PCI BKT DROP DOWN
H < 15.2 mm [0.600"]
Under FH PCI Option Card
234.75 [9.242]
264.97 [10.432]
273.02 [10.749]
REF ONLY
H < 7 mm [0.275"]
Under Heat Sink
316.00 [12.441]
320.04 [12.600]
4 x 7.62 [0.300]
H < 9.5 mm [0.374"]
Under Bridge Board
REF ONLY
H < 11 mm [0.433"]
Under Heat Sink
TP02293
Figure 6. Intel® Server Board S5000PAL / S5000XAL – Restricted Areas on Side 1
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Product Overview
Intel® Server Board S5000PAL / S5000XAL TPS
H < 1.47 mm [0.058"] Typ.
3 Ground Pad
on Side 2
No Components or
Surface Layer Traces
in this Zone.
2 X 5.00 [0.197]
3 X 3.99 [0.157]
10.16 [0.400]
3.00 [0.118]
0.00 [0.000]
10.13 [0.399]
Ø 29.46 [1.160] Typ.
H < 2 mm
[0.078]
15.24 [0.600] Typ.
Ø 2.000 [50.8 mm] Typ.
Backside Spring Area.
No Motherboard Component
Placement Allowed.
180.34 [7.100]
200.03 [7.875]
0.200" [5.08 mm Max] Keep IN
for 2U and above Platforms.
0.100" [2.54 mm Max] Keep IN
for 1U Platforms on Side 2.
5.08 [0.200] Typ.
20.32 [0.800] Typ.
257.73 [10.147]
4 x 4.45 [0.175]
276.86 [10.900]
Limited Height 1.27 mm
[0.05"] on Side 2
Limited Height 1.27 mm [0.05"]
on Side 2, Dia. 29.5 mm [1.160"]
320.04 [12.600]
TP02294
Figure 7. Intel® Server Board S5000PAL / S5000XAL – Restricted Areas on Side 2
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Intel® Server Board S5000PAL / S5000XAL TPS
Product Overview
10.16 [0.400]
0.00 [0.000]
NO Components Allowed
for Duct
143.51 [5.650]
2 x 173.99 [6.850]
182.83 [7.198]
H < 10.0 mm [0.394"]
Under Duct
H < 0.8 mm [0.310"]
Under VR
H < 1.5 mm [0.059"]
Under VR
256.54 [10.100]
3 x 274.32 [10.800]
298.51 [11.753]
2 x 77.22 [3.040]
5.52 [0.217]
4.83 [0.190]
NO Components Allowed
H < 27 mm [1.063"]
Under Duct
5.08 [0.200]
TP02295
Figure 8. Intel® Server Board S5000PAL / S5000XAL - Primary Side Duct and VR Restrictions
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
3. Functional Architecture
The architecture and design of the Intel® Server Board S5000PAL / S5000XAL is based on the Intel®
5000 Chipset Family. The chipset is designed for systems based on the Dual-Core Intel® Xeon®
processor 5000 sequence with system bus speeds of 667 MHz, 1066 MHz, and 1333 MHz. The chipset
is made up of two main components: the Memory Controller Hub (MCH) for the host bridge and the ESB-
2 I/O controller hub for the I/O subsystem. This chapter provides a high-level description of the
functionality associated with each chipset component and the architectural blocks that make up this
server board. For more in depth detail of the functionality for each of the chipset components and each of
the functional architecture blocks, see the Intel® S5000 Server Board Family Datasheet.
Figure 9. Server Board Functional Block Diagram
Note: The diagram above uses the Intel® 5000P MCH as a general reference designator for both MCH
components supported on this server board.
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Intel® Server Board S5000PAL / S5000XAL TPS
Functional Architecture
3.1 Intel® 5000P and 5000X Memory Controller Hubs (MCH)
This section will describe the general functionality of the memory controller hub as it is implemented on
this server board. Depending on the version of the server board in use, it may support either the Intel®
5000P MCH or the Intel® 5000X MCH. Features that are unique to a particular MCH will be so referenced.
The Memory Controller Hub (MCH) is a single 1432 pin FCBGA package which includes the following
core platform functions:
•
•
•
•
•
System Bus Interface for the processor sub-system
Memory Controller
PCI Express* Ports including the Enterprise South Bridge Interface (ESI)
FBD Thermal Management
SMBUS Interface
Additional information about MCH functionality can be obtained from the Intel® S5000 Series Chipsets
Server Board Family Datasheet, the Intel® 5000P Memory Controller Hub External Design Specification
(Yellow Cover), or the Intel® 5000X Memory Controller Hub External Design Specification (Yellow Cover).
Note: Yellow Cover documents can only be obtained under NDA with Intel and ordered through an Intel
representative.
3.1.1
System Bus Interface
The MCH is configured for symmetric multi-processing across two independent front side bus interfaces
that connect to the Dual-Core Intel® Xeon® processors 5000 sequence. Each front side bus on the MCH
uses a 64-bit wide 1066 or 1333 MHz data bus. The 1333 MHz data bus is capable of transferring data at
up to 10.66 GB/s. The MCH supports a 36-bit wide address bus, capable of addressing up to 64 GB of
memory. The MCH is the priority agent for both front side bus interfaces, and is optimized for one
processor on each bus.
3.1.2
Processor Support
The server board supports one or two Dual-Core Intel® Xeon® processors 5000 sequence, with system
bus speeds of 667 MHz, 1066 MHz, and1333 MHz, and core frequencies starting at 2.67 GHz. Previous
generations of the Intel® Xeon® processor are not supported on this server board.
Note: Only Dual-Core Intel® Xeon® processors 5000 sequence, that support system bus speeds of 667
MHz, 1066 MHz, and1333 MHz are supported on this server board. See the following table for a list of
supported processors.
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
Dual-Core Intel® Xeon® processors 5000 sequence will encompass the following:
Table 1. Processor Support Matrix
Processor Family
System Bus
Speed
533 MHz
800 MHz
Core
Frequency
All
Cache
Watts
Support
Intel® Xeon® processor
No
No
Intel® Xeon® processor
All
Dual-Core Intel® Xeon® processor 5030
Dual-Core Intel® Xeon® processor 5050
Dual-Core Intel® Xeon® processor 5060
Dual-Core Intel® Xeon® processor 5063
Dual-Core Intel® Xeon® processor 5080
Dual-Core Intel® Xeon® processor 5110
Dual-Core Intel® Xeon® processor 5120
Dual-Core Intel® Xeon® processor 5130
Dual-Core Intel® Xeon® processor 5140
Dual-Core Intel® Xeon® processor 5150
Dual-Core Intel® Xeon® processor 5160
667 MHz
667 MHz
2.67 GHz
3.0 GHz
3.2 GHz
3.2 GHz
3.73 GHz
1.60 GHz
1.87 GHz
2 GHz
2x 2 MB
2x 2 MB
2x 2 MB
2x 2 MB
2x 2 MB
4MB shared
4MB shared
4MB shared
4MB shared
4MB shared
4MB shared
95
95
130
95
130
65
65
65
65
65
80
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
Yes
1066 MHz
1066 MHz
1066 MHz
1066 MHz
1066 MHz
1333 MHz
1333 MHz
1333 MHz
1333 MHz
2.33 GHz
2.67 GHz
3 GHz
3.1.2.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and bus/core speed.
Mixed processor steppings is supported. However, the stepping of one processor cannot be greater than
one stepping back of the other. When only one processor is installed, it must be in the socket labeled
CPU1. The other socket must be empty.
The board is designed to provide up to 130A of current per processor. Processors with higher current
requirements are not supported.
No terminator is required in the second processor socket when using a single processor configuration.
3.1.2.2
Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s Common Enabling Kit (CEK) processor mounting and heat sink
retention solution. The server board ships with a CEK spring snapped onto the underside of the server
board, beneath each processor socket. The heat sink attaches to the CEK, over the top of the processor
and the thermal interface material (TIM). See the figure below for the stacking order of the chassis, CEK
spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.
Note: The processor heat sink and CEK spring shown in the following diagram are for reference
purposes only. The actual processor heat sink and CEK solutions compatible with this generation server
board may be of a different design.
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Intel® Server Board S5000PAL / S5000XAL TPS
Functional Architecture
Heatsink assembly
Thermal interface material (TIM)
Server board
CEK spring
Chassis
Figure 10. CEK Processor Mounting
3.1.3
Memory Sub-system
On the Intel® Server Board S5000PAL / S5000XAL, the MCH provides four channels of Fully Buffered
DIMM (FB-DIMM) memory. Each channel can support up to 2 Dual Ranked FB-DIMM DDR2 DIMMs. FB-
DIMM memory channels are organized in to two branches for support of RAID 1 (mirroring). The MCH
can support up to 8 DIMMs or a maximum memory size of 32 GB physical memory in non-mirrored mode
and 16 GB physical memory in a mirrored configuration. The read bandwidth for each FB-DIMM channel
is 4.25 GB/s for DDR2 533 FB-DIMM memory which gives a total read bandwidth of 17 GB/s for four FB-
DIMM channels. Thus, this provides 8.5 GB/s of write memory bandwidth for four FB-DIMM channels.
The read bandwidth for each FB-DIMM channel is 5.3GB/s for DDR2 667 FB-DIMM memory which gives
a total read bandwidth of 21GB/s for four FB-DIMM channels. Thus, this provides 10.7 GB/s of write
memory bandwidth for four FB-DIMM channels. The total bandwidth is based on read bandwidth thus the
total bandwidth is 17 GB/s for 533 and 21.0 GB/s for 667.
On the Intel® Server Board S5000PAL / S5000XAL, a pair of channels becomes a branch where Branch
0 consists of channels A and B, and Branch 1 consists of channels C and D. FBD memory channels are
organized into two branches for support of RAID 1(mirroring).
Channel B
Channel A
Channel C
Channel D
Branch 0
Branch 1
TP02299
Figure 11. Memory Layout
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
To boot the system, the system BIOS on the server board uses a dedicated I2C bus to retrieve DIMM
information needed to program the MCH memory registers. The following table provides the I2C
addresses for each DIMM slot.
Table 2. I2C Addresses for Memory Module SMB
Device
Address
DIMM A1
0xA0
DIMM A2
DIMM B1
DIMM B2
DIMM C1
DIMM C2
DIMM D1
DIMM D2
0xA2
0xA0
0xA2
0xA0
0xA2
0xA0
0xA2
3.1.3.1
Memory RASUM Featuresi
The MCH supports several memory RASUM (Reliability, Availability, Serviceability, Usability, and
Manageability) features. These features include the Intel® x4 Single Device Data Correction (Intel® x4
SDDC) for memory error detection and correction, Memory Scrubbing, Retry on Correctable Errors,
Memory Built In Self Test, DIMM Sparing, and Memory Mirroring. See the Intel® S5000 Series Chipsets
Server Board Family Datasheet for more information describing these features.
3.1.3.2
Supported Memory
The server board supports up to eight DDR2-533 or DDR2-667 Fully Buffered DIMMs (FBD memory).
The following tables show the maximum memory configurations supported using the specified memory
technology.
Table 3. Maximum 8 DIMM System Memory Configuration – x8 Single Rank
DRAM Technology x8
Single Rank
256 Mb
Maximum Capacity
Mirrored Mode
1 GB
Maximum Capacity
Non-Mirrored Mode
2 GB
4 GB
8 GB
16 GB
512 Mb
1024 Mb
2048 Mb
2 GB
4 GB
8 GB
Table 4. Maximum 8 DIMM System Memory Configuration – x4 Dual Rank
DRAM Technology x4
Dual Rank
256 Mb
Maximum Capacity
Mirrored Mode
4 GB
Maximum Capacity
Non-Mirrored Mode
8 GB
512 Mb
8 GB
16 GB
1024 Mb
16 GB
32 GB
2048 Mb
16 GB
32 GB
Note: DDR2 DIMMs that are not fully buffered are NOT supported on this server board. See the Intel®
Server Board S5000PAL / S5000XAL Tested Memory List for a complete list of supported memory for
this server board.
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Functional Architecture
3.1.3.3 DIMM Population Rules and Supported DIMM Configurations
DIMM population rules depend on the operating mode of the memory controller, which is determined by
the number of DIMMs installed. DIMMs must be populated in pairs. DIMM pairs are populated in the
following DIMM slot order: A1 & B1, C1 & D1, A2 & B2, C2 & D2. DIMMs within a given pair must be
identical with respect to size, speed, and organization. However, DIMM capacities can be different
between different DIMM pairs.
For example, a valid mixed DIMM configuration may have 512MB DIMMs installed in DIMM Slots A1 &
B1, and 1GB DIMMs installed in DIMM slots C1 & D1.
Intel supported DIMM configurations for this server board are shown in the following table.
Supported and Validated configuration : Slot is populated
Supported but not validated configuration : Slot is
populated
Slot is not populated
Mirroring: Y = Yes. Indicates that configuration supports Memory Mirroring.
Sparing:
Y(x) = Yes. Indicates that configuration supports Memory Sparing.
Where x = 0 : Sparing supported on Branch0 only
1 : Sparing supported on Branch1 only
0,1 : Sparing supported on both branches
Branch 0
Branch 1
Mirroring
Possible
Sparing
Possible
Channel A
Channel B
DIMM_B1 DIMM B2
Channel C
DIMM C1 DIMM C2
Channel D
DIMM D1 DIMM D2
DIMM_A1
DIMM_A2
Y (0)
Y
Y
Y (0)
Y (0, 1)
Notes:
-
Single channel mode is only tested and supported with a 512MB x8 FBDIMM installed in DIMM
Slot A1.
-
-
The supported memory configurations must meet population rules defined above.
For best performance, the number of DIMMs installed should be balanced across both
memory branches. For Example: a four DIMM configuration will perform better than a two
DIMM configuration and should be installed in DIMM Slots A1, B1, C1, and D1. An eight
DIMM configuration will perform better then a six DIMM configuration.
Although mixed DIMM capacities between channels is supported, Intel does not validate DIMMs
in mixed DIMM configurations.
-
3.1.3.3.1
Minimum Non-Mirrored Mode Configuration
The server board is capable of supporting a minimum of one DIMM installed. However, for system
performance reasons, Intel’s recommendation is that at least 2 DIMMs be installed.
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
The following diagram shows the recommended minimum DIMM memory configuration. Populated DIMM
slots are shown in Grey.
Channel B
Channel A
Channel C
Channel D
Branch 0
Branch 1
TP02300
Figure 12. Recommended Minimum Two DIMM Memory Configuration
Note: The server board supports single DIMM mode operation. Intel will only validate and support this
configuration with a single 512MB x8 FBDIMM installed in DIMM slot A1.
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Intel® Server Board S5000PAL / S5000XAL TPS
Functional Architecture
3.1.3.4
Non-mirrored mode memory upgrades
The minimum memory upgrade increment is two DIMMs per branch. The DIMMs must cover the same
slot position on both channels. DIMMs pairs must be identical with respect to size, speed, and
organization. DIMMs that cover adjacent slot positions do not need to be identical.
When adding two DIMMs to the configuration shown in Figure 12, the DIMMs should be populated in
DIMM slots C1 and D1 as shown in the following diagram. Populated DIMM slots are shown in Grey.
Channel B
Channel A
Channel C
Channel D
Branch 0
Branch 1
TP02301
Figure 13. Recommended Four DIMM Configuration
Functionally, DIMM slots A2 and B2 could also have been populated instead of DIMM slots C1 and D1.
However, your system will not achieve equivalent performance. Figure 13 shows the supported DIMM
configuration that is recommended because it allows both memory branches from the MCH to operate
independently and simultaneously. FBD bandwidth is doubled when both branches operate in parallel.
3.1.3.4.1
Mirrored Mode Memory Configuration
When operating in mirrored mode, both branches operate in lock step. In mirrored mode, branch 1
contains a replicate copy of the data in branch 0. The minimum DIMM configuration to support memory
mirroring is four DIMMs, populated as shown in Figure 13 above. All four DIMMs must be identical with
respect to size, speed, and organization.
To upgrade a four DIMM mirrored memory configuration, four additional DIMMs must be added to the
system. All four DIMMs in the second set must be identical to the first with the exception of speed. The
MCH will adjust to the lowest speed DIMM.
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
3.1.3.4.2 DIMM Sparing Mode Memory Configuration
The MCH provides DIMM sparing capabilities. Sparing is a RAS feature that involves configuring a DIMM
to be placed in reserve so it can be use to replace a DIMM that fails. DIMM sparing occurs within a given
bank of memory and is not supported across branches.
There are two supported Memory Sparing configurations.
3.1.3.4.2.1
Single Branch Mode Sparing
DIMM_A2
DIMM_A1
DIMM_B2
DIMM_B1
DIMM_C2
DIMM_C1
DIMM_D2
DIMM_D1
Slot 2
Slot 1
Channel A
Channel B
Channel C
Channel D
Branch 0
Branch 1
Intel® 5000P/5000X Memory Controller Hub
Figure 14. Single Branch Mode Sparing DIMM Configuration
•
•
•
•
•
•
•
DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.
DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.
DIMM_A1 and DIMM_A2 need not be identical in organization, size and speed.
DIMM_B1 and DIMM_B2 need not be identical in organization, size and speed.
Sparing should be enabled in BIOS setup.
BIOS will configure Rank Sparing Mode.
The larger of the pairs {DIMM_A1, DIMM_B1} and {DIMM_A2, DIMM_B2} will be selected as the
spare pair unit.
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Functional Architecture
3.1.3.4.2.2
Dual Branch Mode Sparing
Dual branch mode sparing requires that all eight DIMM slots be populated and must comply with the
following population rules.
•
•
•
•
•
•
•
•
•
•
•
DIMM_A1 and DIMM_B1 must be identical in organization, size and speed.
DIMM_A2 and DIMM_B2 must be identical in organization, size and speed.
DIMM_C1 and DIMM_D1 must be identical in organization, size and speed.
DIMM_C2 and DIMM_D2 must be identical in organization, size and speed.
DIMM_A1 and DIMM_A2 need not be identical in organization, size and speed.
DIMM_B1 and DIMM_B2 need not be identical in organization, size and speed.
DIMM_C1 and DIMM_C2 need not be identical in organization, size and speed.
DIMM_D1 and DIMM_D2 need not be identical in organization, size and speed.
Sparing should be enabled in BIOS setup.
BIOS will configure Rank Sparing Mode.
The larger of the pairs {DIMM_A1, DIMM_B1} and {DIMM_A2, DIMM_B2} and {DIMM_C1,
DIMM_D1} and {DIMM_C2, DIMM_D2} will be selected as the spare pair units.
3.1.4
Snoop Filter (5000X MCH only)
The 5000X version of the MCH includes a snoop filter. Depending on the application of the server, this
feature can be used to enhance the performance of the server by eliminating unnecessary traffic on the
system bus. By removing the excess traffic from the snooped bus, the full bandwidth is available for
other operations.
3.2 ESB-2 IO Controller
The ESB-2 is a multi-function device that provides four distinct functions: an IO Controller, a PCI-X*
Bridge, a Gigabit Ethernet Controller, and a Baseboard Management Controller (BMC). Each function
within the ESB-2 has its own set of configuration registers. Once configured, each appears to the system
as a distinct hardware controller.
A primary role of the ESB-2 is to provide the gateway to all PC-compatible I/O devices and features. The
server board uses the following ESB-2 features:
•
•
•
•
•
•
•
•
•
•
•
•
•
PCI-X* bus interface
Six Channel SATA interface w/SATA Busy LED Control
Dual GbE MAC
Baseboard Management Controller (BMC)
Single ATA interface, with Ultra DMA 100 capability
Universal Serial Bus 2.0 (USB) interface
Removable Media Drives
LPC bus interface
PC-compatible timer/counter and DMA controllers
APIC and 8259 interrupt controller
Power management
System RTC
General purpose I/O
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
This section describes the function of most of the listed features as they pertain to this server board. For
more detail information, see the Intel® S5000 Series Chipsets Server Board Family Datasheet or the
Intel® Enterprise South Bridge-2 External Design Specification (Yellow Cover)
3.2.1
PCI Sub-system
The primary I/O buses for the server board are PCI, PCI Express*, and PCI-X*, with six independent PCI
bus segments. The PCI buses comply with the PCI Local Bus Specification, Revision 2.3. The table
below lists the characteristics of the PCI bus segments. Details about each bus segment follow the table.
Table 5. PCI Bus Segment Characteristics
PCI Bus Segment
PCI32
Voltage
3.3V
Width
Speed
Type
PCI
On-board Device Support
32 bit
33MHz
Used internally for video controller
ESB-2
PXA
Full height riser slot, up to three slots on riser
card
3.3V/5.0V
3.3V
64 bit
x4
133MHz
10Gb/S
10Gb/S
PCI-X*
PCIe*
PCIe
ESB-2
PE1
Used for Intel chassis for mid-plane IOP
ESB-2 PCIe* Port2
PE2
Mezzanine connector for Intel® I/O Expansion
Module
3.3V
x4
ESB-2 PCIe Port3
PE4, PE5
Low profile riser slot, up to two x4 slots on 2U
riser, or one x8 slot on 1U riser.
3.3V
3.3V
x8
x8
20Gb/S
20Gb/S
PCIe
PCIe
BNB PCIe Ports
4,5
PE6, PE7
Full height riser slot, up to two x4 slots on
riser or one x8
BNB PCIe Ports
6,7
3.2.1.1
PCI32: 32-bit, 33-MHz PCI Bus Segment
All 32-bit, 33-MHz PCI I/O is directed through the ESB-2 ICH6. The 32-bit, 33-MHz PCI segment created
by the ESB-2-ICH6 is known as the PCI32 segment. The PCI32 segment supports the following
embedded devices:
•
2D Graphics Accelerator: ATI* ES1000 Video Controller
3.2.1.2
PXA: 64-bit, 133MHz PCI-X* Bus Segment
One 64-bit PCI-X* bus segment is directed through the ESB-2 ICH6. This PCI-X segment, PXA, can
support up to three add-in cards on a riser card plugged into the full height riser card slot (J4F1).
3.2.1.3
PE1: One x4 PCI Express* Bus Segment
One x4 PCI Express* bus segment is directed through the ESB-2. This PCI Express segment, PE1,
supports the optional Active SAS Midplane IOP as used in supported Intel chassis for this server board.
3.2.1.4
PE2: One x4 PCI Express* Bus Segment
One x4 PCI Express* bus segment is directed through the ESB-2. This PCI Express segment, PE2,
supports one x4 PCI Express segment to the proprietary Intel® I/O Expansion Module mezzanine
connector (J3B1).
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3.2.1.5 PE4, PE5: Two x4 PCI Express* Bus Segments
Functional Architecture
Two x4 PCI Express* bus segments are directed through the MCH. These PCI Express segments, PE4
and PE5, support one x8 or two x4 PCI Express segments to the low profile riser slot (J5B1).
3.2.1.6
PE6, PE7: Two x4 PCI Express* Bus Segments
Two x4 PCI Express* bus segments are directed through the MCH. These PCI Express segments, PE6
and PE7, support one x8 or two x4 PCI Express segments to the full height riser slot (J4F1).
3.2.1.7
PCI Riser Slots
The server board has two riser slots capable of supporting riser cards for both 1U and 2U system
configurations. Because of board placement resulting in different pin orientations, and expanded
technology support associated with the full-height riser, the riser slots are not the same and require
different riser cards.
The low profile riser slot (J5B1) utilizes a 98-pin connector. It is capable of supporting one x8 (1U) or two
x4 (2U) low profile PCI Express* add-in cards. The x8 PCI Express* bus can support bus speeds of up to
20 Gb/S. The following table provides the supported bus throughput for the given riser card used and the
number of add-in cards installed.
Low Profile Riser
1U – 1 add-in card slot
2U – 2 add-in card slots
1 add-in card populated
x8 or x4
x4
2 add-in cards populated
NA
x4
Note: There are no population rules for installing a single low profile add-in card in the 2U LP riser card; a
single add in card can be installed in either PCI Express* slot. While each slot can accommodate a x8
card, each slot will only support x4 bus speeds.
The full height riser slot (J4F1) implements Intel® Adaptive Slot Technology. This 280-pin connector is
capable of supporting riser cards that meet either the PCI-X* or PCI Express* technology specifications.
The following tables show the maximum bus speed supported with different add-in card populations for
each supported riser card.
Full Height PCI-X*
(Passive) Riser
1 add-in card populated
2 add-in cards populated 3 add-in cards populated
1U – 1 add-in card slot
2U – 3 add-in card slots
Up to 133MHz
Up to 100MHz in top PCI
slot
NA
NA
66MHz
Up to 100MHz using top
and middle slots
Note: For the 2U PCI-X* (passive) riser card, add-in cards should be installed starting with the top slot
first, followed by the middle, and then the bottom. Any add-in card populated in the bottom PCI slot will
cause the bus to operate at 66MHz.
Full Height PCI-X*
(Active) Riser
1 add-in card populated
2 add-in cards populated 3 add-in cards populated
2U – 3 add-in card slots
Up to 133MHz
Up to 133MHz
Up to 133MHz
Note: Each PCI slot on the 2U PCI-X* (active) riser card operates on an independent PCI bus. Therefore,
using an add-in card that operates below 133MHz will not affect the bus speed of the other PCI slots.
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Intel® Server Board S5000PAL / S5000XAL TPS
Full Height PCI Express*
Riser
1 add-in card populated
2 add-in cards populated
3 add-in cards populated
1U – 1 add-in card slot
2U – 3 add-in card slots
x4 or x8
NA
NA
Single PCIe* x4 in either
slot or x8 in middle slot
Or
PCI-X* – Up to 133MHz in
bottom slot
Single PCIe* – x4 in either
slot or x8 in middle slot and
PCI-X* – Up to 133MHz
Or
Dual PCIe* – x4
And
PCI-X* – Up to 133MHz
Dual PCIe – x4
3.2.2
Serial ATA Support
The ESB-2 has an integrated Serial ATA (SATA) controller that supports independent DMA operation on
six ports and supports data transfer rates of up to 3.0 Gb/s. The six SATA ports on the server board are
numbered SATA-0 thru SATA-5. The SATA ports can be enabled/disabled and/or configured by
accessing the BIOS Setup Utility during POST.
3.2.2.1
Intel® Embedded Server RAID Technology II Support
The onboard storage capability of this server board includes support for Intel® Embedded Server RAID
Technology which provides three standard software RAID levels: data stripping (RAID Level 0), data
mirroring (RAID Level 1), and data stripping with mirroring (RAID Level 10). For higher performance,
data stripping can be used to alleviate disk bottlenecks by taking advantage of the dual independent DMA
engines that each SATA port offers. Data mirroring is used for data security. Should a disk fail, a mirrored
copy of the failed disk is brought on-line. There is no loss of either PCI resources (request/grant pair) or
add-in card slots.
With the addition of an optional Intel RAID Activation Key, Intel® Embedded Server RAID Technology is
also capable of providing fault tolerant data stripping (software RAID Level 5), such that if a SATA hard
drive should fail, the lost data can be restored on a replacement drive from the other drives that make up
the RAID 5 pack.
See Figure 1. Components & Connector Location Diagram for the location of Intel RAID Activation Key
connector location.
Note: Availability of the Intel RAID Activation Key to support software RAID 5 will be deferred until after
product launch of this server board.
Intel® Embedded Server RAID Technology functionality requires the following items:
•
•
•
•
Intel® ESB-2 IO Controller Hub
Intel® Embedded Server RAID Technology Option ROM
Intel® Application Accelerator RAID Edition drivers, most recent revision
At least two SATA hard disk drives
Intel® Embedded Server RAID Technology is not available in the following configurations:
•
•
The SATA controller in compatible mode
Intel® Embedded Server RAID Technology has been disabled
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Functional Architecture
3.2.2.2
Intel® Embedded Server RAID Technology Option ROM
The Intel® Embedded Server RAID Technology for SATA Option ROM provides a pre-OS user interface
for the Intel® Embedded Server RAID Technology implementation and provides the ability for an Intel®
Embedded Server RAID Technology volume to be used as a boot disk as well as to detect any faults in
the Intel® Embedded Server RAID Technology volume(s) attached to the Intel® RAID controller.
3.2.3
Parallel ATA (PATA) Support
The integrated IDE controller of the ESB-2 ICH6 provides one IDE channel. It redefines signals on the
IDE cable to allow both host and target throttling of data and transfer rates of up to 100MB/s. For this
server board, the IDE channel was designed to provide Slim-line Optical Drive support to the platform.
The BIOS initializes and supports ATAPI devices such as CDROM, CD-RW and DVD. The IDE channel
is accessed through a single high density 44-pin connector ((J3G1) which provides both power and IO
signals. The ATA channel can be configured and enabled or disabled by accessing the BIOS Setup Utility
during POST.
Note: The IDE connector on this server board is NOT a standard 40 IDE connector. Instead, this
connector has an additional 4 power pins over and above the standard 40 I/O pins. The design intent of
this connector is to provide support for a slim-line optical drive only.
3.2.4
USB 2.0 Support
The USB controller functionality integrated into ESB-2 provides the server board with the interface for up
to eight USB 2.0 ports. Two external connectors are located on the back edge of the server board. One
internal 2x5 header is provided, capable of supporting two optional USB 2.0 ports. Three USB ports are
routed through the bridge board connector providing optional USB support for a system Control Panel or
other USB requirements. An additional USB port is dedicated to the Intel® Remote Management Module
(Intel® RMM) connector.
3.3 Video Support
The server board provides an ATI* ES1000 PCI graphics accelerator, along with 16MB of video DDR
SDRAM and support circuitry for an embedded SVGA video sub-system. The ATI ES1000 chip contains
an SVGA video controller, clock generator, 2D engine, and RAMDAC in a 359-pin BGA. One 4Mx16x4
bank DDR SDRAM chip provides 16MB of video memory.
The SVGA sub-system supports a variety of modes, up to 1024 x 768 resolution in 8 / 16 / 32bpp modes
under 2D. It also supports both CRT and LCD monitors up to a 100 Hz vertical refresh rate.
Video is accessed using a standard 15-pin VGA connector found on the back edge of the server board.
Video signals are also made available through the 120-pin bridgeboard connector which provides signals
for an optional video connector to be present on the platform’s control panel. Video is routed to both the
rear video connector and a control panel video connector. Video is present at both connectors
simultaneously and cannot be disabled at either connector individually. Hot plugging the video while the
system is still running is supported.
On-board video can be disabled using the BIOS Setup Utility or when an add-in video card is installed.
System BIOS also provides the option for dual video operation when an add-in video card is configured in
the system.
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
3.3.1.1
Video Modes
The ATI ES1000 chip supports all standard IBM* VGA modes. The following table shows the 2D modes
supported for both CRT and LCD.
Table 6. Video Modes
2D Mode
640x480
Refresh Rate (Hz)
2D Video Mode Support
16 bpp
8 bpp
Supported
32 bpp
Supported
60, 72, 75, 85, 90,
100, 120, 160, 200
Supported
800x600
60, 70, 72, 75, 85,
90, 100, 120,160
Supported
Supported
Supported
Supported
Supported
Supported
1024x768
60, 70, 72,
75,85,90,100
1152x864
1280x1024
1600x1200
43,47,60,70,75,80,85
60,70,74,75
52
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
Supported
3.3.1.2
Video Memory Interface
The memory controller sub-system of the ES1000 arbitrates requests from the direct memory interface,
the VGA graphics controller, the drawing co-processor, the display controller, the video scalar, and the
hardware cursor. Requests are serviced in a manner that ensures display integrity and maximum
CPU/co-processor drawing performance.
The server board supports a 16MB (4Meg x 16-bit x 4 banks) DDR SDRAM device for video memory.
3.3.1.3
Dual Video
The BIOS supports single and dual video modes. The dual video mode is enabled by default.
•
•
In single mode (Dual Monitor Video = Disabled), the on-board video controller is disabled when
an add-in video card is detected.
In dual mode (On-board Video = Enabled, Dual Monitor Video = Enabled), the on-board video
controller is enabled and will be the primary video device. The external video card will be
allocated resources and is considered the secondary video device. BIOS Setup provides user
options to configure the feature as follows.
On-board Video
Enabled
Disabled
Enabled
Disabled
Dual Monitor Video
Shaded if on-board video is set to "Disabled"
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Functional Architecture
3.4 Network Interface Controller (NIC)
Network interface support is provided from the built in Dual GbE MAC features of the ESB-2 in
conjunction with the Intel® 82563EB compact Physical Layer Transceiver (PHY). Together, they provide
the server board with support for dual LAN ports designed for 10/100/1000 Mbps operation.
The 82563EB device is based upon proven PHY technology integrated into the Intel® Gigabit Ethernet
Controllers. The physical layer circuitry provides a standard IEEE 802.3 Ethernet interface for 1000BASE-
T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and 802.3ab). The 82563EB device is
capable of transmitting and receiving data at rates of 1000 Mbps, 100 Mbps, or 10 Mbps
Each Network Interface Controller (NIC) drives two LEDs located on each network interface connector.
The link/activity LED (to the right of the connector) indicates network connection when on, and
Transmit/Receive activity when blinking. The speed LED (to the left of the connector) indicates 1000-
Mbps operation when amber, 100-Mbps operation when green, and 10-Mbps when off. The table below
provides an overview of the LEDs.
Table 7. NIC2 Status LED
LED Color
LED State
NIC State
Off
10 Mbps
Green/Amber (Left)
Green
Amber
On
100 Mbps
1000 Mbps
Active Connection
Green (Right)
Blinking
Transmit / Receive activity
3.4.1
Intel® I/O Acceleration Technology
Intel® I/O Acceleration Technology moves network data more efficiently through Dual-Core Intel® Xeon®
processor 5000 sequence-based servers for improved application responsiveness across diverse
operating systems and virtualized environments. Intel® I/OAT improves network application
responsiveness by unleashing the power of Dual-Core Intel® Xeon® processors 5000 sequence through
more efficient network data movement and reduced system overhead. Intel multi-port network adapters
with Intel® I/OAT provide high-performance I/O for server consolidation and virtualization via stateless
network acceleration that seamlessly scales across multiple ports and virtual machines. Intel® I/OAT
provides safe and flexible network acceleration through tight integration into popular operating systems &
virtual machine monitors, avoiding the support risks of 3rd-party network stacks and preserving existing
network requirements such as teaming and failover.
3.4.2
MAC Address Definition
Each Intel® Server Board S5000PAL / S5000XAL has four MAC addresses assigned to it at the Intel
factory. During the manufacturing process, each server board will have a white MAC address sticker
placed on the board. The sticker will display the MAC address in both bar code and alpha numeric
formats. The printed MAC address is assigned to NIC 1 on the server board. NIC 2 is assigned the NIC 1
MAC address + 1.
Two additional MAC addresses are assigned to the Baseboard Management Controller (BMC) embedded
in the ESB-2. These MAC addresses are used by the BMC’s embedded network stack to enable IPMI
remote management over LAN. BMC LAN Channel 1 is assigned the NIC1 MAC address + 2, and BMC
LAN Channel 2 is assigned the NIC1 MAC address + 3.
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Functional Architecture
Intel® Server Board S5000PAL / S5000XAL TPS
3.5 Super I/O
Legacy I/O support is provided by using a National Semiconductor* PC87427 Super I/O device. This chip
contains all of the necessary circuitry to support the following functions:
•
•
•
•
•
GPIOs
Two serial ports
Keyboard and mouse support
Wake up control
System health support
3.5.1.1
Serial Ports
The server board provides two serial ports: an external RJ45 serial port, and an internal DH10 serial
header.
Serial A is an optional port accessed through a 9-pin internal DH-10 header. A standard DH10 to DB9
cable can be used to direct the Serial A port to the rear of a chassis. The Serial A interface follows the
standard RS232 pin-out as defined in the following table.
Table 8. Serial A Header Pin-out
Pin
Signal Name
Serial Port A Header Pin-out
1
DCD
2
3
4
5
6
7
8
9
DSR
RX
RTS
TX
CTS
DTR
RI
GND
The rear RJ45 Serial B port is a fully functional serial port that can support any standard serial device.
Using an RJ45 connector for a serial port allows direct support for serial port concentrators, which
typically use RJ45 connectors and are widely used in the high-density server market. For server
applications that use a serial concentrator to access the system management features of the server
board, a standard 8-pin CAT-5 cable from the serial concentrator is plugged directly into the rear RJ45
serial port.
To allow support for either of two serial port configuration standards, a jumper block located directly
behind the rear RJ45 serial port must be configured appropriately according to the desired standard. For
serial concentrators that require a DCD signal, the jumper block must be configured with the serial port
jumper over pins 1 and 2. For serial concentrators that require a DSR signal (Default), the jumper block
must be configured with the serial port jumper over pins 3 and 4. Pin 1 on the jumper is identified by “*”.
Note: By default, the rear RJ45 serial port is configured to support a DSR signal. This configuration is
compatible with the Cisco* standard.
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Functional Architecture
J8A3
2
3
4
1-2: DCD to DTR
3-4: DSR to DTR
(factory default)
TP02303
Figure 15. Serial Port Configuration Jumper Location
Pins
1-2
3-4
What happens at system reset…
Serial port is configured for DCD to DTR
Serial port is configured for DSR to DTR (default)
For server applications that require a DB9 serial connector, an 8-pin RJ45-to-DB9 adapter must be used.
The following table provides the pin-out required for the adapter to provide RS232 support. A standard
DH10-to-DB9 cable and 8-pin RJ45 to DB9 DCD and DSR adapters are available from Intel in the Serial
Port Accessory Kit, product code: AXXRJ45DB92.
Table 9. Rear Serial B Port Adapter Pin-out
RJ45
Signal
Abbreviation
DB9
1
Request to Send
RTS
7
4
3
5
9
2
2
3
4
5
6
7
8
Data Terminal Ready
Transmitted Data
Signal Ground
Ring Indicator
DTR
TD
SGND
RI
Received Data
DCD or DSR
RD
DCD/DSR
CTS
1 or 6 (see note)
8
Clear To Send
Note: The RJ45-to-DB9 adapter should match the configuration of the serial device used. One of two pin-
out configurations is used, depending on whether the serial device requires a DSR or DCD signal. The
final adapter configuration should also match the desired pin-out of the RJ45 connector, as it can also be
configured to support either DSR or DCD.
3.5.1.2
Floppy Disk Controller
The server board does not support a floppy disk controller (FDC) interface. However, the system BIOS
does recognize USB floppy devices.
3.5.1.3
Keyboard and Mouse Support
Dual stacked PS/2 ports, located on the back edge of the server board, are provided for keyboard and
mouse support. Either port can support a mouse or keyboard. Neither port supports hot plugging.
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Intel® Server Board S5000PAL / S5000XAL TPS
3.5.1.4
Wake-up Control
The super I/O contains functionality that allows various events to power-on and power-off the system.
3.5.1.5
System Health Support
The super I/O provides an interface via GPIOs for BIOS and Server Management Firmware to activate
the Diagnostic LEDs, the FRU fault indicator LEDs for processors, DIMMs, fans and the system status
LED. Refer to Figure 2. Light Guided Diagnostic LED Location Diagram for the location of the LEDs on
the baseboard.
The super I/O also provides PMW fan control to the system fans, monitors tach and presence signals for
the system fans and monitors baseboard and control panel temperature.
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Connector / Header Locations and Pin-outs
4. Platform Management
The platform management sub-system on the server board is based on the integrated Baseboard
Management Controller (BMC) features of the ESB-2. The on board platform management subsystem
consists of communication buses, sensors, system BIOS, and server management firmware. The
following diagram provides an overview of the Server Management Bus (SMBUS) architecture used on
this server board.
See Appendix B for onboard sensor data.
For more detailed platform management information, see the Intel® S5000 Server Board Family
Datasheet.
Figure 16. SMBUS Block Diagram
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Intel® Server Board S5000PAL / S5000XAL TPS
5. Connector / Header Locations and Pin-outs
5.1 Board Connector Information
The following section provides detailed information regarding all connectors, headers and jumpers on the
server board. Table 10 lists all connector types available on the board and the corresponding reference
designators printed on the silkscreen.
Table 10. Board Connector Matrix
Connector
Quantity
Reference Designators
Connector Type
Pin
Count
8
Power supply
3
J3K4
CPU Power
Main Power
P/S Aux
J3K3
24
5
J1K1
CPU
2
8
J8G1, J5G1
CPU Sockets
DIMM Sockets
771
240
Main Memory
J7B1,J7B2,J8B1,J8B2,J8B3,J9B1,J9B2,
J9B3
J4F1
J5B1
J4G1
Full Height Riser
Low Profile Riser
1
1
1
Card Edge
Card Edge
Card Edge
280
98
Bridge Board
Connector
120
RMM
1
1
1
J1C5
J1B2
J3B1
Mezzanine
Mezzanine
Mezzanine
120
30
RMM NIC
Intel® I/O
50
Expansion Module
SATA RAID Key
IDE (I/O + Power)
1
1
J1E4
J3G1
Key Holder
3
Shrouded
Header
44
Front System Fans
#1 & #2
2
2
J3K1, J3K2
J7A2, J7A1
Header
4
4
Rear System Fans
#3 & #4
Header
CPU Fans
2
1
1
2
1
1
1
2
J5K1, J9K1
BT1J1
Header
4
3
Battery
Battery Holder
PS2, stacked
External
Keyboard/Mouse
Rear USB
J9A1
12
4
J5A1, J6A2
J1B1
Serial Port A
Serial Port B
Video connector
Header
9
J9A2
External, RJ45
External, D-Sub
10
15
14
J6A1
LAN connector
10/100/1000
JA8A1, JA8A2
External LAN
connector with
built-in magnetic
SSI Control Panel
Internal USB
Intrusion detect
Serial ATA
1
1
2
6
1
1
J3H2
Header
Header
Header
Header
Header
Header
24
10
2
J1J1
J1C4
J1H1,J1G2,J1G1,J1F2,J1F1,J1E3
7
LCP / AUX IPMB
IPMB
J1C2
J1C3
4
3
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Connector / Header Locations and Pin-outs
Connector
Quantity
Reference Designators
J1D1, J1D2, J1D3, J3H1
Connector Type
Pin
Count
3
System Recovery
Setting Jumpers
4
Jumper
5.2 Power Connectors
The main power supply connection is obtained using an SSI compliant 2x12 pin connector (J3K3). In
addition, there are two additional power related connectors; one SSI compliant 2x4 pin power connector
(J3K4) providing support for additional 12V, and one SSI compliant 1x5 pin connector (J1K1) providing
I2C monitoring of the power supply. The following tables define the connector pin-outs.
Table 11. Power Connector Pin-out (J3K3)
Pin
Signal
+3.3Vdc
Color
Orange
Pin
13
Signal
+3.3Vdc
Color
Orange
1
2
3
4
5
6
7
8
9
+3.3Vdc
GND
Orange
Black
Red
14
15
16
17
18
19
20
21
22
23
24
-12Vdc
GND
Blue
Black
Green
Black
Black
Black
White
Red
+5Vdc
GND
PS_ON#
GND
Black
Red
+5Vdc
GND
GND
Black
Gray
GND
PWR_OK
5VSB
RSVD_(-5V)
+5Vdc
+5Vdc
+5Vdc
GND
Purple
Yellow
Yellow
Orange
10
11
12
+12Vdc
+12Vdc
+3.3Vdc
Red
Red
Black
Table 12. 12V Power Connector Pin-out (J3K4)
Pin
Signal
Color
Black
1
2
3
4
5
6
7
8
GND
GND
GND
GND
Black
Black
Black
+12Vdc
+12Vdc
+12Vdc
+12Vdc
Yellow/Black
Yellow/Black
Yellow/Black
Yellow/Black
Table 13. Power Supply Signal Connector Pin-out (J1K1)
Pin
1
Signal
Color
Orange
SMB_CLK_ESB_FP_PWR_R
2
3
4
5
SMB_DAT_ESB_FP_PWR_R
SMB_ALRT_3_ESB_R
3.3V SENSE-
Black
Red
Yellow
Green
3.3V SENSE+
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Connector / Header Locations and Pin-outs
Intel® Server Board S5000PAL / S5000XAL TPS
5.3 System Management Headers
5.3.1
Intel® Remote Management Module (RMM) Connector
A 120-pin Intel® RMM Connector (J1C5) is included on the server board for sole support of the optional
Intel® Remote Management Module. There is no support for third party ASMI cards on this server board.
Note: This connector is NOT compatible for use with Intel® Server Management Module Professional
Edition (Product Code AXXIMMPRO) or the Intel® Server Management Module Advanced Edition
(Product Code AXXIMMADV).
Table 14. Intel® RMM Connector Pin-out (J1C5)
Pin
Signal Name
Pin
Signal Name
1
Reserved - NC
2
GND
3
ESB_PLT_RST_G1_N
GND
4
Reserved - NC
Reserved - NC
GND
5
6
7
Reserved - NC
Reserved - NC
GND
8
9
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
56
60
62
64
66
68
70
72
GND
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
57
59
61
63
65
67
69
71
Reserved - NC
IRQ_SERIAL_R
GND
GND
USB_ESB_P7P
USB_ESB_P7N
GND
GND
Reserved - NC
Reserved - NC
GND
P3V3
LPC_LAD<0>
LPC_LAD<1>
P3V3
LPC_FRAME_N
LPC_LAD<2>
LPC_LAD<3>
P3V3
LPC_LCLK
P3V3
SMB_1_3V3SB_MS_DAT
SMB_1_3V3SB_SL_DAT
SMB_1_3V3SB_MS_CLK
SMB_1_3V3SB_INT
P3V3_AUX
SMB_IPMB_3V3SB_DAT
SMB_IPMB_3V3SB_CLK
SMB_0_3V3SB_MS_CLK
SMB_0_3V3SB_INT
SMB_0_3V3SB_MS_DAT
SMB_0_3V3SB_SL_DAT
P3V3_AUX
SPB_IMM_DSR_N
SPB_IMM_RTS_N
SPB_IMM_CTS_N
SPB_IMM_DCD_N
SPB_RI_N
FM_IMM_PRESENT_N
SPB_IMM_DTR_N
SPB_IMM_SIN
P3V3_AUX
SPB_IMM_SOUT
P3V3_AUX
V_LCDDATA7
V_LCDDATA6
V_LCDDATA5
V_LCDDATA4
V_LCDDATA3
V_LCDCNTL1
GND
V_LCDCNTL3
P3V3_AUX
Reserved - NC
Reserved - NC
GND
V_LCDCNTL0
Reserved - NC
GND
V_LCDDATA15
V_LCDDATA714
46
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Intel® Server Board S5000PAL / S5000XAL TPS
Connector / Header Locations and Pin-outs
Pin
Signal Name
Pin
Signal Name
73
V_LCDDATA23
74
V_LCDDATA13
75
77
79
81
83
85
87
89
91
93
95
97
99
V_LCDDATA22
V_LCDDATA21
76
78
80
82
84
86
88
90
92
94
96
98
V_LCDDATA12
V_LCDDATA11
GND
V_LCDDATA20
V_LCDDATA19
V_LCDCNTL2
V_DVO_DDC_SDA
V_DVO_DDC_SCL
RST_PS_PWRGD
Reserved - NC
Reserved - NC
Reserved - NC
GND
GND
FM_MAN_LAN_TYPE1
FM_MAN_LAN_TYPE1
Reserved - NC
Reserved - NC
MII_MDC_RMII_SPARE
MII_COL_RMIIB_RXER
GND
MII_CRS_RMIIB_CRS
MII_TXER_RMIIB_TXEN
100 MII_TXCLK_RMIIB_RXCLK
101 MII_MDIO_RMIIB_PRESENT 102
GND
103
105
107
109
111
113
115
117
119
GND
104
106
108
110
112
114
116
118
120
MII_TXD3_RMIIB_TXD1
MII_TXD2_RMIIB_TXD0
GND
MII_RXD3_RMIIB_RXD1
MII_RXD2_RMIIB_RXD0
GND
MII_TXD1_RMIIA_TXD1
MII_TXD0_RMIIA_TXD0
GND
MII_RXD1_RMIIA_RXD1
MII_RXD0_RMIIA_RXD0
GND
MII_TXEN_RMIIA_TXEN
MII_RXER_RMIIA_TXER
GND
MII_RXCLK
MII_RXDV_RMIIA_CRS
5.3.2
Intel® RMM NIC Connector
The server board provides an internal 30-pin mezzanine style connector (J1B2) to accommodate a
proprietary form factor RMM NIC module. The following table details the pin-out of the RMM NIC module
connector.
Table 15. 30-pin Intel® RMM NIC Module Connector Pin-out (J1B2)
Pin
Signal Name
Pin
Signal Name
1
3
5
7
9
FM_MAN_LAN_TYPE2
2
4
6
8
MII_MDC_RMII_SPARE
FM_MAN_LAN_TYPE1
GND
MII_COL_RMIIB_RXER
GND
MII_TXCLK_RMIIB_RXCLK
MII_CRS_RMIIB_CRS
GND
MII_TXER_RMIIB_TXEN
MII_MDIO_RMIIB_PRESENT
GND
10
12
14
16
18
20
22
24
26
28
30
11
13
15
17
19
21
23
25
27
29
MII_TXD2_RMIIB_TXD0
MII_TXD1_RMIIA_TXD1
GND
MII_RXD3_RMIIB_RXD1
MII_RXD3_RMIIB_RXD0
GND
MII_TXD3_RMIIB_TXD1
MII_TXD0_RMIIA_TXD0
GND
MII_RXD1_RMIIA_RXD1
MII_RXD0_RMIIA_RXD0
GND
MII_TXEN_RMIIA_TXEN
P3V3_AUX
MII_RXCLK
P3V3_AUX
MII_RXER_RMIIA_RXER
MII_RXDV_RMIIA_CRS
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Connector / Header Locations and Pin-outs
Intel® Server Board S5000PAL / S5000XAL TPS
5.3.3
LCP/AUX IPMB Header
Table 16. LPC/AUX IPMB Header Pin-out (J1C2)
Pin
Signal Name
SMB_IPMB_5VSB_DAT BMC IMB 5V Standby Data Line
GND Ground
SMB_IPMB_5VSB_CLK BMC IMB 5V Standby Clock Line
P5V_STBY +5V Standby Power
Description
1
2
3
4
5.3.4
IPMB Header
Table 17. IPMB Header Pin-out (J1C3)
Pin
Signal Name
Description
1
SMB_IPMB_5VSB_DAT BMC IMB 5V Standby Data Line
2
3
GND
SMB_IPMB_5VSB_CLK BMC IMB 5V Standby Clock Line
5.4 Riser Card Slots
The server board has two riser card slots. The full height riser slot (J4F1) utilizes Intel® Adaptive Slot
Technology. It is capable of supporting riser cards that support either the PCI-X* or PCI Express* full
height / full length add-in cards. The low profile riser slot (J5B1) supports riser cards that support low
profile PCI Express* add-in cards. The following tables show the pin-out for these riser slots.
Table 18. Low-profile Riser Slot Pin-out (J5B1)
Pin Side B
PCI Spec Signal
Pin Side A
PCI Spec Signal
1
P12V
1
2
3
P12V
P12V
2
3
P12V
P12V
4
GND
4
GND
PD_LP_TCK
5
SMB_PCI3V3SB_CLK
SMB_PCI3V3SB_DAT
GND
5
6
6
PU_LP_TDI
7
7
FP_CHASSIS_INTRU
PU_LP_TMS
8
P3V3
8
9
PD_LPTRST_N
P3V3_AUX
9
P3V3
10
11
12
13
14
15
16
17
18
19
10
11
12
13
14
15
16
17
18
19
P3V3
PE_WAKE_N
P3V3
PE_RST_LP_N
GND
GND
CLK_100M_LP_PCIE_SLOT1_P
CLK_100M_LP_PCIE_SLOT1_N
GND
PE4_MCH_TXP_C <3..0>
PE4_MCH_TXN_C <3..0>
GND
0
0
PE4_MCH_RXP <3..0>
PE4_MCH_RXN <3..0>
GND
0
0
GND
PE4_MCH_TXP_C <3..0>
1
P3V3
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Intel® Server Board S5000PAL / S5000XAL TPS
Connector / Header Locations and Pin-outs
Pin Side B
PCI Spec Signal
Pin Side A
PCI Spec Signal
20
PE4_MCH_TXN_C <3..0>
1
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
GND
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
GND
PE4_MCH_RXP <3..0>
PE4_MCH_RXN <3..0>
GND
1
1
GND
PE4_MCH_TXP_C <3..0>
PE4_MCH_TXN_C <3..0>
GND
2
2
GND
PE4_MCH_RXP <3..0>
PE4_MCH_RXN <3..0>
GND
2
2
GND
PE4_MCH_TXP_C <3..0>
PE4_MCH_TXN_C <3..0>
GND
3
3
GND
PE4_MCH_RXP <3..0>
PE4_MCH_RXN <3..0>
GND
3
3
P3V3
GND
PE5_MCH_TXP_C <3..0>
PE5_MCH_TXN_C <3..0>
GND
CLK_100M_LP_PCIE_SLOT2_P
CLK_100M_LP_PCIE_SLOT2_N
GND
0
0
PE5_MCH_RXP <3..0>
PE5_MCH_RXN <3..0>
GND
0
0
GND
PE5_MCH_TXP_C <3..0>
PE5_MCH_TXN_C <3..0>
GND
1
1
GND
PE5_MCH_RXP <3..0>
PE5_MCH_RXN <3..0>
GND
1
1
GND
PE5_MCH_TXP_C <3..0>
PE5_MCH_TXN_C <3..0>
GND
2
2
GND
PE5_MCH_RXP <3..0>
PE5_MCH_RXN <3..0>
GND
2
2
GND
PE5_MCH_TXP_C <3..0>
PE5_MCH_TXN_C <3..0>
GND
3
3
GND
PE5_MCH_RXP <3..0>
PE5_MCH_RXN <3..0>
GND
3
3
FM_LP_RISER_TYPE1
FM_LP_RISER_TYPE0
Table 19. Full-height Riser Slot Pin-out (J4F1)
Pin-Side B PCI Spec Signal Pin-Side A PCI Spec Signal
140
139
138
137
136
135
134
133
132
131
130
129
12V
140
139
138
137
136
135
134
133
132
131
130
129
12V
12V
12V
Ground
-12V
GND
3.3VAux
Wake#
12V
12V
GND
REFCLK2+
REFCLK2+
GND
3.3V
PERST_N
GND
GND
REFCLK1+
REFCLK1+
GND
HSOp(0)
HSOn(0)
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Connector / Header Locations and Pin-outs
Intel® Server Board S5000PAL / S5000XAL TPS
Pin-Side B PCI Spec Signal Pin-Side A PCI Spec Signal
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
GND
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100
99
HSIp(0)
HSIn(0)
GND
GND
HSOp(1)
HSOn(1)
GND
GND
HSIp(1)
HSIn(1)
GND
GND
HSOp(2)
HSOn(2)
GND
GND
HSIp(2)
HSIn(2)
GND
GND
HSOp(3)
HSOn(3)
GND
GND
HSIp(3)
HSIn(3)
GND
GND
HSOp(4)
HSOn(4)
GND
GND
HSIp(4)
HSIn(4)
GND
GND
HSOp(5)
HSOn(6)
GND
GND
HSIp(5)
HSIn(5)
GND
GND
HSOp(6)
HSOn(6)
GND
GND
HSIp(6)
HSIn(6)
GND
GND
HSOp(7)
HSOn(7)
GND
GND
HSIp(7)
HSIn(7)
GND
+5V
98
INTB#
INTD#
+5V
98
97
97
ZCR_PRSNT_L
+5V
96
96
95
Reserved
+5V
95
+5V
94
94
ZCR_MSKID_L
+5V
93
IOP INTA
IOP INTB
GND
93
92
92
INTA#
INTC#
GND
91
91
90
CLK3
90
89
GND
89
REQ3#
GND
88
CLK2
88
87
GND
87
GNT3#
GND
86
REQ2#
GND
86
85
85
RST#
84
Reserved
GND
84
GND
83
83
Reserved
KEY
KEY
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Intel® Server Board S5000PAL / S5000XAL TPS
Connector / Header Locations and Pin-outs
Pin-Side B PCI Spec Signal Pin-Side A PCI Spec Signal
KEY
KEY
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
Reserved
GND
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
+5V
Reserved
GND
CLK1
Ground
REQ1#
+3.3V
GNT2#
+3.3V
GNT1#
Ground
PME1#
PME3#
AD[30]
+3.3V
PME2#
AD[31]
AD[29]
Ground
AD[27]
AD[25]
+3.3V
AD[28]
AD[26]
Ground
AD[24]
RSVRD
+3.3V
C/BE[3]#
AD[23]
Ground
AD[21]
AD[19]
+3.3V
AD[22]
AD[20]
Ground
AD[18]
AD[16]
+3.3V
AD[17]
C/BE[2]#
Ground
IRDY#
+3.3V
FRAME#
Ground
TRDY#
Ground
STOP#
+3.3V
DEVSEL#
PCI-XCAP
LOCK#
PERR#
+3.3V
SERR#
+3.3V
SMBD
SMBCLK
Ground
PAR
C/BE[1]#
AD[14]
Ground
AD[12]
AD[10]
M66EN
Ground
Ground
AD[08]
AD[07]
+3.3V
AD[15]
+3.3V
AD[13]
AD[11]
Ground
AD[09]
C/BE[0]#
+3.3V
AD[06]
AD[04]
Ground
AD[02]
AD[00]
AD[05]
AD[03]
Ground
AD[01]
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Connector / Header Locations and Pin-outs
Intel® Server Board S5000PAL / S5000XAL TPS
Pin-Side B PCI Spec Signal Pin-Side A PCI Spec Signal
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
KEY
KEY
11
10
9
+3.3V
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
KEY
KEY
11
10
9
+3.3V
ACK64#
+5V
REQ64#
+5V
+5V
+5V
Reserved
Ground
C/BE[6]#
C/BE[4]#
Ground
AD[63]
AD[61]
3.3V
+5V
C/BE[7]#
C/BE[5]#
Ground
PAR64
AD[62]
3.3V
AD[60]
AD[58]
Ground
AD[56]
AD[54]
3.3V
AD[59]
AD[57]
Ground
AD[55]
AD[53]
Ground
AD[51]
AD[49]
3.3V
AD[52]
AD[50]
Ground
AD[48]
AD[46]
Ground
AD[44]
AD[42]
AD[47]
AD[45]
Ground
AD[43]
AD[41]
Ground
AD[39]
AD[37]
3.3V
3.3V
AD[40]
AD[38]
8
8
Ground
AD[36]
7
7
6
AD[35]
AD[33]
Ground
Type1
Type0
Size
6
AD[34]
5
5
Ground
AD[32]
4
4
3
3
PXH_RST_N
Ground
PXH_PWROK
2
2
1
1
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Intel® Server Board S5000PAL / S5000XAL TPS
Connector / Header Locations and Pin-outs
5.5 SSI Control Panel Connector
The server board provides a 24-pin SSI control panel connector (J3H2) for use with non-Intel chassis.
The following table provides the pin-out for this connector.
Table 20. Front Panel SSI Standard 24-pin Connector Pin-out (J3H2)
Pin
Signal Name
P3V3_STBY
Pin
Signal Name
P3V3_STBY
1
3
5
7
9
2
4
6
8
Key
P5V_STBY
FP_PWR_LED_L
P3V3
FP_ID_LED_L
FP_STATUS_LED1_R
FP_STATUS_LED2_R
LAN_ACT_A_L
HDD_LED_ACT_R
FP_PWR_BTN_L
GND
10
12
14
16
18
20
22
24
11
13
15
17
19
21
23
LAN_LINKA_L
Reset Button
GND
PS_I2C_3VSB_SDA
PS_I2C_3VSB_SCL
FP_CHASSIS_INTRU
LAN_ACT_B_L
FP_ID_BTN_L
TEMP_SENSOR
FP_NMI_BTN_L
LAN_LINKB_L
5.6 Bridge Board Connector
For use in supported Intel® Server Chassis, the server board provides a 120-pin high-density bridge
board connector (J4G1) to route control panel, mid-plane, and backplane signals from the server board to
the specified system board. The following table provides the pin-outs for this connector.
Table 21. 120-pin Bridgeboard Connector Pin-out (J4G1)
Pin
A1
Signal Name
SMB_HOST_3V3_CLK
Pin
B1
Signal Name
GND
A2
SMB_HOST_3V3_DAT
FM_BRIDGE_PRESENT_N
GND
B2
PE1_ESB_TXN_C<3>
PE1_ESB_TXP_C<3>
GND
A3
B3
A4
B4
A5
PE1_ESB_RXN_C<3>
PE1_ESB_RXP_C<3>
GND
B5
PE_WAKE_N
A6
B6
GND
A7
B7
PE1_ESB_TXN_C<2>
PE1_ESB_TXP_C<2>
GND
A8
FM_FAN_D_PRSNT6
GND
B8
A9
B9
A10
A11
A12
A13
A14
A15
A16
A17
A18
PE1_ESB_RXN_C<2>
PE1_ESB_RXP_C<2>
GND
B10
B11
B12
B13
B14
B15
B16
B17
B18
FM_FAN_D_PRSNT5
GND
PE1_ESB_TXN_C<1>
PE1_ESB_TXP_C<1>
GND
FM_FAN_D_PRSNT4
GND
PE1_ESB_RXN_C<1>
PE1_ESB_RXP_C<1>
GND
RST_MP_PWRGD
GND
PE1_ESB_TXN_C<0>
PE1_ESB_TXP_C<0>
FM_RAID_PRESENT
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Connector / Header Locations and Pin-outs
Intel® Server Board S5000PAL / S5000XAL TPS
Pin
A19
Signal Name
Pin
B19
Signal Name
GND
GND
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
A33
A34
A35
A36
PE1_ESB_RXN_C<0>
PE1_ESB_RXP_C<0>
GND
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
FM_RAID_MODE
GND
CLK_100M_SRLAKE_N
CLK_100M_SRLAKE_P
GND
FM_FAN_D_PRSNT1
FM_FAN_D_PRSNT3
FM_FAN_D_PRSNT2
GND
SGPIO_DATAOUT1_R
SGPIO_DATAOUT0_R
SGPIO_LOAD_R
SGPIO_CLOCK_N
GND
USB_ESB_P4P
USB_ESB_P4N
GND
USB_ESB_OC_N<4>
USB_ESB_OC_N<3>
GND
USB_ESB_P2P
USB_ESB_P2N
GND
USB_ESB_P3P
USB_ESB_P3N
GND
USB_ESB_OC_N<2>
NIC1_LINK_LED_N
NIC1_ACT_LED_N
LED_STATUS_GREEN_R1
KEY
FP_NMI_BTN_N
KEY
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
A50
A51
A52
A53
A54
A55
A56
A57
A58
A59
A60
BMC_RST_BTN_N
FP_PWR_BTN_N
FP_ID_BTN
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
B50
B51
B52
B53
B54
B55
B56
B57
B58
B59
B60
NIC2_LINK_LED_N
NIC2_ACT_LED_N
LED_STATUS_AMBER_R1
GND
GND
SMB_IPMB_ 5VSB_SDA
SMB_IPMB_ 5VSB_CLK
GND
SMB_SN_3V3SB_DAT_BUF
SMB_SN_3V3SB_CLK_BUF
GND
LED_ HDD_ACTIVITY_N
P3V3
V_IO_HSYNC2_BUF_FP
V_IO_VSYNC2_BUF_FP
GND
FP_PWR_LED_N_R
P3V3_STBY
V_IO_BLUE_CONN_FP
V_IO_GREEN_CONN_FP
V_IO_RED_CONN_FP
GND
FP_ID_LED_R1_N
FM_SIO_TEMP_SENSOR
LED_FAN3_FAULT
LED_FAN2_FAULT
LED_FAN1_FAULT
FAN_PWM_CPU1
GND
LED_FAN10_FAULT
LED_FAN5_FAULT
LED_FAN4_FAULT
FAN_IO_PWM
FAN_PWM_CPU2
PCI_FAN_TACH9
FAN_TACH7
GND
PCI_FAN_TACH10
FAN_TACH8
FAN_TACH5
FAN_TACH6
FAN_TACH3_H7
FAN_TACH1_H7
FAN_TACH4_H7
FAN_TACH2_H7
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Connector / Header Locations and Pin-outs
5.7 I/O Connector Pin-out Definition
5.7.1
VGA Connector
The following table details the pin-out definition of the VGA connector (J6A1).
Table 22. VGA Connector Pin-out (J6A1)
Pin
Signal Name
V_IO_R_CONN
Description
Red (analog color signal R)
1
2
3
4
5
6
7
8
9
V_IO_G_CONN
V_IO_B_CONN
TP_VID_CONN_B4
GND
Green (analog color signal G)
Blue (analog color signal B)
No connection
Ground
GND
Ground
GND
Ground
GND
Ground
TP_VID_CONN_B9
GND
No Connection
Ground
10
11
12
13
14
15
TP_VID_CONN_B11
V_IO_DDCDAT
V_IO_HSYNC_CONN
V_IO_VSYNC_CONN
V_IO_DDCCLK
No connection
DDCDAT
HSYNC (horizontal sync)
VSYNC (vertical sync)
DDCCLK
5.7.2
NIC Connectors
The server board provides two RJ45 NIC connectors oriented side by side on the back edge of the board
(JA8A1, JA8A2). The pin-out for each connector is identical and is defined in the following table.
Table 23. RJ-45 10/100/1000 NIC Connector Pin-out (JA8A1, JA8A2)
Pin
Signal Name
1
2
3
4
5
6
7
8
9
GND
P1V8_NIC
NIC_A_MDI3P
NIC_A_MDI3N
NIC_A_MDI2P
NIC_A_MDI2N
NIC_A_MDI1P
NIC_A_MDI1N
NIC_A_MDI0P
NIC_A_MDI0N
10
11 (D1) NIC_LINKA_1000_N (LED
12 (D2) NIC_LINKA_100_N (LED)
13 (D3) NIC_ACT_LED_N
14
15
16
NIC_LINK_LED_N
GND
GND
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5.7.3
IDE Connector
The server board includes an IDE connector to access the single IDE channel from the ESB-2 IO
controller hub. The design intent for this connector is to provide IDE support for a single slim-line optical
drive, such as CDROM or DVD. The connector is not a standard 40-pin IDE connector, instead it has 44
pins providing support for both power and IO signals. The pin-out for this connector is defined in the
following table.
Table 24. 44-pin IDE Connector Pin-out (J3G1)
Pin
Signal Name
Pin
Signal Name
1
3
5
7
9
ESB_PLT_RST_IDE_N
2
4
6
8
GND
RIDE_DD_7
RIDE_DD_6
RIDE_DD_5
RIDE_DD_4
RIDE_DD_3
RIDE_DD_2
RIDE_DD_1
RIDE_DD_0
GND
RIDE_DD_8
RIDE_DD_9
RIDE_DD_10
RIDE_DD_11
RIDE_DD_12
RIDE_DD_13
RIDE_DD_14
RIDE_DD_15
KEY
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
RIDE_DDREQ
RIDE_DIOW_N
RIDE_DIOR_N
RIDE_PIORDY
RIDE_DDACK_N
IRQ_IDE
GND
GND
GND
GND
GND
TP_PIDE_32
IDE_PRI_CBLSNS
RIDE_DA2
RIDE_DCS3_N
GND
RIDE_DA1
RIDE_DA0
RIDE_DCS1_N
LED_IDE_N
P5V
P5V
GND
GND
5.7.4
Intel® I/O Expansion Module Connector
The server board provides an internal 50-pin mezzanine style connector (J3B1) to accommodate
proprietary form factor Intel® I/O Expansion Modules, which expand the IO capabilities of the server board
without sacrificing an add-in slot from the riser cards. There are three planned IO modules for use on this
server board: external 4 port SAS, dual Gb NIC, and Infiniband*. For more detail on the supported IO
modules, please refer to the Intel® Server Board S5000PAL / S5000XAL IO Module Hardware
Specification. The following table details the pin-out of the Intel® I/O Expansion Module connector.
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Connector / Header Locations and Pin-outs
Table 25. 50-pin Intel® I/O Expansion Module Connector Pin-out (J3B1)
Pin
Signal Name
P3V3_AUX
Pin
Signal Name
P3V3_AUX
1
3
5
7
9
2
4
6
8
PE_RST_G2_PM_N
GND
GND
PE2_ESB_RXP_C<0>
GND
PE2_ESB_RXN_C<0>
PE2_ESB_TXP_C<0>
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
GND
11
13
15
17
19
21
22
25
27
29
31
33
35
37
39
41
43
45
47
49
PE2_ESB_TXN_C<0>
GND
GND
PE2_ESB_RXP_C<1>
GND
PE2_ESB_RXN_C<1>
PE2_ESB_TXP_C<2>
GND
PE2_ESB_TXN_C<2>
GND
GND
PE2_ESB_RXP_C<2>
GND
PE2_ESB_RXN_C<2>
PE2_ESB_TXP_C<1>
GND
PE2_ESB_TXN_C<1>
GND
GND
PE2_ESB_RXP_C<3>
GND
PE2_ESB_RXN_C<3>
PE2_ESB_TXP_C<0>
GND
PE2_ESB_TXN_C<0>
GND
GND
CLK_100M_LP_PCIE_SLOT3_P
GND
CLK_100M_LP_PCIE_SLOT3_N
PE_WAKE_N
P3V3
GND
P3V3
P3V3
P3V3
P3V3
P3V3
P3V3
P3V3
5.7.5
SATA Connectors
The server board provides six SATA (Serial ATA) connectors: SATA-0 (J1H1), SATA-1 (J1G2), SATA-2
(J1G1), SATA-3 (J1F2), SATA-4 (J1F1), and SATA-5 (J1E3), for use with an internal SATA backplane.
The pin configuration for each connector is identical and is defined in the following table.
Table 26. SATA Connector Pin-out (J1H1, J1G2, J1G1, J1F2, J1E3)
Pin
Signal Name
GND
Description
1
2
3
4
5
6
7
GND1
SATA#_TX_P_C
SATA#_TX_N_C
GND
Positive side of transmit differential pair
Negative side of transmit differential pair
GND2
SATA#_RX_N_C
SATA#_RX_P_C
GND
Negative side of Receive differential pair
Positive side of Receive differential pair
GND3
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5.7.6
Serial Port Connectors
The server board provides one external RJ45 Serial ‘B’ port (J9A2) and one internal 9-pin Serial ‘A’ port
header (J1B1). The following tables define the pin-outs for each.
Table 27. External RJ-45 Serial ‘B’ Port Pin-out (J9A2)
Pin
Signal Name
SPB_RTS
Description
RTS (request to send)
1
2
3
4
5
6
7
SPB_DTR
SPB_OUT_N
GND
DTR (Data terminal ready)
TXD (Transmit data)
Ground
SPB_RI
RI (Ring Indicate)
RXD (receive data)
SPB_SIN_N
SPB_DSR _DCD
1
Data Set Ready / Data Carrier Detect
CTS (clear to send)
8
SPB_CTS
Note:
1 A jumper block on the server board will determine whether DSR or DCD is routed to pin 7. The
board will have the jumper block configured with DSR enabled at production.
Table 28. Internal 9-pin Serial ‘A’ Header Pin-out (J1B1)
Pin
Signal Name
SPA_DCD
Description
DCD (carrier detect)
1
2
3
4
5
6
7
8
9
SPA_DSR
SPA_SIN_L
SPA_RTS
SPA_SOUT_N
SPA_CTS
SPA_DTR
SPA_RI
DSR (data set ready)
RXD (receive data)
RTS (request to send)
TXD (Transmit data)
CTS (clear to send)
DTR (Data terminal ready)
RI (Ring Indicate)
Ground
GND
5.7.7
Keyboard and Mouse Connector
Two stacked PS/2 ports (J9A1) are provided to support both a keyboard and a mouse. Either PS/2 port
can support a mouse or keyboard. The following table details the pin-out of the PS/2 connector.
Table 29. Stacked PS/2 Keyboard and Mouse Port Pin-out (J9A1)
Pin
1
Signal Name
KB_DATA_F
Description
Keyboard Data
2
3
4
5
6
7
8
9
TP_PS2_2
GND
Test point – keyboard
Ground
P5V_KB_F
KB_CLK_F
TP_PS2_6
MS_DAT_F
TP_PS2_8
GND
Keyboard / mouse power
Keyboard Clock
Test point – keyboard / mouse
Mouse Data
Test point – keyboard / mouse
Ground
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Connector / Header Locations and Pin-outs
Description
Pin
10
Signal Name
P5V_KB_F
Keyboard / mouse power
11
12
13
14
15
16
17
MS_CLK_F
TP_PS2_12
GND
Mouse Clock
Test point – keyboard / mouse
Ground
Ground
Ground
Ground
Ground
GND
GND
GND
GND
5.7.8
USB 2.0 Connectors
The following table details the pin-out of the external USB connectors (J5A1, J6A2) found on the back
edge of the server board.
Table 30. External USB Connector Pin-out (J5A1, J6A2)
Pin
Signal Name
Description
1
USB_OC#_FB_1
USB_PWR
2
3
4
USB_P#N_FB_2
USB_P#N_FB_2
GND
DATAL0 (Differential data line paired with DATAH0)
DATAH0 (Differential data line paired with DATAL0)
Ground
One 2x5 header on the server board (J1J1) provides an option to support an additional two USB 2.0 ports.
The pin-out of the connector is detailed in the following table.
Table 31. Internal USB Connector Pin-out (J1J1)
Pin
Signal Name
Description
1
2
3
4
5
6
7
8
9
P5V_USB2_VBUS0
USB Power (Ports 0,1)
P5V_USB2_VBUS1
USB Power (Ports 0,1)
USB_ESB_P0N_CONN USB Port 0 Negative Signal
USB_ESB_P1N_CONN USB Port 0 Positive Signal
USB_ESB_P0P_CONN USB Port 1 Negative Signal
USB_ESB_P1P_CONN USB Port 1 Positive Signal
Ground
Ground
--
No Pin
10
TP_USB_ESB_NC
TEST POINT
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5.8 Fan Headers
The server board incorporates three system fan circuits which support a total of six SSI compliant 4-pin
fan connectors. Two fan connectors are designated as processor cooling fans, CPU1 Fan (J9K1) and
CPU2 Fan (J5K1). These connectors can support CPU fans that draw a maximum of 1.2 Amps each.
Two system fan connectors can be found towards the front edge of the server board, System Fan 1
(J3K1), System Fan 2 (J3K2). These connectors are capable of supporting a maximum fan load of 3.5
Amps each. Two additional system fan connectors can be found near the back edge of the server board,
System Fan 3(J7A1) and System Fan 4 (J7A2). These two connectors are capable of supporting a
maximum fan load of 2.5 Amps per connector. With the proper Sensor Data Record (SDR) installed,
Server Management software can monitor all system fans in use.
The pin configuration for each fan connector is identical and is defined in the following table.
Table 32. SSI Fan Connector Pin-out (J9K1,J5K1,J3K1,J3K2,J7A2,J7A1)
Pin
Signal Name
Ground
Type
GND
Description
GROUND is the power supply ground
1
2
3
4
12V
Power
Out
In
Power supply 12V
Fan Tach
Fan PWM
FAN_TACH signal is connected to the BMC to monitor the fan speed
FAN_PWM signal to control fan speed
Note: Intel Corporation server baseboards support peripheral components and contain a number of high-
density VLSI and power delivery components that need adequate airflow to cool. Intel’s own chassis are
designed and tested to meet the intended thermal requirements of these components when the fully
integrated system is used together. It is the responsibility of the system integrator that chooses not to use
Intel developed server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental conditions. Intel
Corporation can not be held responsible if components fail or the server board does not operate correctly
when used outside any of their published operating or non-operating limits
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Jumper Block Settings
6. Jumper Block Settings
The server board has several 2-pin and 3-pin jumper blocks that can be used to configure, protect, or
recover specific features of the server board. Pin 1 on each jumper block is denoted by an “*” or “▼”.
6.1 Recovery Jumper Blocks
Table 33. Recovery Jumpers (J1D1, J1D2, J1D3)
Jumper Name
J1D1: BMC Force
Update
Pins
1-2
What happens at system reset…
BMC Firmware Force Update Mode – Disabled (Default)
2-3
1-2
2-3
BMC Firmware Force Update Mode – Enabled
J1D2: Password
Clear
These pins should have a jumper in place for normal system operation. (Default)
If these pins are jumpered, administrator and user passwords will be cleared
immediately. These pins should not be jumpered for normal operation.
J1D3: CMOS
Clear
These pins should have a jumper in place for normal system operation. (Default)
1-2
2-3
If these pins are jumpered, the CMOS settings will be cleared immediately. These pins
should not be jumpered for normal operation
BMC Force
Update Mode
Disable
Enable
2
2
3
Password
Reset
3
J1D2
J1D1
2
3
Clear
CMOS
J1D3
TP02080
Figure 17. Recovery Jumper Blocks (J1D1, J1D2, J1D3)
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Intel® Server Board S5000PAL / S5000XAL TPS
6.1.1
CMOS Clear and Password Reset Usage Procedure
The CMOS Clear (J1D3) and Password Reset (J1D2) recovery features are designed so that the desired
operation can be achieved with minimal system down time. The usage procedure for these two features
has changed from previous generation Intel® Server Boards. The following procedure outlines the new
usage model.
CMOS Clear Procedure:
1. Power down the server; do not remove AC power.
2. Open the server and move the jumper from the default operating position (pins1-2) to the “clear”
position (pins 2-3).
3. Wait 5 seconds.
4. Move the jumper back to the default position (pins 1-2).
5. Close the server system and power up the server.
6. CMOS is now cleared and can be reset by going into the BIOS setup.
Password Reset Procedure:
1. Power down the server; do not remove AC power.
2. Open the server and move the jumper from the default operating position (pins1-2) to the “reset”
position (pins 2-3).
3. Power up the server.
4. The password is now cleared.
5. Power down the server; do not remove AC power.
6. Move the jumper back to the default position (pins 1-2) and close the server system.
7. The password can be reset by going into the BIOS setup.
Note: Removing AC power before performing the CMOS clear operation will cause the system to
automatically power up and immediately power down, after the procedure is followed and AC power is re-
applied. Should this occur, remove the AC power cord again, wait 30 seconds, and re-install the AC
power cord. Power up system and proceed to the <F2> BIOS Setup Utility to reset desired settings.
6.1.2
BMC Force Update Procedure
When performing a standard BMC firmware update procedure, the update utility places the BMC into an
update mode, allowing the firmware to load safely onto the flash device. In the unlikely event that the
BMC firmware update process fails due to the BMC not being in the proper update state, the server board
provides a BMC Force Update jumper (J1D1) which will force the BMC into the proper update state. The
following procedure should be following in the event the standard BMC firmware update process fails.
•
•
Power down the server and remove AC power.
Open the server and move the jumper from the default operating position (pins1-2) to the
“enabled” position (pins 2-3).
•
•
Close the server system and reconnect AC power and power up the server.
Perform the standard BMC firmware update procedure as documented in README.TXT file that
is included in the given BMC Firmware Update package.
•
After successful completion of the firmware update process, the firmware update utility may
generate an error stating that the BMC is still in update mode.
•
•
Power down and remove AC power.
Open the server and move the jumper from the “enabled” position (pins 2-3) to the “disabled”
position (pins 1-2).
•
Close the server system and reconnect AC power and power up the server.
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Jumper Block Settings
Note: Normal BMC functionality is disabled with the force BMC update jumper set to the “enabled”
position. The server should never be run with the BMC force update jumper set in this position and should
only be used when the standard firmware update process fails. This jumper should remain in the default –
disabled position when the server is running normally.
6.2 BIOS Select Jumper
The jumper block at J3H1, located just to the left of the SSI control panel header, is used to select which
BIOS image the system will boot to. Pin 1 on the jumper is identified with a ‘▼’. This jumper should only
be moved if you wish to force the BIOS to boot to the secondary bank which may hold a different version
of BIOS.
The rolling BIOS feature of the baseboard will automatically alternate the Boot BIOS to the secondary
bank in the event the BIOS image in the primary bank is corrupted and cannot boot for any reason.
3
2
3
2
1-2: Force BIOS
to bank 0
2-3: System is
configured for
normal operation
(factory default)
J3H1
TP02305
Figure 18. BIOS Select Jumper (J3H1)
What happens at system reset…
Pins
1-2
2-3
Force BIOS to bank 0
System is configured for normal operation (Default)
Note: When performing a BIOS update procedure, the BIOS select jumper must be set to its default
position (pins 2-3).
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Jumper Block Settings
Intel® Server Board S5000PAL / S5000XAL TPS
6.3 External RJ45 Serial Port Jumper Block
The jumper block J8A3, located directly behind the external RJ45 serial port, is used to configure either a
DSR or a DCD signal to the connector.
J8A3
2
3
4
1-2: DCD to DTR
3-4: DSR to DTR
(factory default)
TP02303
Figure 19. External RJ45 Serial Port Configuration Jumper
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Light Guided Diagnostics
7. Light Guided Diagnostics
The server board has several on-board diagnostic LEDs to assist in troubleshooting board level issues.
This section shows where each LED is located and provides a high level usage description. For a more
detailed description of what drives the diagnostic LED operation, refer to the Intel® S5000 Series Chipsets
Server Board Family Datasheet.
7.1 5-Volt Standby LED
Several server management features of this server board require that a 5 volt stand-by voltage be
supplied from the power supply. Some of the features and components that require this voltage be
present when the system is “Off” include the BMC within the ESB-2, onboard NICs, and optional Intel®
RMM.
The LED located just below the system recovery jumper block labeled “5V STBY” is illuminated when AC
power is applied to the platform and 5 Volt standby voltage is supplied to the server board by the power
supply.
TP02307
Figure 20. 5V Standby Status LED Location
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Light Guided Diagnostics
Intel® Server Board S5000PAL / S5000XAL TPS
7.2 System ID LED and System Status LED
The server board provides LEDs for both System ID and System Status.
ID LED
Status LED
TP02309
Figure 21. System ID LED and System Status LED Locations.
The blue “System ID” LED can be illuminated using either of two mechanisms.
•
•
By pressing the System ID Button on the system control panel the ID LED will display a solid blue
color, until the button is pressed again.
By issuing the appropriate hex IPMI “Chassis Identify” value, the ID LED will either blink blue for
15 seconds and turn off or will blink indefinitely until the appropriate hex IPMI Chassis Identify
value is issued to turn it off.
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Light Guided Diagnostics
The bi-color System Status LED will operate as follows:
Color
Off
Green / Alternating
State
N/A
Criticality
Not ready
Not ready
Description
AC power off
Pre DC Power On – 15-20 second BMC Initialization when AC is
applied to the server. Control Panel buttons are disabled until BMC
initialization is complete.
Amber
Blink
Green
Green
Solid on
Blink
System OK
Degraded
System booted and ready.
System degraded
•
Unable to use all of the installed memory (more than one
DIMM installed).
•
Correctable errors over a threshold of 10 and migrating to a
spare DIMM (memory sparing). This indicates that the user
no longer has spared DIMMs indicating a redundancy lost
condition. Corresponding DIMM LED should light up.
In mirrored configuration, when memory mirroring takes
place and system loses memory redundancy. This is not
covered by (2).
•
•
Redundancy loss such as power-supply or fan. This does
not apply to non-redundant sub-systems.
•
•
PCI-e link errors
CPU failure / disabled – if there are two processors and one
of them fails
•
Fan alarm – Fan failure. Number of operational fans should
be more than minimum number needed to cool the system
Non-critical threshold crossed – Temperature and voltage
•
Amber
Amber
Blink
Non-critical
Non-fatal alarm – system is likely to fail
•
•
•
Critical voltage threshold crossed
VRD hot asserted
Minimum number of fans to cool the system not present or
failed
•
In non-sparing and non-mirroring mode if the threshold of
ten correctable errors is crossed within the window
Solid on
Critical, non-
recoverable
Fatal alarm – system has failed or shutdown
•
DIMM failure when there is one DIMM present, no good
memory present
•
Run-time memory uncorrectable error in non-redundant
mode
•
•
•
IERR signal asserted
Processor 1 missing
Temperature (CPU ThermTrip, memory TempHi, critical
threshold crossed)
•
•
No power good – power fault
Processor configuration error (for instance, processor
stepping mismatch)
7.2.1
System Status LED – BMC Initialization
When the AC power is first applied to the system and 5V-STBY is present, the BMC controller on the
server board requires 15-20 seconds to initialize. During this time, the system status LED will blink,
alternating between amber and green, and the power button functionality of the control panel is disabled
preventing the server from powering up. Once BMC initialization has completed, the status LED will stop
blinking and the power button functionality is restored and can be used to turn on the server.
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Intel® Server Board S5000PAL / S5000XAL TPS
7.3 DIMM Fault LEDs
The server board provides a memory fault LED for each DIMM slot. The DIMM fault LED is illuminated
when the system BIOS disables the specified DIMM after it reaches a specified number of given failures
or if specific critical DIMM failures are detected. See the Intel® S5000 Series Chipsets Server Board
Family Datasheet for more details.
TP02310
Figure 22. DIMM Fault LED Locations
7.4 Processor Fault LED
The server board provides a Processor Fault LED for each of the two processor sockets. These LEDs will
illuminate when a CPU is disabled or a CPU configuration error is detected.
CPU 2
CPU 1
TP02311
Figure 23. Processor Fault LED Location
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Light Guided Diagnostics
7.5 Post Code Diagnostic LEDs
During the system boot process, BIOS executes a number of platform configuration processes, each of
which is assigned a specific hex POST code number. As each configuration routine is started, BIOS will
display the given POST code to the POST code diagnostic LEDs found on the back edge of the server
board. To assist in troubleshooting a system hang during the POST process, the diagnostic LEDs can be
used to identify the last POST process to be executed. See Appendix C for a complete description of
how these LEDs are read, and for a list of all supported POST codes.
TP02312
Figure 24. POST Code Diagnostic LED Location
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Power and Environmental Specifications
Intel® Server Board S5000PAL / S5000XAL TPS
8. Power and Environmental Specifications
8.1 Intel® Server Board S5000PAL / S5000XAL Design Specifications
Operation of the server board at conditions beyond those shown in the following table may cause
permanent damage to the system. Exposure to absolute maximum rating conditions for extended periods
may affect system reliability.
Table 34: Server Board Design Specifications
Operating Temperature
Non-Operating Temperature
DC Voltage
0º C to 55º C 1 (32º F to 131º F)
-40º C to 70º C (-40º F to 158º F)
± 5% of all nominal voltages
Shock (Unpackaged)
Shock (Packaged)
Trapezoidal, 50 g, 170 inches/sec
< 20 lbs 36 inches
≥ 20 to < 40 30 inches
≥ 40 to < 80 24 inches
≥ 80 to < 100 18 inches
≥100 to < 120 12 inches
≥120 9 inches
Vibration (Unpackaged)
5 Hz to 500 Hz 3.13 g RMS random
Note:
1 Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel® Xeon®
processor 5000 sequence maximum case temperature.
Disclaimer Note: Intel Corporation server boards support add-in peripherals and contain a number of
high-density VLSI and power delivery components that need adequate airflow to cool. Intel ensures
through its own chassis development and testing that when Intel server building blocks are used together,
the fully integrated system will meet the intended thermal requirements of these components. It is the
responsibility of the system integrator who chooses not to use Intel developed server building blocks to
consult vendor datasheets and operating parameters to determine the amount of air flow required for their
specific application and environmental conditions. Intel Corporation cannot be held responsible, if
components fail or the server board does not operate correctly when used outside any of their published
operating or non-operating limits.
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Power and Environmental Specifications
8.2 Server Board Power Requirements
This section provides power supply design guidelines for a system using the Intel® Server Board
S5000PAL / S5000XAL, including voltage and current specifications, and power supply on/off sequencing
characteristics. The following diagram shows the power distribution implemented on this server board.
Figure 25. Power Distribution Block Diagram
8.2.1
Processor Power Support
The server board supports the Thermal Design Point (TDP) guideline for Dual-Core Intel® Xeon®
processors 5000 sequence. The Flexible Motherboard Guidelines (FMB) has also been followed to help
determine the suggested thermal and current design values for anticipating future processor needs. The
following table provides maximum values for Icc, TDP power and T
processor 5000 sequence family.
for the Dual-Core Intel® Xeon®
CASE
Table 35. Dual-Core Intel® Xeon® Processor 5000 Sequence TDP Guidelines per processor
TDP Power
Max TCASE
Icc MAX
130 W
70º C
150 A
Note: These values are for reference only. The Dual-Core Intel® Xeon® processor 5000 sequence
Datasheet contains the actual specifications for the processor. If the values found in the Dual-Core Intel®
Xeon® processor 5000 sequence Datasheet are different than those published here, the Dual-Core Intel®
Xeon® processor 5000 sequence Datasheet values will supersede these, and should be used.
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8.2.2
Power Supply Output Requirements
This section is for reference purposes only. Its intent is to provide guidance to system designers for
determining a proper power supply for use with this server board. The contents of this section specify the
power supply requirements Intel used to develop a power supply for its 1U server platform.
The combined power of all outputs shall not exceed the rated output power of the power supply. The
power supply must meet both static and dynamic voltage regulation requirements for the minimum
loading conditions.
Table 36. 600W Load Ratings
Voltage
Minimum
Continuous
1.5 A
Maximum
Continuous
10 A
Peak
+3.3 V
+5 V
1.0 A
20 A
+12 V1
+12 V2
+12 V3
+12 V4
-12 V
0.5 A
0.5 A
0.5 A
0.5 A
16 A
16 A
16 A
16 A
18 A
18 A
0 A
0.5 A
+5 VSB
0.1 A
3.0 A
3.5 A
1. Maximum continuous total DC output power should not exceed 600W.
2. Peak load on the combined 12 V output shall not exceed 49A.
3. Maximum continuous load on the combined 12 V output shall not exceed 44A.
4. Peak total DC output power should not exceed 650W.
5. Peak power and current loading shall be supported for a minimum of 12 seconds.
6. Combined 3.3V and 5V power shall not exceed 100W.
8.2.3 Turn On No Load Operation
At power on the system shall present a no load condition to the power supply. In this no load state the
voltage regulation limits for the 3.3V and 5V are relaxed to +/-10% and the +12V rails relaxed to +10/-8%.
When operating loads are applied the voltages must regulated to there normal limits.
Table 37: No load operating range
Voltage
Minimum
Continuous
0 A
Maximum
Continuous
7 A
Peak
+3.3 V
+5 V
0 A
5 A
+12 V1
+12 V2
+12 V3
+12 V4
-12 V
0 A
0 A
0 A
0 A
0 A
0.1 A
5 A
5 A
6 A
5 A
0.5 A
3.0 A
7 A
7 A
+5 VSB
3.5 A
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Power and Environmental Specifications
8.2.4
Grounding
The grounds of the pins of the power supply output connector provide the power return path. The output
connector ground pins shall be connected to safety ground (power supply enclosure). This grounding
should be well designed to ensure passing the maximum allowed Common Mode Noise levels.
The power supply shall be provided with a reliable protective earth ground. All secondary circuits shall be
connected to protective earth ground. Resistance of the ground returns to chassis shall not exceed 1.0
mΩ. This path may be used to carry DC current.
8.2.5
Standby Outputs
The 5VSB output shall be present when an AC input greater than the power supply turn on voltage is
applied.
8.2.6
Remote Sense
The power supply has remote sense return (ReturnS) to regulate out ground drops for all output voltages:
+3.3V, +5V, +12V1, +12V2, +12V3, -12V, and 5VSB. The power supply uses remote sense (3.3VS) to
regulate out drops in the system for the +3.3V output. The +5V, +12V1, +12V2, +12V3, –12V and 5VSB
outputs only use remote sense referenced to the ReturnS signal. The remote sense input impedance to
the power supply must be greater than 200 Ω on 3.3VS and 5VS; this is the value of the resistor
connecting the remote sense to the output voltage internal to the power supply. Remote sense must be
able to regulate out a minimum of a 200 mV drop on the +3.3V output. The remote sense return
(ReturnS) must be able to regulate out a minimum of a 200 mV drop in the power ground return. The
current in any remote sense line shall be less than 5 mA to prevent voltage sensing errors. The power
supply must operate within specification over the full range of voltage drops from the power supply’s
output connector to the remote sense points.
8.2.7
Voltage Regulation
The power supply output voltages must stay within the following voltage limits when operating at steady
state and dynamic loading conditions. These limits include the peak-peak ripple/noise.
Table 38. Voltage Regulation Limits
PARAMETER
+ 3.3V
+ 5V
+ 12V1,2,3,4
- 12V
TOLERANCE
- 5% / +5%
- 5% / +5%
- 5% / +5%
- 5% / +9%
- 5% / +5%
MIN
+3.14
+4.75
+11.40
-10.80
+4.75
NOM
+3.30
+5.00
+12.00
-12.00
+5.00
MAX
+3.46
+5.25
+12.60
-13.20
+5.25
UNITS
Vrms
Vrms
Vrms
Vrms
+ 5VSB
Vrms
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8.2.8
Dynamic Loading
The output voltages shall remain within limits for the step loading and capacitive loading specified in the
table below. The load transient repetition rate shall be tested between 50 Hz and 5 kHz at duty cycles
ranging from 10%-90%. The load transient repetition rate is only a test specification. The Δ step load
may occur anywhere within the MIN load to the MAX load conditions.
Table 39. Transient Load Requirements
Output
Load Slew Rate
Test capacitive Load
Δ Step Load Size
(See note 2)
+3.3V
+5V
5.0A
0.25 A/μsec
0.25 A/μsec
0.25 A/μsec
250 μF
6.0A
400 μF
2200 μF 1,2
12V1+12V2+12V3+12
V4
28.0A
+5VSB
0.5A
0.25 A/μsec
20 μF
Notes:
1) Step loads on each 12V output may happen simultaneously.
2) The +12V should be tested with 2200μF evenly split between the four +12V rails.
8.2.9
Capacitive Loading
The power supply shall be stable and meet all requirements with the following capacitive loading ranges.
Table 40. Capacitive Loading Conditions
Output
+3.3V
MIN
250
MAX
6,800
4,700
11,000
Units
μF
μF
+5V
400
+12V1,2,3,4
500 each
μF
-12V
1
350
350
μF
μF
+5VSB
20
8.2.10
Closed-Loop Stability
The power supply shall be unconditionally stable under all line/load/transient load conditions including
capacitive load ranges. A minimum of: 45 degrees phase margin and -10dB-gain margin is required.
Closed-loop stability must be ensured at the maximum and minimum loads as applicable.
8.2.11
Common Mode Noise
The common mode noise on any output shall not exceed 350 mV pk-pk over the frequency band of 10Hz
to 30MHz.
1. The measurement shall be made across a 100 Ω resistor between each of the DC outputs,
including ground, at the DC power connector and chassis ground (power subsystem enclosure).
2. The test set-up shall use an FET probe such as Tektronix* model P6046 or equivalent.
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Power and Environmental Specifications
8.2.12
Ripple / Noise
The maximum allowed ripple/noise output of the power supply is defined in the following table. This is
measured over a bandwidth of 0Hz to 20MHz at the power supply output connectors. A 10 μF tantalum
capacitor in parallel with a 0.1 μF ceramic capacitor are placed at the point of measurement.
Table 41. Ripple and Noise
+3.3V
50mVp-p
+5V
50mVp-p
+12V1/2/3/4
120mVp-p
-12V
120mVp-p
+5VSB
50mVp-p
8.2.13
Soft Starting
The power supply shall contain a control circuit which provides a monotonic soft start for its outputs
without overstress of the AC line or any power supply components at any specified AC line or load
conditions. There is no requirement for rise time on the 5 V standby, but the turn on/off shall be
monotonic.
8.2.14
Timing Requirements
These are the timing requirements for the power supply operation. The output voltages must rise from
10% to within regulation limits (Tvout_rise) within 5 to 70 ms, except for 5VSB; it is allowed to rise from 1.0 to
25 ms. All outputs must rise monotonically. Each output voltage shall reach regulation within 50 ms
(Tvout_on) of each other during turn on of the power supply. Each output voltage shall fall out of regulation
within 400 msec (Tvout_off) of each other during turn off. The following diagrams show the timing
requirements for the power supply being turned on and off via the AC input with PSON held low, and the
PSON signal with the AC input applied.
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Table 42. Output Voltage Timing
Item
Tvout_rise
Tvout_on
Description
Output voltage rise time from each main output.
All main outputs must be within regulation of each
other within this time.
MIN
MAX
UNITS
msec
msec
5.0 *
70 1
50
Tvout_off
All main outputs must leave regulation within this
time.
400
msec
1 The 5VSB output voltage rise time shall be from 1.0ms to 25.0ms
V out
10% V out
V1
V2
V3
V4
T
vout_off
T
vout_rise
T
vout_on
TP02313
Figure 26. Output Voltage Timing
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Table 43. Turn On/Off Timing
Item
Tsb_on_delay
Tac_on_delay
Description
MIN
MAX
1500
UNITS
msec
Delay from AC being applied to 5VSB being within regulation.
Delay from AC being applied to all output voltages being within
regulation.
Time all output voltages stay within regulation after loss of AC.
Measured at 60% of maximum load.
msec
msec
msec
msec
2500
Tvout_holdup
Tpwok_holdup
Tpson_on_delay
21
20
5
Delay from loss of AC to de-assertion of PWOK. Measured at
60% of maximum load.
Delay from PSON# active to output voltages within regulation
limits.
400
50
Tpson_pwok
Tpwok_on
Delay from PSON# de-active to PWOK being de-asserted.
msec
msec
Delay from output voltages within regulation limits to PWOK
asserted at turn on.
Delay from PWOK de-asserted to output voltages (3.3V, 5V,
12V, -12V) dropping out of regulation limits.
Duration of PWOK being in the de-asserted state during an
off/on cycle using AC or the PSON signal.
Delay from 5VSB being in regulation to O/Ps being in
regulation at AC turn on.
100
1
500
Tpwok_off
msec
msec
msec
msec
Tpwok_low
Tsb_vout
100
50
70
1000
T5VSB_holdup
Time the 5VSB output voltage stays within regulation after loss
of AC.
AC Input
T
vout_holdup
V out
T
pwok_low
T
AC_on_delay
T
T
sb_on_delay
T
T
T
T
pwok_on
pwok_off
pwok_on
pwok_off
sb_on_delay
T
PWOK
5 VSB
PSON
pson_pwok
T
pwok_holdup
T
5VSB_holdup
T
sb_vout
T
pson_on_delay
AC turn on/off cycle
PSON turn on/off cycle
TP02314
Figure 27. Turn On/Off Timing (Power Supply Signals)
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8.2.15
Residual Voltage Immunity in Standby Mode
The power supply shall be immune to any residual voltage placed on its outputs (typically a leakage
voltage through the system from standby output) up to 500 mV. There shall be no additional heat
generated, nor stress of any internal components with this voltage applied to any individual output, and all
outputs simultaneously. It also should not trip the power supply protection circuits during turn on.
Residual voltage at the power supply outputs for a no load condition shall not exceed 100 mV when AC
voltage is applied and the PSON# signal is de-asserted.
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Regulatory and Certification Information
9. Regulatory and Certification Information
9.1 Product Regulatory Compliance
Intended Application – This product was evaluated as Information Technology Equipment (ITE), which
may be installed in offices, schools, computer rooms, and similar commercial type locations. The
suitability of this product for other product categories and environments (such as: medical, industrial,
telecommunications, NEBS, residential, alarm systems, test equipment, etc.), other than an ITE
application, may require further evaluation. This is an FCC Class A device. Integration of it into a Class B
chassis does not result in a Class B device.
The following table references Server Board Compliance and markings that may appear on the
product. Markings below are typical markings however, may vary or be different based on how
certification is obtained.
Note: Certifications Emissions requirements are to Class A
9.1.1
Product Safety & Electromagnetic (EMC) Compliance
Compliance Regional
Description
Compliance
Reference
Compliance Reference Marking
Example
Australia / New Zealand AS/NZS 3548 (Emissions)
N232
Canada / USA
CSA 60950 – UL 60950
(Safety)
Industry Canada ICES-003
(Emissions)
CANADA ICES-003 CLASS A
CANADA NMB-003 CLASSE A
CENELEC Europe
Low Voltage Directive 93/68/EEC;
EMC Directive 89/336/EEC
EN55022 (Emissions)
EN55024 (Immunity)
CE Declaration of Conformity
CB Certification – IEC60950
CISPR 22 / CISPR 24
International
Korea
None Required
RRL Certification
MIC Notice No. 1997-41 (EMC)
& 1997-42 (EMI)
인증번호: CPU-Model Name (A)
Taiwan
BSMI CNS13438
D33025
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9.2 Electromagnetic Compatibility Notices
9.2.1
FCC Verification Statement (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
Phone: 1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant
to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses, and can radiate radio frequency
energy and, if not installed and used in accordance with the instructions, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur in a particular
installation. If this equipment does cause harmful interference to radio or television reception, which can
be determined by turning the equipment off and on, the user is encouraged to try to correct the
interference by one or more of the following measures:
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and the receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
•
Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications not expressly approved by the grantee of this device could void the user’s
authority to operate the equipment. The customer is responsible for ensuring compliance of the modified
product.
All cables used to connect to peripherals must be shielded and grounded. Operation with cables,
connected to peripherals that are not shielded and grounded may result in interference to radio and TV
reception.
9.2.2
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux
appareils numériques de Classe B prescrites dans la norme sur le matériel brouilleur:
“Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des Communications.
English translation of the notice above:
This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus
set out in the interference-causing equipment standard entitled “Digital Apparatus,” ICES-003 of the
Canadian Department of Communications.
9.2.3
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark to
illustrate its compliance.
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Regulatory and Certification Information
9.2.4
BSMI (Taiwan)
The BSMI Certification Marking and EMC warning is located on the outside rear area of the product.
9.2.5
RRL (Korea)
Following is the RRL certification information for Korea.
English translation of the notice above:
1. Type of Equipment (Model Name): On License and Product
2. Certification No.: On RRL certificate. Obtain certificate from local Intel representative
3. Name of Certification Recipient: Intel Corporation
4. Date of Manufacturer: Refer to date code on product
5. Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
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9.3 Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world wide
product ecology regulatory requirements. The following is Intel’s product ecology compliance criteria.
Compliance Regional
Description
Compliance Reference
Marking Example
Compliance Reference
California
California Code of Regulations, Title 22, Division 4.5;
Chapter 33: Best Management Practices for
Perchlorate Materials.
Special handling may
apply. See
www.dtsc.ca.gov/hazar
douswaste/perchlorate
This notice is required by
California Code of
Regulations, Title 22,
Division 4.5; Chapter 33:
Best Management
Practices for Perchlorate
Materials. This product /
part include a battery
which contains
Perchlorate material.
China
China RoHS
Administrative Measures on the Control of Pollution
Caused by Electronic Information Products” (EIP) #39.
Referred to as China RoHS.
Mark requires to be applied to retail products only.
Mark used is the Environmental Friendly Use Period
(EFUP). Number represents years.
China Recycling (GB18455-2001)
Mark requires to be applied to be retail product only.
Marking applied to bulk packaging and single
packages. Not applied to internal packaging such as
plastics, foams, etc.
Intel Internal
Specification
All materials, parts and subassemblies must not
contain restricted materials as defined in Intel’s
Environmental Product Content Specification of
Suppliers and Outsourced Manufacturers –
None Required
http://supplier.intel.com/ehs/environmental.htm
Europe
European Directive 2002/95/EC -
Restriction of Hazardous Substances (RoHS)
Threshold limits and banned substances are
noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
Lead, Mercury, Hexavalent Chromium,
Polybrominated Biphenyls Diphenyl Ethers
(PBB/PBDE)
None Required
Quantity limit of 0.01% by mass (100 PPM) for:
Cadmium
Germany
German Green Dot
Applied to Retail Packaging Only for Boxed Boards
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Compliance Regional
Regulatory and Certification Information
Compliance Reference
Marking Example
Compliance Reference
Description
Intel Internal
All materials, parts and subassemblies must not
Specification
contain restricted materials as defined in Intel’s
Environmental Product Content Specification of
Suppliers and Outsourced Manufacturers –
None Required
>PC/ABS<
http://supplier.intel.com/ehs/environmental.htm
International
ISO11469 - Plastic parts weighing >25gm are
intended to be marked with per ISO11469.
Recycling Markings – Fiberboard (FB) and Cardboard
(CB) are marked with international recycling marks.
Applied to outer bulk packaging and single package.
Japan
Japan Recycling
Applied to Retail Packaging Only for Boxed Boards
9.4 Other Markings
Compliance
Description
Compliance Reference
Marking Example
Compliance Reference
Country of Origin
Logistic Requirements
Applied to products to indicate where product was
made.
Made in XXXX
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Appendix A: Integration and Usage Tips
Intel® Server Board S5000PAL TPS
Appendix A: Integration and Usage Tips
ƒ
ƒ
When adding or removing components or peripherals from the server board, AC power must be
removed. With AC power plugged into the server board, 5-volt standby is still present even
though the server board is powered off.
When two processors are installed, both must be of identical revision, core voltage, and bus/core
speed. Mixed processor steppings is supported. However, the stepping of one processor can not
greater then one stepping back of the other.
ƒ
ƒ
Processors must be installed in order. CPU 1 is located near the edge of the server board and
must be populated to operate the board.
On the back edge of the server board are four diagnostic LEDs which display a sequence of red,
green, or amber POST codes during the boot process. If the server board hangs during POST,
the LEDs will display the last POST event run before the hang.
ƒ
Only Fully Buffered DIMMs (FBD) are supported on this server board. For a list of supported
memory for this server board, see the Intel® Server Board S5000PAL / S5000XAL Tested
Memory List.
ƒ
ƒ
For a list of Intel supported operating systems, add-in cards, and peripherals for this server board,
see the Intel® Server Board S5000PAL / S5000XAL Tested Hardware and OS List.
Only Dual-Core Intel® Xeon® processors 5000 sequence, with system bus speeds of
667/1066/1333 MHz are supported on this server board. Previous generation Intel® Xeon®
processors are not supported.
ƒ
For best performance, the number of DIMMs installed should be balanced across both memory
branches. For example: a four DIMM configuration will perform better than a two DIMM
configuration and should be installed in DIMM Slots A1, B1, C1, and D1. An eight DIMM
configuration will perform better then a six DIMM configuration.
ƒ
ƒ
ƒ
ƒ
ƒ
There are no population rules for installing a single low profile add-in card in the 2U LP riser card;
a single add in card can be installed in either PCI Express* slot. While each slot can
accommodate a x8 card, each slot will only support x4 bus speeds.
For the 2U PCI-X* (passive) riser card, add-in cards should be installed starting with the top slot
first, followed by the middle, and then the bottom. Any add-in card populated in the bottom PCI
slot will cause the bus to operate at 66MHz.
Each PCI slot on the 2U PCI-X* (active) riser card operates on an independent PCI bus.
Therefore, using an add-in card that operates below 133MHz will not affect the bus speed of the
other PCI slots.
The IDE connector on this server board is NOT a standard 40-pin IDE connector. Instead, this
connector has an additional 4 power pins over and above the standard 40 I/O pins. The design
intent of this connector is to provide support for a slim-line optical drive only.
Removing AC Power before performing the CMOS clear operation will cause the system to
automatically power up and immediately power down after the procedure is followed and AC
power is re-applied. Should this occur, remove the AC power cord again, wait 30 seconds, and
re-install the AC power cord. Power up system and proceed to the <F2> BIOS setup utility to
reset desired settings.
ƒ
Normal BMC functionality is disabled with the force BMC update jumper set to the “enabled”
position (pins 2-3). The server should never be run with the BMC force update jumper set in this
position and should only be used when the standard firmware update process fails. This jumper
should remain in the default (disabled) position (pins 1-2) when the server is running normally.
ƒ
ƒ
When performing a BIOS update procedure, the BIOS select jumper must be set to its default
position (pins 2-3).
When AC power is applied to the server, a 25-30 second delay is necessary to initialize the BMC.
During this initialization period, the Power Button functionality is disabled.
84
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Appendix B: Sensor Tables
Appendix B: BMC Sensor Tables
This appendix lists the sensor identification numbers and information regarding the sensor type, name,
supported thresholds, assertion and de-assertion information, and a brief description of the sensor
purpose. See the Intelligent Platform Management Interface Specification, Version 1.5, for sensor and
event/reading-type table information.
ƒ
ƒ
ƒ
Sensor Type
The Sensor Type references the values enumerated in the Sensor Type Codes table in the IPMI
specification. It provides the context in which to interpret the sensor, e.g., the physical entity or
characteristic that is represented by this sensor.
Event / Reading Type
The Event/Reading Type references values from the Event/Reading Type Code Ranges and
Generic Event/Reading Type Codes tables in the IPMI specification. Note that digital sensors are
a specific type of discrete sensors, which have only two states.
Event Offset/Triggers
Event Thresholds are ‘supported event generating thresholds’ for threshold types of sensors.
o
o
[u,l][nr,c,nc]: upper non-recoverable, upper critical, upper non-critical, lower non-recoverable,
lower critical, lower non-critical
uc, lc: upper critical, lower critical
Event Triggers are ‘supported event generating offsets’ for discrete type sensors. The offsets can
be found in the Generic Event/Reading Type Codes or Sensor Type Codes tables in the IPMI
specification, depending on whether the sensor event/reading type is generic or a sensor specific
response.
ƒ
ƒ
Assertion / De-assertion Enables
Assertion and de-assertion indicators reveal the type of events the sensor can generate:
o
o
As: Assertions
De: De-assertion
Readable Value / Offsets
o
Readable Value indicates the type of value returned for threshold and other non-discrete type
sensors.
o
Readable Offsets indicate the offsets for discrete sensors that are readable via the Get
Sensor Reading command. Unless otherwise indicated, all event triggers are readable, i.e.,
Readable Offsets consists of the reading type offsets that do not generate events.
ƒ
Event Data
This is the data that is included in an event message generated by the associated sensor. For
threshold-based sensors, the following abbreviations are used:
o
o
R: Reading value
T: Threshold value
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
ƒ
Rearm Sensors
-
The rearm is a request for the event status for a sensor to be rechecked and updated upon a
transition between good and bad states. Rearming the sensors can be done manually or
automatically. This column indicates the type supported by the sensor. The following
abbreviations are used in the comment column to describe a sensor:
A: Auto-rearm
M: Manual rearm
ƒ
ƒ
ƒ
Default Hysteresis
-
Hysteresis setting applies to all thresholds of the sensor. This column provides the count of
hysteresis for the sensor, which can be 1 or 2 (positive or negative Hysteresis).
Criticality
Criticality is a classification of the severity and nature of the condition. It also controls the
behavior of the Control Panel Status LED.
Standby
Some sensors operate on standby power. These sensors may be accessed and / or
-
-
generate events when the main (system) power is off, but AC power is present.
86
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Intel® Server Board S5000PAL / S5000XAL TPS
Appendix B: Sensor Tables
Table 44. BMC Sensors
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Power Unit 01h
Status
All
Power Unit
09h
Sensor
Specific
Power down
Power cycle
A/C lost
OK
As
–
Trig Offset
A
X
6Fh
Soft power
Critical
control failure
Power unit
failure
Predictive
failure
Non-Critical
OK
Power Unit 02h
Redun-
dancy
Chassis-
specific
Power Unit
09h
Generic
0Bh
Redundancy
regained
As
–
Trig Offset
A
X
Non-red: suff
res from redund
Redundancy
lost
Degraded
Redundancy
degraded
Non-red: suff
from insuff
OK
Non-red:
Critical
insufficient
Redun degrade OK
from full
Redun degrade
from non-
redundant
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Watchdog 03h
All
Watchdog 2
23h
Sensor
Specific
Timer expired,
status only
OK
As
–
Trig Offset
A
X
6Fh
Hard reset
Power down
Power cycle
Timer interrupt
Platform
Security
Violation
04h
All
Platform
Security
Violation
Attempt
Sensor
Specific
Secure mode
violation
attempt
OK
OK
As
–
Trig Offset
A
X
6Fh
Out-of-band
access
password
violation
06h
Physical
Security
05h
07h
Chassis
Intrusion
is chassis-
specific
Physical
Security
Sensor
Specific
Chassis
intrusion
As and De
–
–
Trig Offset
Trig Offset
A
A
X
–
05h
6Fh
LAN leash lost
1
FP Diag
Interrupt
(NMI)
All
Critical
Interrupt
Sensor
Specific
Front panel NMI OK
/ diagnostic
interrupt
As
13h
6Fh
Bus
uncorrectable
error
System
Event Log
09h
0Ah
All
All
Event
Logging
Disabled
Sensor
Specific
Log area reset / OK
cleared
As
As
–
–
Trig Offset
A
A
X
X
6Fh
10h
Session
Audit
Session Audit Sensor
00h – Session
activation
OK
As defined
by IPMI
Specific
2Ah
6Fh
01h – Session
deactivation
88
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Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
System
Event
('System
Event')
0Bh
All
System Event Sensor
00 – System
reconfigured
OK
As
–
Trig Offset
A
X
Specific
12h
6Fh
04 – PEF action
BB +1.2V
Vtt
10h
11h
12h
13h
14h
15h
16h
17h
18h
19h
1Ah
1Bh
1Eh
All
All
All
All
All
All
All
All
All
All
All
All
All
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
R, T
A
A
A
A
A
A
A
A
A
A
A
A
A
–
01h
BB+1.9V
NIC Core
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
X
01h
BB +1.5V
AUX
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
–
–
–
–
X
X
–
–
–
–
X
01h
BB +1.5V
BB +1.8V
BB +3.3V
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB +3.3V
STB
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB +1.5V
ESB
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB +5V
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB +1.2V
NIC
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB +12V
AUX
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
01h
BB 0.9V
Voltage
02h
Threshold [u,l] [c,nc]
01h
Threshold
defined
BB Vbat
Voltage
02h
Digital
Discrete
01h – Limit
exceeded
Critical
As and De
–
05h
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
BB Temp
30h
All
Temperature Threshold [u,l] [c,nc]
01h 01h
Temperature Threshold [u,l] [c,nc]
01h 01h
Threshold
defined
As and De Analog
R, T
R, T
A
A
X
X
Front
Panel
Temp
32h
All
Threshold
defined
As and De Analog
BNB Temp 33h
All
Temperature Threshold [u,l] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
R, T
R, T
R, T
R, T
R, T
R, T
R, T
A
–
–
–
–
–
–
–
01h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
01h
Fan 1A
Fan 2A
Fan 3A
Fan 4A
Fan 5A
50h
51h
52h
53h
54h
55h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
M
M
M
M
M
M
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Tach Fan
(not used
on this
Chassis-
specific
Threshold [l] [c,nc]
01h
Threshold
defined
server)
Fan 1B
Fan 2B
Fan 3B
Fan 4B
Fan 5B
56h
57h
58h
59h
5Ah
Chassis-
specific
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Threshold [l] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
As and De Analog
As and De Analog
As and De Analog
R, T
R, T
R, T
R, T
R, T
M
M
M
M
M
–
–
–
–
–
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
Threshold
defined
01h
Chassis-
specific
Threshold [l] [c,nc]
01h
Threshold
defined
90
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Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Fan 1
Present
60h
61h
62h
63h
64h
65h
66h
67h
68h
69h
6Fh
Chassis-
specific
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Fan
04h
Generic
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
Device present OK
As and De
As and De
As and De
As and De
As and De
As and De
As and De
As and De
As and De
As and De
As
–
–
–
–
–
–
–
–
–
–
–
T
A
A
A
–
–
–
–
–
–
–
–
–
–
X
08h
Fan 2
Present
Chassis-
specific
Generic
08h
T
Fan 3
Present
Chassis-
specific
Generic
08h
T
Fan 4
Present
Chassis-
specific
Generic
08h
T
A
Fan 5
Present
Chassis-
specific
Generic
08h
T
A
A
A
A
A
A
A
Fan 6
Present
Chassis-
specific
Generic
08h
T
Fan 7
Present
Chassis-
specific
Generic
08h
T
Fan 8
Present
Chassis-
specific
Generic
08h
T
Fan 9
Present
Chassis-
specific
Generic
08h
T
Fan 10
Present
Chassis-
specific
Generic
08h
T
Fan
Redun-
dancy
Chassis-
specific
Generic
0Bh
Redundancy
regained
OK
Trig Offset
Redundancy
lost
Degraded
Redundancy
degraded
Non-red: suff
OK
res from redund
Non-red: suff
from insuff
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Non-red:
Critical
insufficient
Redun degrade OK
from full
Redun degrade
from non-
redundant
Power
Supply
Status 1
70h
71h
Chassis-
specific
Power Supply Sensor
Presence
Failure
OK
As and De
–
–
Trig Offset
Trig Offset
A
A
X
X
Specific
08h
Critical
6Fh
Predictive fail
A/C lost
Non-Critical
Critical
Configuration
error
Non-Critical
Power
Supply
Status 2
Chassis-
specific
Power Supply Sensor
Presence
Failure
OK
As and De
Specific
08h
Critical
6Fh
Predictive fail
A/C lost
Non-Critical
Critical
Configuration
error
Non-Critical
Power
Nozzle
78h
79h
7Ah
Chassis-
specific
Current
03h
Threshold [u] [c,nc]
01h
Threshold
defined
As and De Analog
As and De Analog
As and De Analog
R, T
R, T
R, T
A
A
A
–
–
–
Power
Supply 1
Power
Nozzle
Chassis-
specific
Current
03h
Threshold [u] [c,nc]
01h
Threshold
defined
Power
Supply 2
Power
Gauge
V1 rail
(+12v)
Chassis-
specific
Current
03h
Threshold [u] [c,nc]
01h
Threshold
defined
Power
Supply 1
92
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Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Power
7Bh
Chassis-
specific
Current
03h
Threshold [u] [c,nc]
Threshold
defined
As and De Analog
R, T
A
–
Gauge
V1 rail
(+12v)
01h
Power
Supply 2
Power
Gauge
(aggre-
gate
7Ch
Chassis-
specific
Other Units
0Bh
Threshold [u] [c,nc]
01h
Threshold
defined
As and De Analog
R, T
A
–
power)
Power
Supply 1
Power
Gauge
(aggregate
power)
7Dh
82h
Chassis-
specific
Other Units
0Bh
Threshold [u] [c,nc]
01h
Threshold
defined
As and De Analog
R, T
A
A
–
Power
Supply 2
System
ACPI
Power
State
All
System ACPI Sensor
Power State
S0 / G0
S1
OK
As
–
Trig Offset
X
Specific
22h
6Fh
S3
S4
S5 / G2
G3 mechanical
off
Button
84h
85h
All
All
Button
14h
Sensor
Specific
Power button
Reset button
OK
As
–
–
Trig Offset
Trig Offset
A
A
X
–
6Fh
SMI
Timeout
SMI Timeout Digital
01h – State
asserted
Critical
As and De
Discrete
F3h
03h
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
OEM
Sensor
Specific
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Sensor
Failure
86h
All
Sensor
Failure
I2C device not
found
I2C device error
detected
I2C bus timeout
OK
As
–
Trig Offset
A
X
F6h
73h
NMI Signal 87h
State
All
All
All
OEM
C0h
Digital
Discrete
01h – State
asserted
OK
OK
–
–
01h
01h
–
–
–
–
–
–
03h
SMI Signal 88h
State
OEM
C0h
Digital
Discrete
01h – State
asserted
03h
Proc 1
Status
90h
91h
Processor
07h
Sensor
Specific
IERR
Critical
Non-rec
Critical
OK
As and De
–
–
Trig Offset
M
M
X
Thermal trip
Config error
Presence
Disabled
6Fh
Degraded
Proc 2
Status
All
Processor
07h
Sensor
Specific
IERR
Critical
Non-rec
Critical
OK
As and De
Trig Offset
X
Thermal trip
Config error
Presence
Disabled
6Fh
Degraded
Proc 1
Temp
98h
9Ah
All
All
Temperature Threshold [u,l] [c,nc]
01h 01h
Temperature Threshold [u,l] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
R, T
R, T
A
A
A
–
–
–
Proc 2
Temp
Threshold
defined
01h
01h
PCIe Link0 A0h
Critical
Interrupt
Sensor
Specific
PCIe
Link0
Bus correctable OK
error
As
–
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
94
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Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
PCIe Link1 A1h
PCIe Link2 A2h
PCIe Link3 A3h
PCIe Link4 A4h
PCIe Link5 A5h
PCIe Link6 A6h
PCIe Link7 A7h
Critical
Interrupt
Sensor
Specific
PCIe
Link1
Bus correctable OK
error
As
–
–
–
–
–
–
–
See the
BIOS EPS
A
A
A
A
A
A
A
–
–
–
–
–
–
–
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link2
Bus correctable OK
error
As
As
As
As
As
As
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link3
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link4
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link5
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link6
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link7
Bus correctable OK
error
See the
BIOS EPS
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
bility
13F
6Fh
Bus
Degraded
uncorrectable
error
PCIe Link8 A8h
PCIe Link9 A9h
Critical
Interrupt
Sensor
Specific
PCIe
Link8
Bus correctable OK
error
As
–
–
–
–
–
–
See the
BIOS EPS
A
A
A
A
A
A
–
–
–
–
–
–
13F
6Fh
Bus
Degraded
uncorrectable
error
Critical
Interrupt
Sensor
Specific
PCIe
Link9
Bus correctable OK
error
As
As
As
As
As
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
PCIe
Link10
AAh
ABh
ACh
ADh
Critical
Interrupt
Sensor
Specific
PCIe
Link10
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
PCIe
Link11
Critical
Interrupt
Sensor
Specific
PCIe
Link11
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
PCIe
Link12
Critical
Interrupt
Sensor
Specific
PCIe
Link12
Bus correctable OK
error
See the
BIOS EPS
13F
6Fh
Bus
Degraded
uncorrectable
error
PCIe
Critical
Interrupt
Sensor
Specific
PCIe
Link13
Bus correctable OK
error
See the
BIOS EPS
Link13
13F
6Fh
Bus
Degraded
uncorrectable
error
96
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Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
Proc 1
Thermal
Control
C0h
C1h
C8h
All
All
All
Temperature Threshold [u] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
Trig Offset
Trig Offset
Trig Offset
M
M
M
–
–
–
01h 01h
Proc 2
Thermal
Control
Temperature Threshold [u] [c,nc]
01h 01h
Threshold
defined
Proc 1
VRD Over
Temp
Temperature Digital
01h – Limit
exceeded
Non-Critical
Non-Critical
As and De
As and De
–
–
Discrete
01h
05h
Proc 2
VRD Over
Temp
C9h
All
Temperature Digital
01h – Limit
exceeded
Trig Offset
M
–
Discrete
01h
05h
Proc 1 Vcc D0h
All
All
All
Voltage
02h
Threshold [u,l] [c,nc]
Threshold
defined
As and De Analog
As and De Analog
As and De Discrete
R, T
R, T
R, T
A
A
A
–
–
–
01h
Proc 2 Vcc D1h
Voltage
02h
Threshold [u,l] [c,nc]
01h
Threshold
defined
Proc 1 Vcc D2h
Out-of-
Range
Voltage
02h
Digital
Discrete
01h – Limit
exceeded
Non-Critical
05h
Proc 2
D3h
All
Voltage
02h
Digital
Discrete
01h – Limit
exceeded
Non-Critical
As and De Discrete
R, T
A
–
Vcc Out-
of-Range
05h
CPU
Population
Error
D8h
E0h
All
All
Processor
07h
Generic
03h
01h –- State
asserted
Critical
As and De
As
–
–
R, T
A
A
–
–
DIMM A1
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
Trig Offset
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
DIMM A2
E1h
All
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
As
–
Trig Offset
A
–
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
DIMM B1
DIMM B2
DIMM C1
DIMM C2
DIMM D1
DIMM D2
98
E2h
E3h
E4h
E5h
E6h
E7h
All
All
All
All
All
All
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
As
–
–
–
–
–
–
Trig Offset
Trig Offset
Trig Offset
Trig Offset
Trig Offset
Trig Offset
A
A
A
A
A
A
–
–
–
–
–
–
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
As
As
As
As
As
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
Slot
Connector
Sensor
Specific
Fault status
asserted
Degraded
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Intel® Server Board S5000PAL / S5000XAL TPS
Appendix B: Sensor Tables
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
21h
6Fh
Device installed OK
Disabled
Sparing
Degraded
OK
OK
Memory A ECh
Error
All
Memory
0Ch
Sensor
Specific
Correctable
ECC
As
–
–
–
–
Trig Offset
Trig Offset
Trig Offset
Trig Offset
A
A
A
A
–
–
–
–
6Fh
Uncorrectable
ECC
Memory B EDh
Error
System-
specific
Memory
0Ch
Sensor
Specific
Correctable
ECC
OK
OK
OK
OK
As
As
As
6Fh
Uncorrectable
ECC
Memory C EEh
Error
System-
specific
Memory
0Ch
Sensor
Specific
Correctable
ECC
6Fh
Uncorrectable
ECC
Memory D EFh
Error
System-
specific
Memory
0Ch
Sensor
Specific
Correctable
ECC
6Fh
Uncorrectable
ECC
B0 DIMM
Sparing
Enabled
F0h
F1h
All
All
Entity
Presence
Sensor
Specific
Entity present
As
As
–
–
Trig Offset
Trig Offset
A
A
–
–
25h
6Fh
B0 DIMM
Sparing
Redun-
dancy
Memory
0Ch
Discrete
0Bh
Fully redundant OK
Non-red: suff
res from redund
Degraded
Non-red: suff
res from insuff
res
Non-red: Insuff Critical
res
B1 DIMM
Sparing
Enabled
F2h
All
Entity
Presence
Sensor
Specific
Entity present
OK
As
–
Trig Offset
A
–
25h
6Fh
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Appendix B: Sensor Tables
Intel® Server Board S5000PAL / S5000XAL TPS
Sensor
Name
Sensor
Number Applica-
bility
System Sensor Type
Event /
Reading
Type
Event Offset
Triggers
Criticality
Assert /
De-assert
Readable Event Data Rearm Standby
Value /
Offsets
B1 DIMM
Sparing
Redun-
dancy
F3h
All
Memory
0Ch
Discrete
0Bh
Fully redundant OK
As
–
Trig Offset
A
–
Non-red: suff
Degraded
res from redund
Non-red: suff
res from insuff
res
Non-red: insuff Critical
res
B01 DIMM F4h
Mirroring
Enabled
All
All
Entity
Presence
Sensor
Specific
Entity present
OK
As
As
–
–
Trig Offset
Trig Offset
A
A
–
–
25h
6Fh
B01 DIMM F5h
Mirroring
Redun-
Memory
0Ch
Discrete
0Bh
Fully redundant OK
Non-red:suff res Degraded
from redund
dancy
Non-red:suff res
from insuff res
Non-red: insuff Critical
res
Note 1: Not supported except for ESB-2 embedded NICs
100
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Appendix C: POST Code Diagnostic LEDs
Appendix C: POST Code Diagnostic LED Decoder
During the system boot process, BIOS executes a number of platform configuration processes, each of
which is assigned a specific hex POST code number. As each configuration routine is started, BIOS will
display the given POST code to the POST Code Diagnostic LEDs found on the back edge of the server
board. To assist in troubleshooting a system hang during the POST process, the Diagnostic LEDs can
be used to identify the last POST process to be executed.
Each POST code will be represented by a combination of colors from the four LEDs. The LEDs are
capable of displaying three colors: green, red, and amber. The POST codes are divided into two nibbles,
an upper nibble and a lower nibble. Each bit in the upper nibble is represented by a red LED and each bit
in the lower nibble is represented by a green LED. If both bits are set in the upper and lower nibbles then
both red and green LEDs are lit, resulting in an amber color. If both bits are clear, then the LED is off.
In the below example, BIOS sends a value of ACh to the diagnostic LED decoder. The LEDs are decoded
as follows:
•
red bits = 1010b = Ah
ƒ
green bits = 1100b = Ch
Since the red bits correspond to the upper nibble and the green bits correspond to the lower nibble, the
two are concatenated to be ACh.
Table 45: POST Progress Code LED Example
8h
4h
2h
1h
LEDs
ACh
Result
Red
Green
Red
Green
Red
Green
Red
Green
1
1
0
1
1
0
0
0
Amber
Green
Red
Off
MSB
LSB
Diagnostic LEDs
USB Port
USB Port
Back edge of baseboard
MSB
LSB
Figure 28. Diagnostic LED Placement Diagram
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Appendix C: POST Code Diagnostic LEDs
Intel® Server Board S5000PAL / S5000XAL TPS
Table 46. Diagnostic LED POST Code Decoder
Diagnostic LED Decoder
Description
Checkpoint
G=Green, R=Red, A=Amber
MSB
Host Processor
OFF
LSB
0x10h
0x11h
0x12h
0x13h
Chipset
0x21h
Memory
0x22h
0x23h
0x24h
0x25h
0x26h
0x27h
0x28h
PCI Bus
0x50h
0x51h
0x52h
0x53h
0x54h
0x55h
0x56h
0x57h
USB
OFF
OFF
OFF
OFF
OFF
OFF
G
R
A
R
A
Power-on initialization of the host processor (bootstrap processor)
Host processor cache initialization (including AP)
Starting application processor initialization
SMM initialization
OFF
OFF
OFF
G
OFF
OFF
R
G
Initializing a chipset component
OFF
OFF
OFF
OFF
OFF
OFF
G
OFF
OFF
G
A
A
R
R
A
A
R
OFF Reading configuration data from memory (SPD on DIMM)
Detecting presence of memory
OFF Programming timing parameters in the memory controller
Configuring memory parameters in the memory controller
OFF Optimizing memory controller settings
Initializing memory, such as ECC init
OFF Testing memory
G
G
G
G
G
G
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
OFF
R
R
R
R
A
A
A
A
OFF
OFF
G
R
A
R
A
R
A
R
A
Enumerating PCI busses
Allocating resources to PCI busses
Hot Plug PCI controller initialization
Reserved for PCI bus
G
OFF
OFF
G
Reserved for PCI bus
Reserved for PCI bus
Reserved for PCI bus
G
Reserved for PCI bus
0x58h
0x59h
G
G
R
R
OFF
OFF
R
A
Resetting USB bus
Reserved for USB devices
ATA / ATAPI / SATA
0x5Ah
0x5Bh
G
G
R
R
G
G
R
A
Resetting PATA / SATA bus and all devices
Reserved for ATA
SMBUS
0x5Ch
G
G
A
A
OFF
OFF
R
A
Resetting SMBUS
0x5Dh
Reserved for SMBUS
Local Console
0x70h
OFF
OFF
OFF
R
R
R
R
R
A
R
A
R
Resetting the video controller (VGA)
Disabling the video controller (VGA)
Enabling the video controller (VGA)
0x71h
0x72h
Remote Console
0x78h
0x79h
0x7Ah
G
R
R
R
R
R
A
R
A
R
Resetting the console controller
Disabling the console controller
Enabling the console controller
G
G
Keyboard (PS2 or USB)
0x90h
0x91h
R
R
OFF OFF
OFF OFF
R
A
Resetting the keyboard
Disabling the keyboard
102
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Diagnostic LED Decoder
Appendix C: POST Code Diagnostic LEDs
Description
Checkpoint
G=Green, R=Red, A=Amber
MSB
LSB
0x92h
0x93h
0x94h
0x95h
R
OFF
OFF
G
G
R
Detecting the presence of the keyboard
R
R
R
G
A
R
A
Enabling the keyboard
OFF
OFF
Clearing keyboard input buffer
G
Instructing keyboard controller to run Self Test (PS2 only)
Mouse (PS2 or USB)
0x98h
0x99h
A
A
A
A
OFF OFF
OFF OFF
R
A
R
A
Resetting the mouse
Detecting the mouse
0x9Ah
OFF
OFF
G
G
Detecting the presence of mouse
Enabling the mouse
0x9Bh
Fixed Media
0xB0h
R
R
OFF
OFF
R
R
R
A
Resetting fixed media device
Disabling fixed media device
0xB1h
0xB2h
Detecting presence of a fixed media device (IDE hard drive detection,
etc.)
R
OFF
OFF
A
A
R
A
0xB3h
R
Enabling / configuring a fixed media device
Removable Media
0xB8h
0xB9h
0xBAh
A
A
OFF
OFF
R
R
R
A
Resetting removable media device
Disabling removable media device
Detecting presence of a removable media device (IDE CDROM
detection, etc.)
A
OFF
G
A
R
R
R
0xBCh
A
Enabling / configuring a removable media device
Boot Device Selection
0xD0
0xD1
0xD2
0xD3
0xD4
0xD5
0xD6
0xD7
0xD8
0xD9
0XDA
0xDB
0xDC
0xDE
0xDF
R
R
R
R
R
R
R
R
A
A
A
A
A
A
A
R
R
R
R
A
A
A
A
R
R
R
R
A
A
A
OFF
OFF
G
R
A
R
A
R
A
R
A
R
A
R
A
R
R
A
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
Trying boot device selection
G
OFF
OFF
G
G
OFF
OFF
G
G
OFF
G
G
Pre-EFI Initialization (PEI) Core
0xE0h
0xE2h
0xE1h
0xE3h
R
R
R
R
R
R
R
R
R
A
R
A
OFF Started dispatching early initialization modules (PEIM)
OFF Initial memory found, configured, and installed correctly
G
G
Reserved for initialization module use (PEIM)
Reserved for initialization module use (PEIM)
Driver Execution Environment (DXE) Core
0xE4h
0xE5h
R
R
R
A
A
A
R
R
A
OFF Entered EFI driver execution phase (DXE)
Started dispatching drivers
G
0xE6h
OFF Started connecting drivers
DXE Drivers
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Appendix C: POST Code Diagnostic LEDs
Diagnostic LED Decoder
Intel® Server Board S5000PAL / S5000XAL TPS
Description
Checkpoint
G=Green, R=Red, A=Amber
MSB
LSB
0xE7h
0xE8h
0xE9h
0xEAh
0xEEh
0xEFh
R
A
R
R
R
A
A
A
R
R
A
A
A
G
Waiting for user input
A
A
A
A
A
OFF Checking password
Entering BIOS setup
G
OFF Flash Update
OFF Calling Int 19. One beep unless silent boot is enabled.
G
Unrecoverable boot failure / S3 resume failure
Runtime Phase / EFI Operating System Boot
0xF4h
0xF5h
0xF8h
R
R
A
A
R
R
R
A
Entering Sleep state
Exiting Sleep state
Operating system has requested EFI to close boot services
(ExitBootServices ( ) has been called)
A
A
A
R
R
R
R
R
A
R
A
R
0xF9h
0xFAh
Operating system has switched to virtual address mode
(SetVirtualAddressMap ( ) has been called)
Operating system has requested the system to reset (ResetSystem ()
has been called)
Pre-EFI Initialization Module (PEIM) / Recovery
0x30h
0x31h
0x34h
0x35h
0x3Fh
OFF
OFF
OFF
OFF
G
OFF
OFF
G
R
R
R
R
A
R
A
R
A
A
Crisis recovery has been initiated because of a user request
Crisis recovery has been initiated by software (corrupt flash)
Loading crisis recovery capsule
G
Handing off control to the crisis recovery capsule
Unable to complete crisis recovery.
G
104
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Intel® Server Board S5000PAL / S5000XAL TPS Appendix D: POST Error Messages and Handling
Appendix D: POST Error Messages and Handling
Whenever possible, the BIOS will output the current boot progress codes on the video screen. Progress
codes are 32-bit quantities plus optional data. The 32-bit numbers include class, subclass, and operation
information. The class and subclass fields point to the type of hardware that is being initialized. The
operation field represents the specific initialization activity. Based on the data bit availability to display
progress codes, a progress code can be customized to fit the data width. The higher the data bit, the
higher the granularity of information that can be sent on the progress port. The progress codes may be
reported by the system BIOS or option ROMs.
The Response section in the following table is divided into two types:
Pause: The message is displayed in the Error Manager screen, an error is logged to the
SEL, and user input is required to continue. The user can take immediate corrective
action or choose to continue booting.
Halt: The message is displayed in the Error Manager screen, an error is logged to the SEL,
and the system cannot boot unless the error is resolved. The user needs to replace the
faulty part and restart the system.
Table 47. POST Error Messages and Handling
Error Code
004C
Error Message
Response
Pause
Keyboard / interface error
CMOS date / time not set
0012
5220
5221
5223
0048
0141
0146
8110
8111
8120
8121
8130
8131
8160
8161
8190
8198
0192
0194
0195
0197
8300
8306
8305
84F2
84F3
84F4
Pause
Pause
Pause
Pause
Halt
Configuration cleared by jumper
Passwords cleared by jumper
Configuration default loaded
Password check failed
PCI resource conflict
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Halt
Insufficient memory to shadow PCI ROM
Processor 01 internal error (IERR) on last boot
Processor 02 internal error (IERR) on last boot
Processor 01 thermal trip error on last boot
Processor 02 thermal trip error on last boot
Processor 01 disabled
Processor 02 disabled
Processor 01 unable to apply BIOS update
Processor 02 unable to apply BIOS update
Watchdog timer failed on last boot
Operating system boot watchdog timer expired on last boot
L3 cache size mismatch
CPUID, processor family are different
Front side bus mismatch
Halt
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Processor speeds mismatched
Baseboard management controller failed self-test
Front panel controller locked
Hot swap controller failed
Baseboard management controller failed to respond
Baseboard management controller in update mode
Sensor data record empty
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Appendix D: POST Error Messages and Handling Intel® Server Board S5000PAL / S5000XAL TPS
Error Code
84FF
Error Message
Response
Pause
System event log full
8500
8520
8521
8522
8523
8524
8525
8526
8527
8528
8529
852A
852B
852C
852D
852E
852F
8540
8580
8581
8582
8583
8584
8585
8586
8587
8588
8589
858A
858B
858C
858D
858E
858F
8600
Memory Component could not be configured in the selected RAS mode.
DIMM_A1 failed Self Test (BIST).
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
DIMM_A2 failed Self Test (BIST).
DIMM_A3 failed Self Test (BIST).
DIMM_A4 failed Self Test (BIST).
DIMM_B1 failed Self Test (BIST).
DIMM_B2 failed Self Test (BIST).
DIMM_B3 failed Self Test (BIST).
DIMM_B4 failed Self Test (BIST).
DIMM_C1 failed Self Test (BIST).
DIMM_C2 failed Self Test (BIST).
DIMM_C3 failed Self Test (BIST).
DIMM_C4 failed Self Test (BIST).
DIMM_D1 failed Self Test (BIST).
DIMM_D2 failed Self Test (BIST).
DIMM_D3 failed Self Test (BIST).
DIMM_D4 failed Self Test (BIST).
Memory Component lost redundancy during the last boot.
DIMM_A1 Correctable ECC error encountered.
DIMM_A2 Correctable ECC error encountered.
DIMM_A3 Correctable ECC error encountered.
DIMM_A4 Correctable ECC error encountered.
DIMM_B1 Correctable ECC error encountered.
DIMM_B2 Correctable ECC error encountered.
DIMM_B3 Correctable ECC error encountered.
DIMM_B4 Correctable ECC error encountered.
DIMM_C1 Correctable ECC error encountered.
DIMM_C2 Correctable ECC error encountered.
DIMM_C3 Correctable ECC error encountered.
DIMM_C4 Correctable ECC error encountered.
DIMM_D1 Correctable ECC error encountered.
DIMM_D2 Correctable ECC error encountered.
DIMM_D3 Correctable ECC error encountered.
DIMM_D4 Correctable ECC error encountered.
Primary and secondary BIOS IDs do not match.
Override jumper is set to force boot from lower alternate BIOS bank of flash
ROM
8601
8602
8603
WatchDog timer expired (secondary BIOS may be bad!)
Secondary BIOS checksum fail
Pause
Pause
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Intel® Server Board S5000PAL / S5000XAL TPS Appendix D: POST Error Messages and Handling
POST Error Beep Codes
The following table lists POST error beep codes. Prior to system Video initialization, BIOS uses these
beep codes to inform users on error conditions. The beep code is followed by a user visible code on
POST Progress LEDs.
Table 48. POST Error Beep Codes
Beeps
3
Error Message
Memory error
POST Progress Code
Description
System halted because a fatal error related to the memory
was detected.
6
BIOS rolling back
error
The system has detected a corrupted BIOS in the flash
part, and is rolling back to the last good BIOS.
The BMC may generate beep codes upon detection of failure conditions. Beep codes are sounded each
time the problem is discovered, such as on each power-up attempt, but are not sounded continuously.
Codes that are common across all Intel® Server Boards and systems that use the Intel® S5000 chipset
are listed in Table 49. Each digit in the code is represented by a sequence of beeps whose count is equal
to the digit.
Table 49. BMC Beep Codes
Code
1-5-2-1
Reason for Beep
CPU: Empty slot / population error – Processor
slot 1 is not populated.
Associated Sensors
CPU Population Error
Supported?
Yes
1-5-2-2
1-5-2-3
1-5-2-4
1-5-4-2
CPU: No processors (terminators only)
N/A
N/A
No
No
No
Yes
CPU: Configuration error (e.g., VID mismatch)
CPU: Configuration error (e.g., BSEL mismatch) N/A
Power fault: DC power unexpectedly lost (power Power Unit – power unit
good dropout)
failure offset
1-5-4-3
1-5-4-4
Chipset control failure
Power control fault
N/A
No
Power Unit – soft power
control failure offset
Yes
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Appendix E: Supported Intel® Server Chassis
Intel® Server Board S5000PAL / S5000XAL TPS
Appendix E: Supported Intel® Server Chassis
The Intel® Server Board S5000PAL / S5000XAL is supported in the following Intel high density rack
mount server chassis:
•
•
•
Intel® Server Chassis SR1500
Intel® Server Chassis SR1550
Intel® Server Chassis SR2500
This section provides a high level descriptive overview of each chassis. For more detail, please
reference the appropriate Technical Product Specification (TPS) available for each.
F
G
E
H
D
I
C
B
A
P
J
O
K
L
N
A
M
TP02154
A
B
Rack handles
I
PCI card bracket (low profile) – PCIe*
Processor air duct
Backplane – Passive SAS/SATA or Active
SAS/SAS RAID
J
C
D
E
F
Air baffle
K
L
Fan module
Bridge board
Power supply fans
600 Watt Power supply
Intel® Server Board S5000PAL / S5000XAL
M
N
O
P
Control panel (standard control panel shown)
Hard drive bays (drives not included)
Slimline drive bay (drive not included)
Front bezel (optional)
G
H
PCI card bracket (full height) – PCI-X* or PCIe*
PCI add-in riser assembly
Figure 29. 1U – Intel® Server Chassis SR1500 Overview
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Intel® Server Board S5000PAL / S5000XAL TPS
Appendix E: Supported Intel® Server Chassis
A
B
Rack Handles
L
Riser Card Assembly
System Memory
SAS/SATA Backplane
M
SAS RAID Battery Pack
(Optional)
C
N
Processor and Heat Sink
D
E
Power Supply Air Duct
O
P
Processor Air Duct
System Fan Bank
Power Distribution Board
1+1 650 Watt Power Supply
Modules
Mid-plane Board
F
G
H
I
Q
R
S
T
(Active - SAS/SAS RAID shown)
Front Bezel (Optional; Standard Control Panel
shown)
Intel® Server Board S5000PAL /
S5000XAL
Standard Control Panel or Intel® Local Control
Panel (Optional)
Bridge Board
Mini Control Panel Bay – required option to
support eight hard drives
Intel® RMM Module (Optional)
J
Intel® RMM NIC(Optional)
IO Module (Optional)
U
V
Slimline Optical Drive Bay
K
Up to Eight 2.5” Hard Drive Bays
Figure 30. 1U – Intel® Server Chassis SR1550 Overview
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Appendix E: Supported Intel® Server Chassis
Intel® Server Board S5000PAL / S5000XAL TPS
E
F
D
C
B
A
G
N
M
L
H
I
K
J
A
TP02094
A.
B.
Rack Handles
H.
I.
CPU Air Duct
SAS/SATA Backplane
System Fan Assembly
Standard Control Panel
Flex Bay – 6th HDD or Tape (Optional)
C. Air Baffles
J.
K.
D. Power Distribution Module
1+1 750 Watt Power Supply
Modules
E.
L.
Five SATA/SAS Hard Drive Bays
F.
G. System Memory
Mid-pane – Passive SAS/SATA
Riser Card Assembly
M.
N.
Slim-Line Optical Drive Bay
Front Bezel (Optional)
or Active SAS/SAS RAID
(Not shown)
Figure 31. 2U – Intel® Server Chassis SR2500 Overview
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Intel® Server Board S5000PAL / S5000XAL TPS
Glossary
Glossary
This appendix contains important terms used in the preceding chapters. For ease of use, numeric entries
are listed first (e.g., “82460GX”) with alpha entries following (e.g., “AGP 4x”). Acronyms are then entered
in their respective place, with non-acronyms following.
Term
ACPI
Definition
Advanced Configuration and Power Interface
Application Processor
AP
APIC
ASIC
ASMI
BIOS
BIST
BMC
Bridge
BSP
byte
Advanced Programmable Interrupt Control
Application Specific Integrated Circuit
Advanced Server Management Interface
Basic Input/Output System
Built-In Self Test
Baseboard Management Controller
Circuitry connecting one computer bus to another, allowing an agent on one to access the other
Bootstrap Processor
8-bit quantity.
CBC
Chassis Bridge Controller (A microcontroller connected to one or more other CBCs, together they
bridge the IPMB buses of multiple chassis.
CEK
Common Enabling Kit
CHAP
CMOS
Challenge Handshake Authentication Protocol
In terms of this specification, this describes the PC-AT compatible region of battery-backed 128 bytes
of memory, which normally resides on the server board.
DPC
EEPROM
EHCI
EMP
EPS
ESB-2
FBD
FMB
FRB
FRU
FSB
GB
Direct Platform Control
Electrically Erasable Programmable Read-Only Memory
Enhanced Host Controller Interface
Emergency Management Port
External Product Specification
Enterprise South Bridge 2
Fully Buffered DIMM
Flexible Mother Board
Fault Resilient Booting
Field Replaceable Unit
Front Side Bus
1024MB
GPIO
GTL
HSC
Hz
General Purpose I/O
Gunning Transceiver Logic
Hot-Swap Controller
Hertz (1 cycle/second)
Inter-Integrated Circuit Bus
Intel® Architecture
I2C
IA
IBF
Input Buffer
ICH
I/O Controller Hub
ICMB
IERR
IFB
Intelligent Chassis Management Bus
Internal Error
I/O and Firmware Bridge
Interrupt
INTR
IP
Internet Protocol
IPMB
Intelligent Platform Management Bus
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Glossary
Intel® Server Board S5000PAL / S5000XAL TPS
Definition
Term
IPMI
Intelligent Platform Management Interface
Infrared
IR
ITP
In-Target Probe
KB
1024 bytes
KCS
LAN
Keyboard Controller Style
Local Area Network
Liquid Crystal Display
Light Emitting Diode
Low Pin Count
LCD
LED
LPC
LUN
MAC
MB
Logical Unit Number
Media Access Control
1024KB
MCH
MD2
MD5
ms
Memory Controller Hub
Message Digest 2 – Hashing Algorithm
Message Digest 5 – Hashing Algorithm – Higher Security
milliseconds
MTTR
Mux
Memory Type Range Register
Multiplexor
NIC
Network Interface Controller
NMI
Nonmaskable Interrupt
OBF
OEM
Ohm
PEF
Output Buffer
Original Equipment Manufacturer
Unit of electrical resistance
Platform Event Filtering
PEP
PIA
Platform Event Paging
Platform Information Area (This feature configures the firmware for the platform hardware)
Programmable Logic Device
PLD
PMI
Platform Management Interrupt
Power-On Self Test
POST
PSMI
PWM
RAM
RASUM
RISC
ROM
RTC
SDR
SECC
SEEPROM
SEL
Power Supply Management Interface
Pulse-Width Modulation
Random Access Memory
Reliability, Availability, Serviceability, Usability, and Manageability
Reduced Instruction Set Computing
Read Only Memory
Real-Time Clock (Component of ICH peripheral chip on the server board)
Sensor Data Record
Single Edge Connector Cartridge
Serial Electrically Erasable Programmable Read-Only Memory
System Event Log
SIO
Server Input/Output
SMI
Server Management Interrupt (SMI is the highest priority nonmaskable interrupt)
Server Management Mode
SMM
SMS
SNMP
TBD
TIM
Server Management Software
Simple Network Management Protocol
To Be Determined
Thermal Interface Material
UART
Universal Asynchronous Receiver/Transmitter
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Intel® Server Board S5000PAL / S5000XAL TPS
Term
Glossary
Definition
UDP
UHCI
UTC
VID
User Datagram Protocol
Universal Host Controller Interface
Universal time coordinate
Voltage Identification
VRD
Word
ZIF
Voltage Regulator Down
16-bit quantity
Zero Insertion Force
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Reference Documents
Intel® Server Board S5000PAL / S5000XAL TPS
Reference Documents
See the following documents for additional information:
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
ƒ
Intel® S5000 Series Chipsets Server Board Family Datasheet
Intel® S5000 Server Board Family BIOS Core External Product Specification (Yellow Cover)
Intel® S5000 Server Board Family BMC Core External Product Specification (Yellow Cover)
Intel® 5000P Memory Controller Hub External Design Specification (Yellow Cover)
Intel® Enterprise South Bridge-2 (ESB-2) External Design Specification (Yellow Cover)
TEB 2.11 – Thin Electronics Bay (1U/2U Rack Optimized)
EPS 1U Rev. 2.93 – Entry Level Power Supply – 1U non-redundant – Intel® S5000 Server Board
Family
ERP 2U – Rev. 2.31 – Entry Redundant Power Supply 2U form factor – Intel® S5000 Server
Board Family
ƒ
Note: Yellow Cover documents can only be obtained under NDA with Intel and ordered through an Intel
representative.
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