Intel Personal Computer DP45SG User Manual

Intel® Desktop Board DP45SG  
Product Guide  
Order Number: E30016-001  
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Preface  
This Product Guide gives information about board layout, component installation, BIOS  
update, and regulatory requirements for Intel® Desktop Board DP45SG.  
Intended Audience  
The Product Guide is intended for technically qualified personnel. It is not intended for  
general audiences.  
Use Only for Intended Applications  
All Intel Desktop Boards are evaluated as Information Technology Equipment (I.T.E.)  
for use in personal computers (PC) for installation in homes, offices, schools, computer  
rooms, and similar locations. The suitability of this product for other PC or embedded  
non-PC applications or other environments, such as medical, industrial, alarm systems,  
test equipment, etc. may not be supported without further evaluation by Intel.  
Document Organization  
The chapters in this Product Guide are arranged as follows:  
1 Desktop Board Features: a summary of product features  
2 Installing and Replacing Desktop Board Components: instructions on how to install  
the Desktop Board and other hardware components  
3 Updating the BIOS: instructions on how to update the BIOS  
4 Configuring for RAID Using Intel® Matrix Storage Technology: information about  
configuring your system for RAID  
5 Configuring for Intel® Rapid Recover Technology (Intel® RRT): information about  
configuring your system for Intel Rapid Recover Technology  
A Error Messages and Indicators: information about BIOS error messages and beep  
codes  
B Regulatory Compliance: describes the board’s adherence to safety standards and  
EMC regulations and its product certifications  
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Intel Desktop Board DP45SG Product Guide  
Conventions  
The following conventions are used in this manual:  
CAUTION  
Cautions warn the user about how to prevent damage to hardware or loss of data.  
NOTE  
Notes call attention to important information.  
Terminology  
The table below gives descriptions of some common terms used in the product guide.  
Term  
GB  
Description  
Gigabyte (1,073,741,824 bytes)  
Gigahertz (one billion hertz)  
Kilobyte (1024 bytes)  
GHz  
KB  
MB  
Megabyte (1,048,576 bytes)  
Megabit (1,048,576 bits)  
Megahertz (one million hertz)  
Mb  
MHz  
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Contents  
1 Desktop Board Features  
Desktop Board Components.................................................................................11  
Processor..........................................................................................................13  
Main Memory.....................................................................................................13  
Intel® P45 Express Chipset..................................................................................14  
Audio Subsystem ...............................................................................................14  
LAN Subsystem .................................................................................................15  
USB 2.0 Support................................................................................................16  
Serial ATA Support.............................................................................................16  
Serial ATA RAID .........................................................................................16  
Intel® Rapid Recover Technology (Intel® RRT) ................................................16  
Legacy I/O........................................................................................................17  
Expandability.....................................................................................................17  
BIOS................................................................................................................17  
Serial ATA Auto Configuration.......................................................................17  
PCI* and PCI Express* Auto Configuration .....................................................17  
Security Passwords.....................................................................................18  
Hardware Management.......................................................................................18  
Hardware Monitoring and Fan Speed Control ..................................................18  
Intel® Precision Cooling Technology .......................................................18  
Chassis Intrusion........................................................................................19  
Power Management............................................................................................19  
Software Support .......................................................................................19  
ACPI..................................................................................................19  
Hardware Support ......................................................................................19  
Power Connectors ...............................................................................19  
Fan Headers.......................................................................................20  
LAN Wake Capabilities..........................................................................20  
Instantly Available PC Technology..........................................................20  
+5 V Standby Power Indicator...............................................................21  
Wake from USB ..................................................................................22  
PME# Signal Wake-up Support..............................................................22  
WAKE# Signal Wake-up Support ...........................................................22  
Wake from CIR ...................................................................................22  
ENERGY STAR* Capable......................................................................................22  
Speaker............................................................................................................22  
Battery.............................................................................................................22  
Real-Time Clock.................................................................................................23  
2 Installing and Replacing Desktop Board Components  
Before You Begin ...............................................................................................25  
Installation Precautions.......................................................................................26  
Prevent Power Supply Overload....................................................................26  
Observe Safety and Regulatory Requirements.................................................26  
Installing the I/O Shield......................................................................................27  
Installing and Removing the Desktop Board...........................................................28  
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Installing and Removing a Processor.....................................................................29  
Installing a Processor..................................................................................29  
Installing the Processor Fan Heat Sink...........................................................33  
Connecting the Processor Fan Heat Sink Cable................................................33  
Removing the Processor ..............................................................................34  
Installing the ICH Heat Sink Decorative Cover (Optional).........................................34  
Installing and Removing Memory..........................................................................35  
Guidelines for Dual Channel Memory Configuration..........................................35  
Two or Four DIMMs .............................................................................35  
Three DIMMs......................................................................................36  
Installing DIMMs ........................................................................................37  
Removing DIMMs........................................................................................39  
Installing and Removing a PCI Express x16 Card ....................................................40  
Installing Multiple PCI Express x16 Graphics Cards..........................................40  
Installing a PCI Express x16 Card .................................................................41  
Removing a PCI Express x16 Card ................................................................42  
Connecting the Serial ATA (SATA) Cables ..............................................................43  
Connecting to the Internal Headers and Connectors................................................44  
S/PDIF Connector.......................................................................................45  
Front Panel Audio Header ............................................................................45  
IEEE 1394a Header.....................................................................................46  
Consumer IR (CIR) Headers.........................................................................46  
Chassis Intrusion Header.............................................................................47  
Front Panel Header .....................................................................................47  
Alternate Front Panel Power LED Header........................................................48  
HD Audio Link Header .................................................................................48  
USB 2.0 Headers........................................................................................49  
Serial Port Header ......................................................................................49  
Connecting to the Flexible Audio System ...............................................................50  
Connecting Chassis Fan and Power Supply Cables...................................................51  
Connecting Chassis Fan Cables.....................................................................51  
Connecting Power Supply Cables ..................................................................52  
Setting the BIOS Configuration Jumper .................................................................53  
Clearing Passwords ............................................................................................54  
Replacing the Battery .........................................................................................55  
3 Updating the BIOS  
Updating the BIOS with the Intel® Express BIOS Update Utility.................................61  
Updating the BIOS with the ISO Image BIOS Update File or the Iflash Memory  
Update Utility...............................................................................................62  
Obtaining the BIOS Update File ....................................................................62  
Updating the BIOS with the ISO Image BIOS Update File .................................62  
Updating the BIOS with the Iflash Memory Update Utility .................................63  
Recovering the BIOS...................................................................................64  
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Contents  
4 Configuring for RAID Using Intel® Matrix Storage Technology  
(Intel® MST)  
Configuring the BIOS..........................................................................................65  
Creating Your RAID Set.......................................................................................65  
Loading the Intel Matrix Storage Technology RAID Drivers and Software for  
Microsoft Windows* XP..................................................................................66  
Setting Up a “RAID Ready” System.......................................................................66  
5 Configuring for Intel® Rapid Recover Technology (Intel® RRT)  
Enabling Intel Rapid Recover Technology...............................................................67  
Creating a Recovery Volume................................................................................68  
Creating a Recovery Volume Using the RAID Option ROM .................................68  
Creating a Recovery Volume Using the Intel® Matrix Storage Console ................68  
Disk Synchronization Mode..................................................................................69  
Mounting the Recovery Disk ................................................................................69  
A Error Messages and Indicators  
BIOS Beep Codes...............................................................................................71  
BIOS Error Messages..........................................................................................71  
B Regulatory Compliance  
Safety Standards ...............................................................................................73  
Place Battery Marking .................................................................................73  
European Union Declaration of Conformity Statement..............................................74  
Product Ecology Statements ................................................................................75  
Recycling Considerations .............................................................................75  
Lead-free 2LI/Pb-free 2LI Board ...................................................................78  
Restriction of Hazardous Substances (RoHS) ..................................................79  
EU RoHS............................................................................................79  
China RoHS........................................................................................80  
EMC Regulations................................................................................................82  
Ensure Electromagnetic Compatibility (EMC) Compliance..................................83  
Product Certifications..........................................................................................84  
Board-Level Certification Markings ................................................................84  
Chassis and Component Certifications............................................................85  
Figures  
1. Intel Desktop Board DP45SG Components........................................................11  
2. LAN Connector LEDs .....................................................................................15  
3. Location of the Standby Power Indicator ..........................................................21  
4. Installing the I/O Shield ................................................................................27  
5. Intel Desktop Board DP45SG Mounting Screw Hole Locations..............................28  
6. Lift the Socket Lever.....................................................................................29  
7. Lift the Load Plate.........................................................................................30  
8. Remove the Protective Socket Cover ...............................................................30  
9. Remove the Processor from the Protective Processor Cover ................................31  
10. Install the Processor .....................................................................................31  
11. Close the Load Plate .....................................................................................32  
12. Connecting the Processor Fan Heat Sink Cable..................................................33  
13. Installing the ICH Heat Sink Decorative Cover ..................................................34  
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14. Dual Channel Memory Configuration with Two DIMMs ........................................35  
15. Dual Channel Memory Configuration with Four DIMMs........................................36  
16. Dual Channel Memory Configuration with Three DIMMs......................................36  
17. Use DDR3 DIMMs .........................................................................................37  
18. Installing a DIMM .........................................................................................38  
19. Installing Two PCI Express x16 Graphics Cards.................................................40  
20. Installing a PCI Express x16 Card ...................................................................41  
21. Removing a PCI Express x16 Card ..................................................................42  
22. Connecting a Serial ATA Cable........................................................................43  
23. Internal Headers and Connectors....................................................................44  
24. Back Panel Audio Connectors .........................................................................50  
25. Location of the Chassis Fan Headers................................................................51  
26. Connecting Power Supply Cables ....................................................................52  
27. Location of the BIOS Configuration Jumper Block ..............................................53  
28. Removing the Battery ...................................................................................60  
29. Intel Desktop Board DP45SG China RoHS Material Self Declaration Table..............81  
Tables  
1. Feature Summary.......................................................................................... 9  
2. Intel Desktop Board DP45SG Components........................................................12  
3. LAN Connector LEDs .....................................................................................15  
4. S/PDIF Connector Signal Names .....................................................................45  
5. Front Panel Audio Header Signal Names for HD Audio ........................................45  
6. Front Panel Audio Header Signal Names for AC ’97 Audio ...................................45  
7. IEEE 1394a Header Signal Names...................................................................46  
8. Front Panel CIR Receiver (Input) Header Signal Names......................................46  
9. Back Panel CIR Header Emitter (Output) Header Signal Names ...........................47  
10. Chassis Intrusion Header Signal Names ...........................................................47  
11. Front Panel Header Signal Names ...................................................................47  
12. Alternate Front Panel Power LED Header Signal Names ......................................48  
13. HD Audio Link Header Signal Names ...............................................................48  
14. USB 2.0 Header Signal Names........................................................................49  
15. Serial Port Header Signal Names.....................................................................49  
16. Jumper Settings for the BIOS Setup Program Modes..........................................54  
17. Beep Codes .................................................................................................71  
18. BIOS Error Messages ....................................................................................71  
19. Safety Standards..........................................................................................73  
20. Lead-Free Second Level Interconnect Marks .....................................................79  
21. China RoHS Environmentally Friendly Use Period Mark.......................................80  
22. EMC Regulations...........................................................................................82  
23. Product Certification Markings ........................................................................84  
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1 Desktop Board Features  
This chapter briefly describes the features of Intel® Desktop Board DP45SG. Table 1  
summarizes the major features of the Desktop Board.  
Table 1. Feature Summary  
ATX (294.64 millimeters [11.60 inches] x 243.84 millimeters  
[9.60 inches])  
Support for an Intel® processor in the LGA775 package  
Form Factor  
Processor  
Main Memory  
Four 240-pin, DDR3 1.5 V SDRAM Dual Inline Memory Module  
(DIMM) sockets  
1333/1066/800 MHz DDR3 SDRAM interface  
Support for up to 8 GB of system memory  
Intel® P45 Express Chipset consisting of:  
Chipset  
Intel P45 Express Chipset Memory Controller Hub (MCH) with Direct  
Media Interface interconnect  
Intel® 82801JR I/O Controller Hub (ICH10R) supporting Intel®  
Matrix Storage Technology (Intel® MST)  
Graphics  
Audio  
Support for multiple PCI Express* graphics cards  
Independent multi-streaming 8-channel (7.1) audio and 2-channel  
audio subsystem, featuring:  
Intel® High Definition Audio (Intel® HD Audio) interface  
IDT* 92HD73E audio codec  
HD Audio Link header  
Front panel header  
Two independent S/PDIF connectors  
Onboard 3-pin connector  
Back panel optical connector  
Two PCI Express 2.0 x16 ports  
Two PCI Express 1.1 x1 ports  
Three PCI* bus connectors  
Expansion  
Capabilities  
Legacy I/O Support  
Legacy I/O Controller that provides:  
Consumer Infrared (CIR) support  
Serial port via an onboard header  
Up to 12 USB 2.0 ports:  
Six ports routed to the back panel  
Six ports routed to two USB headers  
Up to two IEEE 1394a ports:  
Peripheral  
Interfaces  
One port routed to the back panel  
One port routed to an IEEE 1394a header  
Six Serial ATA (SATA) channels (3.0 Gb/s) via ICH10R, including  
one back panel eSATA channel  
continued  
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Table 1. Feature Summary (continued)  
RAID Support  
Intel Matrix Storage Technology for Serial ATA including support for  
Intel® Rapid Recover Technology (Intel® RRT)  
Gigabit LAN subsystem, including:  
LAN Support  
Intel® 82567LF Gigabit (10/100/1000 Mb/s) Ethernet LAN controller  
RJ-45 back panel connector with integrated status LEDs  
Intel® Platform Innovation Framework for EFI  
32 Mb symmetrical flash memory device  
Support for SMBIOS  
BIOS  
Intel® Rapid BIOS Boot  
Intel® Express BIOS Update  
Power Management  
Support for Advanced Configuration and Power Interface (ACPI)  
Suspend to RAM (STR)  
Wake on USB, PCI, PCI Express, LAN, CIR, and front panel  
ENERGY STAR* capable  
Hardware  
Hardware monitor with:  
Management  
Four fan sensing inputs used to monitor fan activity  
Intel® Precision Cooling Technology fan speed control  
Voltage sensing to detect out of range values  
Microsoft Windows Vista* Ultimate  
Supported  
Operating Systems  
Microsoft Windows Vista Enterprise  
Microsoft Windows Vista Business  
Microsoft Windows Vista Home Premium  
Microsoft Windows Vista Home Basic  
Microsoft Windows Vista Ultimate 64-bit edition  
Microsoft Windows Vista Enterprise 64-bit edition  
Microsoft Windows Vista Business 64-bit edition  
Microsoft Windows Vista Home Premium 64-bit edition  
Microsoft Windows Vista Home Basic 64-bit edition  
Microsoft Windows* XP Media Center Edition 2005  
Microsoft Windows XP Professional  
Microsoft Windows XP Professional x64 Edition  
Microsoft Windows XP Home  
For more information about Intel Desktop Board DP45SG, including the Technical  
Product Specification (TPS), BIOS updates, and device drivers, go to  
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Desktop Board Features  
Desktop Board Components  
Figure 1 shows the approximate location of the major components on Intel Desktop  
Board DP45SG.  
Figure 1. Intel Desktop Board DP45SG Components  
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Table 2. Intel Desktop Board DP45SG Components  
Label  
A
Description  
PCI bus connector 3  
B
S/PDIF connector  
C
PCI bus connector 2  
D
PCI bus connector 1  
E
PCI Express 2.0 x16 secondary connector  
PCI Express 1.1 x1 connector 2  
IEEE 1394a header  
F
G
H
PCI Express 1.1 x1 connector  
PCI Express 2.0 x16 primary connector  
Auxiliary PCI Express graphics power connector (1 x 4 pin)  
Back panel connectors  
I
J
K
L
Processor fan header (4-pin)  
Rear chassis fan header (3-pin)  
12 V processor core voltage connector (2 x 2 pin)  
Processor socket  
M
N
O
P
DDR3 DIMM 0 sockets  
Q
DDR3 DIMM 1 sockets  
R
Main power connector (2 x 12 pin)  
Front chassis fan header (3-pin)  
Chassis intrusion header  
S
T
U
BIOS configuration jumper block  
Alternate front panel power LED header  
Front panel header  
V
W
X
Front panel CIR receiver (input) header  
Serial ATA connectors (5)  
Speaker  
Y
Z
AA  
BB  
CC  
DD  
EE  
FF  
GG  
Auxiliary chassis fan header (4-pin)  
USB 2.0 headers (3)  
High Definition Audio Link header  
Battery  
Serial header  
Back panel CIR transmitter (output) header  
Front panel audio header  
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Desktop Board Features  
Processor  
CAUTION  
Failure to use an appropriate power supply and/or not connecting the 12 V (2 x 2 pin)  
power connector to the Desktop Board may result in damage to the board, or the  
system may not function properly.  
Intel Desktop Board DP45SG supports an Intel processor in the LGA775 package.  
Processors are not included with the Desktop Board and must be purchased  
separately. The processor connects to the Desktop Board through the LGA775 socket.  
Go to the following locations for more information about:  
Instructions on installing or upgrading the processor, page 29 in Chapter 2  
Supported processors for Intel Desktop Board DP45SG,  
Main Memory  
NOTE  
To be fully compliant with all applicable Intel® SDRAM memory specifications, the  
board should be populated with DIMMs that support the Serial Presence Detect (SPD)  
data structure. If your memory modules do not support SPD, you will see a  
notification to this effect on the screen at power up. The BIOS will attempt to  
configure the memory controller for normal operation.  
The Desktop Board supports the dual or single channel memory configurations defined  
below:  
Four 240-pin Double Data Rate 3 (DDR3) SDRAM Dual Inline Memory Module  
(DIMM) connectors with gold-plated contacts.  
1333/1066/800 MHz DDR3 SDRAM interface  
Unbuffered, non-registered single- or double-sided DIMMs  
Non-ECC DDR3 memory  
Serial Presence Detect (SPD) memory only  
Up to 4 GB utilizing 512 Mb or 1 Gb technology  
Up to 8 GB utilizing 1 Gb or 2 Gb technology  
NOTE  
System resources and hardware (such as PCI and PCI Express) require physical  
memory address locations that can reduce available addressable system memory.  
This could result in a reduction of as much as 1 GB or more of physical addressable  
memory being available to the operating system and applications, depending on the  
system configuration and operating system.  
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Go to the following locations for more information about:  
Installing memory, page 35 in Chapter 2  
Intel® P45 Express Chipset  
The Intel P45 Express Chipset consists of the following devices:  
Intel P45 Express Chipset Memory Controller Hub (MCH) with Direct Media  
Interface (DMI) interconnect  
Intel 82801JR I/O Controller Hub (ICH10R) with DMI interconnect  
The MCH provides interfaces to the processor, memory, PCI Express bus, and the DMI  
interconnect. ICH10R is a centralized controller for the board’s I/O paths.  
For more information about the Intel P45 Express Chipset, go to  
Audio Subsystem  
The onboard audio subsystem consists of the following components:  
Intel® ICH10R I/O controller hub  
IDT 92HD73E audio codec  
The subsystem has the following headers and connectors:  
Back panel audio connectors, including an S/PDIF optical port  
Front panel header that provides mic in and line out signals for front panel audio  
connectors. High definition (HD) Audio or AC’97 Audio front panels can be  
supported.  
HD Audio Link header used with HDMI video cards  
Onboard S/PDIF connector that can be used for HDMI video cards that do not work  
with the HD Audio Link header  
The audio subsystem supports the following features:  
Dolby* Home Theater  
A signal-to-noise (S/N) ratio of 95 dB  
Independent multi-streaming 8-channel (7.1) audio (using the back panel audio  
connectors) and 2-channel audio (using the Intel High Definition Audio front panel  
header)  
Go to the following locations for more information about:  
The location of the onboard audio headers, Figure 23 on page 44  
The signal names for the front panel header and the HD Audio Link header,  
page 48  
The back panel audio connectors, Figure 24 on page 50  
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Desktop Board Features  
LAN Subsystem  
The LAN subsystem includes:  
Intel ICH10R  
Intel 82567LF Gigabit (10/100/1000 Mb/s) Ethernet LAN controller  
RJ-45 LAN connector with integrated status LEDs  
The subsystem features:  
CSMA/CD protocol engine  
LAN connect interface between ICH10R and the LAN controller  
PCI Express power management  
For information about LAN software and drivers go to  
Two LEDs are built into the RJ-45 LAN connector located on the back panel (see  
Figure 2). These LEDs indicate the status of the LAN.  
Figure 2. LAN Connector LEDs  
Table 3 describes the LED states when the board is powered up and the LAN  
subsystem is operating.  
Table 3. LAN Connector LEDs  
LED  
LED Color  
LED State  
Off  
Indicates  
A
Green  
LAN link is not established  
LAN link is established  
LAN activity is occurring  
10 Mb/s data rate  
On  
Blinking  
Off  
B
N/A  
Green  
Yellow  
On  
100 Mb/s data rate  
1000 Mb/s data rate  
On  
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USB 2.0 Support  
The Desktop Board supports up to 12 USB 2.0 ports (six ports routed to back panel  
connectors and six ports routed to three onboard headers) via the ICH10R. USB 2.0  
ports are backward compatible with USB 1.1 devices. USB 1.1 devices will function  
normally at USB 1.1 speeds.  
USB 2.0 support requires both an operating system and drivers that fully support  
USB 2.0 transfer rates. Disabling Hi-Speed USB in the BIOS reverts all USB 2.0 ports  
to USB 1.1 operation. This may be required to accommodate operating systems that  
do not support USB 2.0.  
Serial ATA Support  
Intel Desktop Board DP45SG supports five onboard Serial ATA channels and one  
eSATA channel (3.0 Gb/s) via ICH10R.  
Serial ATA RAID  
The five onboard Serial ATA channels support the following RAID (Redundant Array of  
Independent Drives) levels via Intel Matrix Storage Technology:  
RAID 0 - data striping  
RAID 1 - data mirroring  
RAID 0+1 (or RAID 10) - data striping and data mirroring  
RAID 5 - distributed parity  
For information on configuring your system for RAID using Intel Matrix Storage  
Technology go to Chapter 4.  
Intel® Rapid Recover Technology (Intel® RRT)  
The Desktop Board supports Intel Rapid Recover Technology which enables fast and  
easy recovery of your data in the event of a hard drive failure. It allows you to  
maintain a complete copy of your primary or master drive onto a second hard drive,  
the recovery drive. If the master hard drive should fail, either from a mechanical  
failure or the result of a virus, recovery is as simple as booting from the recovery  
drive. The recovery drive can be attached to your system via any standard SATA or  
eSATA connection.  
Intel Rapid Recover Technology also provides the added benefit of allowing the  
recovery drive to be mounted as a read-only volume so you can quickly copy files from  
the recovery drive when individual files need to be recovered.  
For information on configuring your system for Intel Rapid Recover Technology see  
Chapter 5.  
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Desktop Board Features  
Legacy I/O  
Intel Desktop Board DP45SG includes an I/O controller that provides the following  
legacy I/O features:  
One serial port via an onboard header  
Consumer Infrared (CIR) support  
Low pin count (LPC) interface  
Intelligent power management, including a programmable wake up event interface  
PCI power management support  
Expandability  
Intel Desktop Board DP45SG provides the following expansion capability:  
Two PCI Express 2.0 x16 connectors (compatible with PCI Express 1.1 add-in  
cards)  
Two PCI Express 1.1 x1 connectors  
Three PCI bus connectors  
BIOS  
The BIOS provides the Power-On Self-Test (POST), the BIOS Setup program, and the  
PCI/PCI Express auto-configuration utilities. The BIOS is stored in the Serial  
Peripheral Interface (SPI) Flash device.  
The BIOS can be updated by following the instructions on page 61 in Chapter 3.  
Serial ATA Auto Configuration  
If you install a Serial ATA device (such as a hard drive) in your computer, the auto-  
configuration utility in the BIOS automatically detects and configures the device for  
your computer. You do not need to run the BIOS Setup program after installing a  
Serial ATA device. You can override the auto-configuration options by specifying  
manual configuration in the BIOS Setup program.  
PCI* and PCI Express* Auto Configuration  
If you install a PCI/PCI Express add-in card in your computer, the PCI/PCI Express  
auto-configuration utility in the BIOS automatically detects and configures the  
resources (IRQs, DMA channels, and I/O space) for that add-in card. You do not need  
to run the BIOS Setup program after you install a PCI/PCI Express add-in card.  
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Security Passwords  
The BIOS includes security features that restrict whether the BIOS Setup program can  
be accessed and who can boot the computer. A supervisor password and a user  
password can be set for the BIOS Setup and for booting the computer, with the  
following restrictions:  
The supervisor password gives unrestricted access to view and change all Setup  
options. If only the supervisor password is set, pressing <Enter> at the password  
prompt of Setup gives the user restricted access to Setup.  
If both the supervisor and user passwords are set, you must enter either the  
supervisor password or the user password to access Setup. Setup options are then  
available for viewing and changing depending on whether the supervisor or user  
password was entered.  
Setting a user password restricts who can boot the computer. The password  
prompt is displayed before the computer is booted. If only the supervisor  
password is set, the computer boots without asking for a password. If both  
passwords are set, you can enter either password to boot the computer.  
Related Links:  
For instructions on resetting the password, go to Clearing Passwords on page 54.  
Hardware Management  
The hardware management features of Intel Desktop Board DP45SG enable the board  
to be compatible with the Wired for Management (WfM) specification. The board has  
several hardware management features including the following:  
Fan speed monitoring and control  
Thermal and voltage monitoring  
Chassis intrusion detection  
Hardware Monitoring and Fan Speed Control  
The features of the hardware monitoring and fan speed control include:  
Monitoring of power supply voltages to detect levels above and below acceptable  
values  
Intel Precision Cooling Technology fan speed control, delivering acoustically-  
optimized thermal management  
A thermal sensor in the processor and a remote thermal sensor on the board  
Thermally monitored closed-loop fan control, for all onboard fans, that can adjust  
fan speed or switch the fans off as needed  
Intel® Precision Cooling Technology  
Intel Precision Cooling Technology automatically adjusts processor fan speed based on  
the processor temperature and adjusts chassis fan speeds based on the internal  
system temperature.  
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Desktop Board Features  
Chassis Intrusion  
The board supports a chassis security feature that detects if the chassis cover has  
been removed. The security feature uses a mechanical switch on the chassis that can  
be connected to the chassis intrusion header on the Desktop Board. See Figure 23 for  
the location of the chassis intrusion header.  
Power Management  
Power management is implemented at several levels, including software support  
through the Advanced Configuration and Power Interface (ACPI) and the following  
hardware support:  
Power connectors  
Fan headers  
LAN wake capabilities  
Instantly Available PC technology (Suspend to RAM)  
+5 V standby power indicator LED  
Wake from USB  
PCI Power Management Event signal (PME#) wakeup support  
PCI Express WAKE# signal wakeup support  
Wake from Consumer IR  
Software Support  
ACPI  
ACPI gives the operating system direct control over the power management and Plug  
and Play functions of a computer. The use of ACPI with the Desktop Board requires an  
operating system that provides full ACPI support.  
Hardware Support  
Power Connectors  
ATX12V-compliant power supplies can turn off the computer power through system  
control. When an ACPI-enabled computer receives the correct command, the power  
supply removes all non-standby voltages.  
When resuming from an AC power failure, the computer returns to the power state it  
was in before power was interrupted (either on or off). The computer’s response can  
be set by using the Last Power State feature in the BIOS Setup program’s Boot menu.  
The Desktop Board has three power connectors. See Figure 26 on page 52 for the  
location of the power connectors.  
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Fan Headers  
The function/operation of the fans is as follows:  
The fans are on when the computer is in the ACPI S0 state.  
The fans are off when the computer is in the ACPI S3, S4, or S5 state.  
Each fan header is wired to a tachometer input of the hardware monitoring and  
control device.  
All fan headers support closed-loop fan control that can adjust the fan speed or  
switch the fan on or off as needed.  
All fan headers have a +12 V DC connection.  
The Desktop Board has a 4-pin processor fan header, one 4-pin and two 3-pin chassis  
fan headers.  
LAN Wake Capabilities  
CAUTION  
For LAN wake capabilities, the 5 V standby line for the power supply must be capable  
of delivering adequate +5 V standby current. Failure to provide adequate standby  
current when using this feature can damage the power supply.  
LAN wakeup capabilities enable remote wake-up of the computer through a network.  
The LAN subsystem monitors network traffic and upon detecting a Magic Packet*  
frame, it asserts a wake-up signal that powers up the computer.  
Instantly Available PC Technology  
CAUTIONS  
For Instantly Available PC technology, the 5 V standby line for the power supply must  
be capable of delivering adequate +5 V standby current. Failure to provide adequate  
standby current when using this feature can damage the power supply and/or effect  
ACPI S3 sleep state functionality.  
Power supplies used with this Desktop Board must be able to provide enough standby  
current to support the standard Instantly Available (ACPI S3 sleep state) configuration.  
If the standby current necessary to support multiple wake events from the PCI and/or  
USB buses exceeds power supply capacity, the Desktop Board may lose register  
settings stored in memory.  
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-  
RAM) sleep state. While in the S3 sleep state, the computer will appear to be off. If  
the computer has a dual-colored power LED on the front panel, the sleep state is  
indicated by the LED turning amber. When signaled by a wake-up device or event, the  
computer quickly returns to its last known awake state.  
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Desktop Board Features  
The Desktop Board supports the PCI Bus Power Management Interface Specification.  
Add-in cards that support this specification can participate in power management and  
can be used to wake the computer.  
+5 V Standby Power Indicator  
CAUTION  
If the AC power has been switched off and the standby power indicator is still lit,  
disconnect the power cord before installing or removing any devices connected to the  
board. Failure to do so could damage the board and any attached devices.  
The Desktop Board’s standby power indicator, shown in Figure 3, is lit when there is  
standby power still present on the board even when the computer appears to be off.  
For example, when this LED is lit, standby power is still present at the memory module  
sockets and the PCI/PCI Express connectors.  
Figure 3. Location of the Standby Power Indicator  
For more information on standby current requirements for the Desktop Board, refer to  
the Technical Product Specification by going to the following link, finding the product,  
and selecting Product Documentation from the left-hand menu:  
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Wake from USB  
NOTE  
Wake from USB requires the use of a USB peripheral that supports Wake from USB  
and an operating system that supports Wake from USB.  
USB bus activity wakes the computer from an ACPI S3 state.  
PME# Signal Wake-up Support  
When the PME# signal on the PCI bus is asserted, the computer wakes from an  
ACPI S1, S3, S4, or S5 state.  
WAKE# Signal Wake-up Support  
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from  
an ACPI S1, S3, S4, or S5 state.  
Wake from CIR  
Consumer IR device activity wakes the computer from an ACPI S1 or S3 state.  
ENERGY STAR* Capable  
In 2007, the US Department of Energy and the US Environmental Protection Agency  
revised the ENERGY STAR requirements. Intel worked directly with these two  
governmental agencies to define the new requirements. This Desktop Board meets  
the ENERGY STAR Category C.  
For information and recommendations concerning the new ENERGY STAR  
requirements, go to the following location http://intel.com/go/energystar.  
Speaker  
A speaker is mounted on the Desktop Board. The speaker provides audible error code  
(beep code) information during the Power-On Self-Test (POST). Refer to Appendix A  
for a description of the board’s beep codes.  
Battery  
A battery on the Desktop Board keeps the values in CMOS RAM and the clock current  
when the computer is turned off. Go to page 55 for instructions on how to replace the  
battery.  
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Desktop Board Features  
Real-Time Clock  
The Desktop Board has a time-of-day clock and 100-year calendar. The battery on the  
Desktop Board keeps the clock current when the computer is turned off.  
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Intel Desktop Board DP45SG Product Guide  
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2 Installing and Replacing Desktop  
Board Components  
This chapter tells you how to:  
Install the I/O shield  
Install and remove the Desktop Board  
Install and remove a processor  
Install the ICH heat sink decorative cover (optional)  
Install and remove memory  
Install and remove PCI Express x16 cards  
Connect the Serial ATA cables  
Connect to the internal headers and connectors  
Connect to the audio system  
Connect chassis fan and power supply cables  
Set the BIOS configuration jumper  
Clear passwords  
Replace the battery  
Before You Begin  
CAUTIONS  
The procedures in this chapter assume familiarity with the general terminology  
associated with personal computers and with the safety practices and regulatory  
compliance required for using and modifying electronic equipment.  
Disconnect the computer from its power source and from any telecommunications  
links, networks, or modems before performing any of the procedures described in this  
chapter. Failure to disconnect power, telecommunications links, networks, or modems  
before you open the computer or perform any procedures can result in personal injury  
or equipment damage. Some circuitry on the board can continue to operate even  
though the front panel power button is off.  
Follow these guidelines before you begin:  
Always follow the steps in each procedure in the correct order.  
Set up a log to record information about your computer, such as model, serial  
numbers, installed options, and configuration information.  
Electrostatic discharge (ESD) can damage components. Perform the procedures  
described in this chapter only at an ESD workstation using an antistatic wrist strap  
and a conductive foam pad. If such a station is not available, you can provide  
some ESD protection by wearing an antistatic wrist strap and attaching it to a  
metal part of the computer chassis.  
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Intel Desktop Board DP45SG Product Guide  
Installation Precautions  
When you install and test the Intel Desktop Board, observe all warnings and cautions  
in the installation instructions.  
To avoid injury, be careful of:  
Sharp pins on connectors  
Sharp pins on printed circuit assemblies  
Rough edges and sharp corners on the chassis  
Hot components (such as processors, voltage regulators, and heat sinks)  
Damage to wires that could cause a short circuit  
Observe all warnings and cautions that instruct you to refer computer servicing to  
qualified technical personnel.  
Prevent Power Supply Overload  
Do not overload the power supply output. To avoid overloading the power supply,  
make sure that the calculated total current loads of all the modules within the  
computer is less than the output current rating of each of the power supplies output  
circuits.  
Observe Safety and Regulatory Requirements  
Read and follow the instructions in this section and the instructions supplied with the  
chassis and associated modules. If you do not follow these instructions and the  
instructions provided by the chassis and module suppliers, you increase your safety  
risk and the possibility of noncompliance with regional laws and regulations. If the  
instructions for the chassis are inconsistent with these instructions or the instructions  
for associated modules, contact the supplier to find out how you can ensure that your  
computer meets safety and regulatory requirements.  
For information about the Desktop Board’s regulatory compliance, go to Appendix B.  
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Installing and Replacing Desktop Board Components  
Installing the I/O Shield  
The Desktop Board comes with an I/O shield. When installed in the chassis, the shield  
blocks radio frequency transmissions, protects internal components from dust and  
foreign objects, and promotes correct airflow within the chassis.  
Install the I/O shield before installing the Desktop Board in the chassis. Place the  
shield inside the chassis as shown in Figure 4. Press the shield into place so that it fits  
tightly and securely. If the shield does not fit, obtain a properly sized shield from the  
chassis supplier.  
Figure 4. Installing the I/O Shield  
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Intel Desktop Board DP45SG Product Guide  
Installing and Removing the Desktop Board  
CAUTION  
Only qualified technical personnel should perform this procedure. Disconnect the  
computer from its power source before performing the procedures described here.  
Failure to disconnect the power before you open the computer can result in personal  
injury or equipment damage.  
Refer to your chassis manual for instructions on installing and removing the Desktop  
Board.  
Figure 5 shows the location of the mounting screw holes for Intel Desktop Board  
DP45SG.  
Figure 5. Intel Desktop Board DP45SG Mounting Screw Hole Locations  
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Installing and Replacing Desktop Board Components  
Installing and Removing a Processor  
Instructions on how to install the processor on the Desktop Board are given below.  
Installing a Processor  
CAUTION  
Before installing or removing a processor, make sure the AC power has been removed  
by unplugging the power cord from the computer; the standby power LED should not  
be lit (see Figure 3 on page 21). Failure to do so could damage the processor and the  
board.  
To install a processor, follow these instructions:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Open the socket lever by pushing the lever down and away from the socket  
(Figure 6, A and B).  
Figure 6. Lift the Socket Lever  
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3. Lift the load plate (Figure 7, A). Do not touch the socket contacts (Figure 7, B).  
Figure 7. Lift the Load Plate  
4. Remove the plastic protective socket cover from the load plate (Figure 8). Do not  
discard the protective socket cover. Always replace the socket cover if the  
processor is removed from the socket.  
Figure 8. Remove the Protective Socket Cover  
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Installing and Replacing Desktop Board Components  
5. Remove the processor from the protective processor cover. Hold the processor  
only at the edges, being careful not to touch the bottom of the processor (see  
Figure 9). Do not discard the protective processor cover. Always replace the  
processor cover if the processor is removed from the socket.  
Figure 9. Remove the Processor from the Protective Processor Cover  
6. Hold the processor with your thumb and index fingers oriented as shown in  
Figure 10. Make sure your fingers align to the socket cutouts (Figure 10, A). Align  
notches (Figure 10, B) with the socket (Figure 10, C). Lower the processor straight  
down without tilting or sliding it in the socket.  
Figure 10. Install the Processor  
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7. Pressing down on the load plate (Figure 11, A), close and engage the socket lever  
Figure 11. Close the Load Plate  
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Installing and Replacing Desktop Board Components  
Installing the Processor Fan Heat Sink  
Intel Desktop Board DP45SG has mounting holes for a processor fan heat sink. For  
instructions on how to attach the processor fan heat sink to the Desktop Board, refer  
to the boxed processor manual.  
Connecting the Processor Fan Heat Sink Cable  
Connect the processor fan heat sink cable to the 4-pin processor fan header (see  
Figure 12). A fan with a 4-pin connector as shown in Figure 12, A is recommended;  
however, a fan with a 3-pin connector (Figure 12, B) can be used. However, since the  
fan with a 3-pin connector cannot use the onboard fan control, the fan will always  
operate at full speed.  
Figure 12. Connecting the Processor Fan Heat Sink Cable  
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Removing the Processor  
For instructions on how to remove the processor fan heat sink and processor, refer to  
the processor installation manual.  
Installing the ICH Heat Sink Decorative Cover  
(Optional)  
To install the ICH heat sink decorative cover, follow these instructions:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Remove the paper covering the adhesive strip on the bottom of the heat sink cover  
3. Place the heat sink cover on the ICH heat sink (Figure 13, B). Press down firmly to  
ensure that the adhesive adheres to the heat sink.  
Figure 13. Installing the ICH Heat Sink Decorative Cover  
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Installing and Replacing Desktop Board Components  
Installing and Removing Memory  
NOTE  
To be fully compliant with all applicable Intel SDRAM memory specifications, the board  
requires DIMMs that support the Serial Presence Detect (SPD) data structure.  
Intel Desktop board DP45SG has four 240-pin DDR3 DIMM sockets arranged as  
DIMM 0 and DIMM 1 in both Channel A and Channel B.  
NOTE  
Regardless of the memory configuration used (dual or single channel), Channel A,  
DIMM 0 must always be populated. This is a requirement of the ICH10R Manageability  
Engine feature.  
Guidelines for Dual Channel Memory Configuration  
Before installing DIMMs, read and follow these guidelines for dual channel  
configuration.  
Two or Four DIMMs  
Install a matched pair of DIMMs equal in speed and size (see Figure 14) in DIMM 0  
(blue) of channels A and B.  
Figure 14. Dual Channel Memory Configuration with Two DIMMs  
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If additional memory is to be used, install another matched pair of DIMMs in DIMM 1  
(black) in channels A and B (see Figure 15).  
Figure 15. Dual Channel Memory Configuration with Four DIMMs  
Three DIMMs  
If you want to use three DIMMs in a dual-channel configuration, install a matched pair  
of DIMMs equal in speed and size in DIMM 0 (blue) and DIMM 1 (black) of channel A.  
Install a DIMM equal in speed and total size of the DIMMs installed in channel A in  
either DIMM 0 or DIMM 1 of channel B (see Figure 16).  
Figure 16. Dual Channel Memory Configuration with Three DIMMs  
NOTE  
All other memory configurations will result in single channel memory operation.  
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Installing and Replacing Desktop Board Components  
Installing DIMMs  
To make sure you have the correct DIMM, place it on the illustration of the DDR3  
DIMM in Figure 17. All the notches should match with the DDR3 DIMM.  
Figure 17. Use DDR3 DIMMs  
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To install a DIMM, follow these steps:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Turn off all peripheral devices connected to the computer. Turn off the computer  
and disconnect the AC power cord.  
3. Remove the computer’s cover and locate the DIMM sockets (see Figure 18).  
Figure 18. Installing a DIMM  
4. Make sure the clips at either end of the DIMM socket(s) are pushed outward to the  
open position.  
5. Holding the DIMM by the edges, remove it from its anti-static package.  
6. Position the DIMM above the socket. Align the small notch at the bottom edge of  
the DIMM with the keys in the socket (see inset in Figure 18).  
7. Insert the bottom edge of the DIMM into the socket.  
8. When the DIMM is inserted, push down on the top edge of the DIMM until the  
retaining clips snap into place. Make sure the clips are firmly in place.  
9. Replace the computer’s cover and reconnect the AC power cord.  
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Installing and Replacing Desktop Board Components  
Removing DIMMs  
To remove a DIMM, follow these steps:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Turn off all peripheral devices connected to the computer. Turn off the computer.  
3. Remove the AC power cord from the computer.  
4. Remove the computer’s cover.  
5. Gently spread the retaining clips at each end of the DIMM socket. The DIMM pops  
out of the socket.  
6. Hold the DIMM by the edges, lift it away from the socket, and store it in an  
anti-static package.  
7. Reinstall and reconnect any parts you removed or disconnected to reach the DIMM  
sockets.  
8. Replace the computer’s cover and reconnect the AC power cord.  
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Installing and Removing a PCI Express x16  
Card  
CAUTION  
When installing a PCI Express card on the Desktop Board, ensure that the card is fully  
seated in the PCI Express connector before you power on the system. If the card is  
not fully seated in the connector, an electrical short may result across the connector  
pins. Depending on the over-current protection of the power supply, certain Desktop  
Board components and/or traces may be damaged.  
Installing Multiple PCI Express x16 Graphics Cards  
If you are installing a single PCI Express x16 graphics card, install it in the PCI Express  
primary connector (Figure 19, A) for optimum performance. However, if you are  
installing two PCI Express x16 graphics cards, install one in the PCI Express x16  
primary connector (Figure 19, A) and one in the secondary connector (Figure 19, B).  
Figure 19. Installing Two PCI Express x16 Graphics Cards  
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Installing and Replacing Desktop Board Components  
Installing a PCI Express x16 Card  
Follow these instructions to install any PCI Express x16 card:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Place the card in a PCI Express x16 connector (Figure 20, A) and press down on  
the card until it is completely seated in the connector and the card retention notch  
on the card snaps into place around the retention mechanism pin on the connector.  
3. Secure the card’s metal bracket to the chassis back panel with a screw  
Figure 20. Installing a PCI Express x16 Card  
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Intel Desktop Board DP45SG Product Guide  
Removing a PCI Express x16 Card  
Follow these instructions to remove a PCI Express x16 card from a connector:  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Remove the screw (Figure 21, A) that secures the card’s metal bracket to the  
chassis back panel.  
3. Push the card ejector lever down using the tip of a pencil or similar tool  
(Figure 21, B) in the notch. This will release the card from the connector (C).  
4. Pull the card straight up.  
Figure 21. Removing a PCI Express x16 Card  
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Installing and Replacing Desktop Board Components  
Connecting the Serial ATA (SATA) Cables  
SATA cables support the Serial ATA protocol. Each cable can be used to connect one  
internal SATA drive to the Desktop Board. For correct cable function:  
1. Observe the precaution in “Before You Begin” on page 25.  
2. Attach one end of the SATA cable to one of the SATA connectors on the board  
(Figure 22, A) and attach the other end of the cable to the SATA drive  
Figure 22. Connecting a Serial ATA Cable  
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Connecting to the Internal Headers and  
Connectors  
Before connecting cables to any of the internal headers or connectors, observe the  
precautions in “Before You Begin” on page 25. Figure 23 shows the location of the  
internal headers and connectors on Intel Desktop Board DP45SG.  
Item Description  
Item  
Description  
A
B
C
D
E
F
S/PDIF  
Front panel audio  
IEEE 1394a  
Back panel CIR emitter (output)  
Front panel CIR receiver (input)  
Chassis intrusion  
G
H
I
J
K
Alternate front panel power LED  
Front panel  
HD Audio Link  
USB 2.0 (3)  
Serial  
Figure 23. Internal Headers and Connectors  
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S/PDIF Connector  
Figure 23, A shows the location of the S/PDIF connector. This connector can be used  
with HDMI video cards that do not work with the HD Audio Link header (see  
Table 4 shows the pin assignments and signal names for the S/PDIF connector.  
Table 4. S/PDIF Connector Signal Names  
Pin  
1
Description  
Vcc  
2
S/PDIF Out  
Ground  
3
Front Panel Audio Header  
Figure 23, B shows the location of the front panel audio header. The front panel audio  
header supports both High Definition (HD) Audio and AC’97 Audio. Table 5 shows the  
pin assignments and signal names for HD Audio and Table 6 shows the pin  
assignments and signal names for AC’97 Audio.  
Table 5. Front Panel Audio Header Signal Names for HD Audio  
Pin  
1
Signal Name  
PORT 1L  
Pin  
2
Signal Name  
GND  
3
PORT 1R  
4
PRESENCE#  
SENSE1_RETURN  
KEY (no pin)  
SENSE2_RETURN  
5
PORT 2R  
6
7
SENSE_SEND  
PORT 2L  
8
9
10  
Table 6. Front Panel Audio Header Signal Names for AC ’97 Audio  
Pin  
1
Signal Name  
MIC  
Pin  
2
Signal Name  
AUD_GND  
3
MIC_BIAS  
FP_OUT_R  
AUD_5V  
4
AUD_GND  
5
6
FP_RETURN_R  
KEY (no pin)  
FP_RETURN_L  
7
8
9
FP_OUT_L  
10  
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IEEE 1394a Header  
Figure 23, C shows the location of the IEEE 1394a header. Table 7 shows the pin  
assignments and signal names for the IEEE 1394a header.  
Table 7. IEEE 1394a Header Signal Names  
Pin  
1
Signal Name  
TPA1+  
Pin  
2
Signal Name  
TPA1-  
3
Ground  
4
Ground  
TPA2-  
5
TPA2+  
6
7
+12 V  
8
+12 V  
9
Key (no pin)  
10  
Ground  
Consumer IR (CIR) Headers  
The Desktop Board has two CIR headers: the input or receiver header (Figure 23, E)  
and the output or emitter header (Figure 23, D). The receiver header consists of a  
filtered translated infrared input compliant with Microsoft CIR specifications and a  
“learning” infrared input. The learning input is a high-pass input which the computer  
can use to “learn” to speak the infrared communication language of other user  
remotes. The emitter header consists of two output ports which the computer can use  
to emulate “learned” infrared commands in order to control external electronic  
hardware.  
NOTE  
The Consumer IR option must be enabled in the system BIOS before it can  
function. Press <F2> at boot to enter the system BIOS, and go to Advanced >  
Peripheral Configuration > Enhanced Consumer IR, and set this option to  
Enabled.  
Table 8 shows the pin assignments and signal names for the front panel CIR receiver  
(input) header and Table 9 shows the pin assignments and signal names for the back  
panel CIR emitter (output) header.  
Table 8. Front Panel CIR Receiver (Input) Header Signal Names  
Pin  
1
Signal Name  
Ground  
Pin  
2
Signal Name  
LED  
3
No Connection  
+5 V Standby  
Key (no pin)  
4
Learn-In  
Vcc  
5
6
7
8
CIR Input  
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Installing and Replacing Desktop Board Components  
Table 9. Back Panel CIR Header Emitter (Output) Header Signal Names  
Pin  
1
Signal Name  
Emitter Out 1  
Ground  
Pin  
2
Signal Name  
Emitter Out 2  
Key (no pin)  
Jack Detect 2  
3
4
5
Jack Detect 1  
6
Chassis Intrusion Header  
Figure 23, F shows the location of the chassis intrusion header. This header can be  
connected to a mechanical switch on the chassis to detect if the chassis cover is  
removed.  
Table 10 shows the pin assignments and signal names for the chassis intrusion header.  
Table 10.Chassis Intrusion Header Signal Names  
Pin  
1
Description  
Intruder  
2
Ground  
Front Panel Header  
Figure 23, H shows the location of the front panel header. Table 11 shows the pin  
assignments and signal names for the front panel header.  
Table 11.Front Panel Header Signal Names  
Pin Description  
Hard Drive Activity LED  
Hard disk LED pull-up to +5 V Out  
In/Out Pin Description  
In/Out  
Power LED  
1
3
2
4
Front panel green LED  
Front panel yellow LED  
On/Off Switch  
Power switch  
Out  
Out  
Hard disk active LED  
Reset Switch  
Ground  
Out  
5
7
6
8
In  
Reset switch  
Power  
In  
Ground  
Not Connected  
No pin  
9
Power  
Out  
10  
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Alternate Front Panel Power LED Header  
Figure 23, G shows the location of the alternate front panel power LED header. Pins 1  
and 3 of this header duplicate the signals on pins 2 and 4 of the front panel header. If  
your chassis has a three-pin power LED cable, connect it to this header.  
Table 12 shows the pin assignments and signal names for the alternate front panel  
power LED header.  
Table 12.Alternate Front Panel Power LED Header Signal Names  
Pin  
1
Description  
In/Out  
Front panel green LED  
No pin  
Out  
2
3
Front panel yellow LED  
Out  
HD Audio Link Header  
Figure 23, I shows the location of the HD Audio Link header. Table 13 shows the pin  
assignments and signal names for the HD Audio Link header.  
Table 13.HD Audio Link Header Signal Names  
Pin  
1
Signal Name  
BCLK  
Pin  
2
Signal Name  
Ground  
3
RST#  
4
DVDD_IO  
Ground  
5
SYNC  
6
7
SDO  
8
3.3V_DVDD_CORE  
+12 V  
9
SDI0  
10  
12  
14  
16  
11  
13  
15  
SDI1  
Key  
No Connection  
No Connection  
3.3V_DUAL  
Ground  
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USB 2.0 Headers  
Figure 23, J shows the location of the USB 2.0 headers. Table 14 shows the pin  
assignments and signal names for each USB 2.0 header. Each USB header can be  
used to connect two USB devices.  
Table 14.USB 2.0 Header Signal Names  
USB Port A  
Signal Name  
Power (+5 V)  
USB Port B  
Signal Name  
Power (+5 V)  
D-  
Pin  
1
3
Pin  
2
4
D-  
5
D+  
6
D+  
7
9
Ground  
Key  
8
10  
Ground  
No Connection  
Note: USB ports may be assigned as needed.  
NOTE  
Computer systems that have an unshielded cable attached to a USB port might not  
meet FCC Class B requirements, even if no device or a low-speed USB device is  
attached to the cable. Use a shielded cable that meets the requirements for a  
full-speed USB device.  
Serial Port Header  
See Figure 23, E for the location of the serial port header. Table 15 shows the pin  
assignments for the header.  
Table 15.Serial Port Header Signal Names  
Pin  
1
Signal Name  
DCD  
Pin  
2
Signal Name  
RXD#  
3
TXD#  
Ground  
RTS  
4
DTR  
5
6
DSR  
7
8
CTS  
9
RI  
10  
No Connection  
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Connecting to the Flexible Audio System  
After installing the IDT* audio driver from the Intel® Express Installer DVD-ROM, the  
multi-channel audio feature can be enabled. Figure 24 shows the back panel audio  
connectors. The default connector assignments are shown in the table.  
Item  
A
Description  
Rear Surround Left and Right Channel  
Center Channel and LFE (Subwoofer)  
Side Surround Left and Right/Line In  
Line Out  
B
C
D
E
Mic In  
F
S/PDIF Digital Audio Out (Optical)  
Figure 24. Back Panel Audio Connectors  
NOTE  
The back panel line out connector is designed to power either headphones or amplified  
speakers only. Poor audio quality may occur if passive (non-amplified) speakers are  
connected to this output.  
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Connecting Chassis Fan and Power Supply  
Cables  
Connecting Chassis Fan Cables  
Connect chassis fan cables to the 3-pin and 4-pin chassis fan headers on the Desktop  
Board. Figure 25 shows the location of the chassis fan headers.  
Figure 25. Location of the Chassis Fan Headers  
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Connecting Power Supply Cables  
CAUTION  
Failure to use an appropriate power supply and/or not connecting the 12 V (2 x 2 pin)  
power connector to the Desktop Board may result in damage to the board or the  
system may not function properly.  
The 2 x 12 pin main power connector on the Desktop Board is backwards compatible  
with ATX12V power supplies with 2 x 10 connectors. Use of the 1 x 4 power connector  
is required with ATX12V power supplies when using PCI Express add-in cards that can  
consume up to 75 W. Figure 26 shows the location of the power connectors.  
Figure 26. Connecting Power Supply Cables  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Connect the 12 V processor core voltage power supply cable to the 2 x 2 pin  
connector.  
3. Connect the 1 x 4 power supply cable to the 1 x 4 connector.  
4. Connect the main power supply cable to the 2 x 12 pin connector.  
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Setting the BIOS Configuration Jumper  
NOTE  
Always turn off the power and unplug the power cord from the computer before  
moving the jumper. Moving the jumper with the power on may result in unreliable  
computer operation.  
Figure 27 shows the location of the Desktop Board’s BIOS configuration jumper block.  
Figure 27. Location of the BIOS Configuration Jumper Block  
The three-pin BIOS jumper block enables all board configurations to be done in the  
BIOS Setup program. Table 16 shows the jumper settings for the BIOS Setup  
program modes.  
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Table 16.Jumper Settings for the BIOS Setup Program Modes  
Jumper Setting  
Mode  
Description  
Normal (default) (1-2)  
The BIOS uses the current configuration and  
passwords for booting.  
Configure (2-3)  
Recovery (None)  
After the Power-On Self-Test (POST) runs, the  
BIOS displays the Maintenance Menu. Use this  
menu to clear passwords.  
The BIOS recovers data in the event of a failed  
BIOS update.  
Clearing Passwords  
This procedure assumes that the board is installed in the computer and the  
configuration jumper block is set to normal mode.  
1. Observe the precautions in "Before You Begin" on page 25.  
2. Turn off all peripheral devices connected to the computer. Turn off the computer.  
Disconnect the computer’s power cord from the AC power source (wall outlet or  
power adapter).  
3. Remove the computer cover.  
4. Find the configuration jumper block (see Figure 27).  
5. Place the jumper on pins 2-3 as shown below.  
6. Replace the cover, plug in the computer, turn on the computer, and allow it to  
boot.  
7. The computer starts the Setup program. Setup displays the Maintenance menu.  
8. Use the arrow keys to select Clear Passwords. Press <Enter> and Setup displays a  
pop-up screen requesting that you confirm clearing the password. Select Yes and  
press <Enter>. Setup displays the maintenance menu again.  
9. Press <F10> to save the current values and exit Setup.  
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10.Turn off the computer. Disconnect the computer’s power cord from the AC power  
source.  
11.Remove the computer cover.  
12.To restore normal operation, place the jumper on pins 1-2 as shown below.  
13.Replace the cover, plug in the computer, and turn on the computer.  
Replacing the Battery  
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When  
the computer is not plugged into a wall socket, the battery has an estimated life of  
three years. When the computer is plugged in, the standby current from the power  
supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at  
25 ºC with 3.3 VSB applied.  
When the voltage drops below a certain level, the BIOS Setup program settings stored  
in CMOS RAM (for example, the date and time) might not be accurate. Replace the  
battery with an equivalent one. Figure 28 on page 60 shows the location of the  
battery.  
CAUTION  
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be  
recycled where possible. Disposal of used batteries must be in accordance with local  
environmental regulations.  
PRECAUTION  
Risque d'explosion si la pile usagée est remplacée par une pile de type incorrect. Les  
piles usagées doivent être recyclées dans la mesure du possible. La mise au rebut des  
piles usagées doit respecter les réglementations locales en vigueur en matière de  
protection de l'environnement.  
FORHOLDSREGEL  
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier  
bør om muligt genbruges. Bortskaffelse af brugte batterier bør foregå i  
overensstemmelse med gældende miljølovgivning.  
OBS!  
Det kan oppstå eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier  
bør kastes i henhold til gjeldende miljølovgivning.  
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VIKTIGT!  
Risk för explosion om batteriet ersätts med felaktig batterityp. Batterier ska kasseras  
enligt de lokala miljövårdsbestämmelserna.  
VARO  
Räjähdysvaara, jos pariston tyyppi on väärä. Paristot on kierrätettävä, jos se on  
mahdollista. Käytetyt paristot on hävitettävä paikallisten ympäristömääräysten  
mukaisesti.  
VORSICHT  
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie  
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen  
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen  
des Herstellers entsprechend.  
AVVERTIMENTO  
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.  
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per  
disfarsi delle pile usate, seguire le istruzioni del produttore.  
PRECAUCIÓN  
Existe peligro de explosión si la pila no se cambia de forma adecuada. Utilice  
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del  
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del  
fabricante.  
WAARSCHUWING  
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type  
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het  
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.  
ATENÇÃO  
Haverá risco de explosão se a bateria for substituída por um tipo de bateria incorreto.  
As baterias devem ser recicladas nos locais apropriados. A eliminação de baterias  
usadas deve ser feita de acordo com as regulamentações ambientais da região.  
AŚCIAROŽZNAŚĆ  
Існуе рызыка выбуху, калі заменены акумулятар неправільнага тыпу.  
Акумулятары павінны, па магчымасці, перепрацоўвацца. Пазбаўляцца ад старых  
акумулятараў патрэбна згодна з мясцовым заканадаўствам па экалогіі.  
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UPOZORNÌNÍ  
V případě výměny baterie za nesprávný druh může dojít k výbuchu. Je-li to možné,  
baterie by měly být recyklovány. Baterie je třeba zlikvidovat v souladu s místními  
předpisy o životním prostředí.  
Προσοχή  
Υπάρχει κίνδυνος για έκρηξη σε περίπτωση που η μπαταρία αντικατασταθεί από μία  
λανθασμένου τύπου. Οι μπαταρίες θα πρέπει να ανακυκλώνονται όταν κάτι τέτοιο είναι  
δυνατό. Η απόρριψη των χρησιμοποιημένων μπαταριών πρέπει να γίνεται σύμφωνα με  
τους κατά τόπο περιβαλλοντικούς κανονισμούς.  
VIGYÁZAT  
Ha a telepet nem a megfelelő típusú telepre cseréli, az felrobbanhat. A telepeket  
lehetőség szerint újra kell hasznosítani. A használt telepeket a helyi környezetvédelmi  
előírásoknak megfelelően kell kiselejtezni.  
AWAS  
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri  
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi  
peraturan alam sekitar tempatan.  
OSTRZEŻENIE  
Istnieje niebezpieczeństwo wybuchu w przypadku zastosowania niewłaściwego typu  
baterii. Zużyte baterie należy w miarę możliwości utylizować zgodnie z odpowiednimi  
przepisami ochrony środowiska.  
PRECAUŢIE  
Risc de explozie, dacă bateria este înlocuită cu un tip de baterie necorespunzător.  
Bateriile trebuie reciclate, dacă este posibil. Depozitarea bateriilor uzate trebuie să  
respecte reglementările locale privind protecţia mediului.  
ВНИМАНИЕ  
При использовании батареи несоответствующего типа существует риск ее взрыва.  
Батареи должны быть утилизированы по возможности. Утилизация батарей должна  
проводится по правилам, соответствующим местным требованиям.  
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UPOZORNENIE  
Ak batériu vymeníte za nesprávny typ, hrozí nebezpečenstvo jej výbuchu. Batérie by  
sa mali podľa možnosti vždy recyklovať. Likvidácia použitých batérií sa musí vykonávať  
v súlade s miestnymi predpismi na ochranu životného prostredia.  
POZOR  
Zamenjava baterije z baterijo drugačnega tipa lahko povzroči eksplozijo.  
Če je mogoče, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi  
okoljevarstvenimi predpisi.  
.
UYARI  
Yanlış türde pil takıldığında patlama riski vardır. Piller mümkün olduğunda geri  
dönüştürülmelidir. Kullanılmış piller, yerel çevre yasalarına uygun olarak atılmalıdır.  
OСТОРОГА  
Використовуйте батареї правильного типу, інакше існуватиме ризик вибуху.  
Якщо можливо, використані батареї слід утилізувати. Утилізація використаних  
батарей має бути виконана згідно місцевих норм, що регулюють охорону довкілля.  
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To replace the battery, follow these steps:  
1. Observe the precautions in "Before You Begin" (see page 25).  
2. Turn off all peripheral devices connected to the computer. Disconnect the  
computer’s power cord from the AC power source (wall outlet or power adapter).  
3. Remove the computer cover.  
4. Locate the battery on the board (see Figure 28).  
5. With a medium flat-bladed screwdriver, gently pry the battery free from its  
connector. Note the orientation of the “+” and “-” on the battery.  
6. Install the new battery in the connector, orienting the “+” and “-” correctly.  
7. Replace the computer cover.  
Figure 28. Removing the Battery  
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3 Updating the BIOS  
The BIOS Setup program can be used to view and change the BIOS settings for the  
computer. You can access the BIOS Setup program by pressing the <F2> key after  
the Power-On Self-Test (POST) memory test begins and before the operating system  
boot begins.  
This chapter tells you how to update the BIOS by either using the Intel Express BIOS  
Update utility or the Iflash Memory Update utility, and how to recover the BIOS if an  
update fails.  
Updating the BIOS with the Intel® Express  
BIOS Update Utility  
With the Intel Express BIOS Update utility you can update the system BIOS while in  
the Windows environment. The BIOS file is included in an automated update utility  
that combines the functionality of the Intel® Flash Memory Update Utility and the ease  
of use of Windows-based installation wizards.  
To update the BIOS with the Intel Express BIOS Update utility:  
1. Go to the Intel World Wide Web site:  
2. Navigate to the Intel Desktop Board DP45SG page, click “[view] Latest BIOS  
updates,” and select the Express BIOS Update utility file.  
3. Download the file to your hard drive. (You can also save this file to a removable  
USB device. This is useful if you are updating the BIOS for multiple identical  
systems.)  
4. Close all other applications. This step is required. Your system will be rebooted at  
the last Express BIOS Update window.  
5. Double-click the executable file from the location on your hard drive where it was  
saved. This runs the update program.  
6. Follow the instructions provided in the dialog boxes to complete the BIOS update.  
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Updating the BIOS with the ISO Image BIOS  
Update File or the Iflash Memory Update  
Utility  
You can use the information in this section to update the BIOS using either the Iflash  
Memory Update Utility or the ISO Image BIOS update file.  
Obtaining the BIOS Update File  
You can update to a new version of the BIOS by using the ISO Image BIOS update file  
(recommended), or Iflash BIOS update file.  
The ISO Image BIOS update file is a standardized image of a bootable CD-ROM that  
can be used to create a bootable CD that will update the BIOS.  
The Iflash BIOS update file is a compressed file that contains the files you need to  
update the BIOS. The Iflash BIOS update file contains:  
New BIOS file including the Intel® Management Engine (Intel® ME) Firmware  
Image  
Intel® Integrator Toolkit Configuration File (optional)  
Intel Flash Memory Update Utility  
You can obtain either of these files through your computer supplier or by navigating to  
the Intel Desktop Board DP45SG page on the Intel World Wide Web site at:  
Navigate to the Intel Desktop Board DP45SG page, click “[view] Latest BIOS updates,”  
and select the ISO Image BIOS Update or Iflash BIOS Update utility file.  
Updating the BIOS with the ISO Image BIOS Update  
File  
The ISO Image BIOS update allows for the update of an Intel® Desktop Board BIOS to  
the latest production release regardless of the operating system installed on the  
computer's hard drive and without the need to remove the BIOS configuration jumper.  
It requires a blank CD-R, a read/writeable CD drive, and software capable of  
uncompressing and writing the ISO image file to CD.  
The image uses ISOLINUX* bootloader and automatically launches a script to upgrade  
the BIOS via the Iflash utility.  
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Updating the BIOS  
CAUTION  
Do not interrupt the process or the system may not function properly.  
Follow these instructions to upgrade the BIOS using the ISO Image BIOS file:  
1. Download the ISO Image BIOS file.  
2. Using software capable of uncompressing and writing an ISO image file to CD, burn  
the data to a blank CD.  
NOTE  
Copying the ISO Image BIOS file to CD will not work. The completed CD should  
contain multiple files and a directory.  
3. Insert the CD that was created in the CD-ROM drive of the computer to be  
upgraded and boot the system.  
4. When the "Press ENTER to continue booting from CD-ROM" prompt appears, press  
the Enter key. The system will boot from the hard drive if no key is pressed within  
15 seconds.  
5. At the "Welcome to the Intel Desktop Board BIOS Upgrade CD-ROM" page, press  
any key to confirm the BIOS upgrade operation.  
6. Wait for the BIOS upgrade process to complete.  
CAUTION  
DO NOT POWER DOWN YOUR COMPUTER before the update is complete. The update  
may take up to 5 minutes.  
Updating the BIOS with the Iflash Memory Update  
Utility  
With the Iflash Memory update utility you can update the system BIOS from a  
bootable CD-ROM, bootable USB flash drive, or other bootable USB media. The utility  
available on the Intel World Wide Web site provides a simple method for creating a  
bootable CD-ROM that will automatically update your BIOS. The Iflash BIOS update  
files can also be extracted locally to your hard drive and copied to a bootable USB  
flash drive or other bootable USB media.  
The Iflash Memory update utility allows you to:  
Update the BIOS and Intel Management Engine in flash memory  
Update the language section of the BIOS  
NOTE  
Review the instructions distributed with the update utility before attempting a BIOS  
update.  
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CAUTION  
Do not interrupt the process or the system may not function properly.  
1. Uncompress the BIOS update file and copy the .BIO file, IFLASH.EXE, and .ITK file  
(optional) to a bootable USB flash drive or other bootable USB media.  
2. Configure the BIOS or use the F10 option during POST to boot to the USB device.  
3. Manually run the IFLASH.EXE file from the USB device and manually update the  
BIOS.  
Recovering the BIOS  
It is unlikely that anything will interrupt the BIOS update; however, if an interruption  
occurs, the BIOS could be damaged. Due to BIOS size and recovery requirements, a  
CD-R with the .BIO file in the root directory will be required.  
For more information about updating the Intel Desktop Board BIOS or recovering from  
a BIOS update failure, go to  
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4 Configuring for RAID Using Intel®  
Matrix Storage Technology (Intel®  
MST)  
NOTE  
Intel Matrix Storage Technology requires Microsoft Windows Vista or Microsoft  
Windows XP operating system and SATA hard drives.  
Configuring the BIOS  
1. Assemble your system and attach two or more SATA hard drives to the SATA  
connectors.  
2. Enter system BIOS Setup by pressing <F2> after the Power-On-Self-Test (POST)  
memory tests begin.  
3. Go to Advanced Drive Configuration Configure SATA as; ensure that  
RAID is selected.  
4. Then save your settings by pressing <F10>.  
Creating Your RAID Set  
1. Upon re-boot, you will see the following Intel Matrix Storage Manager option ROM  
status message on the screen: Press <Ctrl-I> to enter the RAID  
Configuration Utility. Press <Ctrl-I> and enter the RAID Configuration Utility.  
2. In the Intel Matrix Storage Manager option ROM Main Menu, select option #1:  
Create RAID Volume. Enter a volume name (using English alphanumeric ASCII  
characters) and press <Enter>.  
3. Use the arrow keys to select RAID 0 or RAID 1 (if only two SATA drives are  
available), RAID 5 and RAID 10 (these options will only appear if three or four  
SATA drives are installed respectively). Press <Enter> once you have selected the  
RAID LEVEL.  
4. Select the drives to be used in the RAID array (only if there are more than two  
drives available) and press <Enter>.  
5. Select the strip size, if necessary, and press <Enter>.  
6. Enter the size of the volume (if you enter less than the maximum volume size, you  
can then create a second RAID array on the remaining portion of your volume) and  
press <Enter>.  
7. Finally, press <Enter> to Create Volume.  
8. Exit the Option ROM user interface by pressing <Esc> or going to the EXIT option  
in the MAIN MENU.  
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Loading the Intel Matrix Storage Technology  
RAID Drivers and Software for Microsoft  
Windows* XP  
NOTE  
You wll not be required to perform these steps if you will be using the Microsoft  
Windows Vista operating system as the ICH10R driver is supported natively.  
1. Begin Windows Setup by booting from the Windows installation CD.  
2. At the beginning of Windows Setup, press <F6> to install a third-party SCSI or  
RAID driver. When prompted, insert the diskette that contains the Intel Matrix  
Storage Technology RAID Driver in a USB floppy disk drive. Refer to  
http://support.microsoft.com/kb/916196/en-us for information on supported USB  
floppy disk drives. Install the Intel® ICH10 SATA RAID Controller driver.  
3. Finish the Windows installation and install all necessary drivers.  
4. Install the Intel Matrix Storage Console software via the Intel Express Installer  
Driver and Softwared DVD included with your Desktop Board or after downloading  
The Intel Matrix Storage Console software can be used to manage the RAID  
configuration.  
Setting Up a “RAID Ready” System  
The Intel Matrix Storage Technology Console software offers the flexibility to upgrade  
from a single Serial ATA drive to RAID without reinstalling the operating system, when  
a second SATA hard drive is added to the system.  
Follow the steps described above in: "Configuring the BIOS" and "Loading the Intel  
Matrix Storage Technology RAID Drivers and Software."  
Once additional SATA drives have been added to the system, open the Intel Matrix  
Storage Technology Console Software and follow the directions to update to a RAID  
setup.  
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5 Configuring for Intel® Rapid  
Recover Technology (Intel® RRT)  
Intel Rapid Recover technology utilizes RAID 1 (mirroring) functionality to copy data  
from a designated master drive to a designated recovery drive. The master and  
recovery drives must span 100 percent of the available hard drive space of an array,  
and only one recovery volume can be present on a system.  
You can select whether you want the master drive data to be copied to the recovery  
drive continuously or on request. When using the Continuous Update policy, changes  
made to the data on the master drive while the recovery drive is disconnected or  
offline are automatically copied to the recovery drive when it is reconnected.  
When using the Update On Request policy, the master drive data can be restored to a  
previous state by copying the data on the recovery drive back to the master drive.  
Enabling Intel Rapid Recover Technology  
NOTE  
Intel Rapid Recover Technology does not support RAID 5.  
Intel Rapid Recover Technology can be Enabled or Disabled in the system BIOS menu.  
To enable Intel Rapid Recover Technology, complete following steps:  
1. Enter the BIOS menu by pressing the <F2> key early during system POST.  
2. Go to Advanced Drive Configuration.  
3. For the setting Intel Rapid Recover Technology, select to enable it.  
4. For the setting Configure SATA as, ensure it is set to RAID.  
CAUTION  
If Configure SATA as was previously not set to RAID and you already have an  
operating system installed, you must reinstall it. Follow the instructions in  
Chapter 4 to install the Intel Matrix Storage RAID driver during the operating  
system installation.  
5. Exit and save settings. Proceed to “Creating a Recovery Volume.”  
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Creating a Recovery Volume  
A recovery volume consists of two disks – a master disk and a recovery disk.  
A recovery volume can be created with either the RAID Option ROM (OROM) or the  
Intel® Matrix Storage Console application.  
Creating a Recovery Volume Using the RAID Option  
ROM  
To create a recovery volume using the RAID OROM, complete the following steps:  
1. Enter the RAID OROM by pressing the <Ctrl> and <I> keys simultaneously when  
prompted during system POST.  
2. Under the Create RAID volume option, select the option to create a recovery  
volume.  
3. Select the master disk and the recovery disk.  
NOTE  
The master disk size must be less than or equal to the recovery disk size.  
The RAID OROM Recovery menu provides the following options:  
1. Disable Continuous Update  
2. Boot from Recovery Disk  
3. Boot from Master Disk  
Creating a Recovery Volume Using the Intel® Matrix  
Storage Console  
To create a recovery volume using the Intel Matrix Storage Console, the system must  
be configured in RAID mode with two drives. Boot the system into Microsoft Windows  
and open the Intel Matrix Storage Console application.  
A recovery volume can be created in the Basic mode or the Advanced mode.  
To create a recovery volume using the Basic mode, complete the following steps:  
1. Select Protect data using Intel® Rapid Recover Technology.  
2. A dialog box will pop up. Selecting Yes will start the volume creation process  
which can be monitored on the progress bar.  
To create a recovery volume using the Advanced mode, complete the following steps:  
1. Select Advanced Mode in the View menu.  
2. Select Create a Recovery Volume in the Actions menu.  
3. Select Next to continue.  
4. Select the master disk and select Next to continue.  
5. Select the recovery disk and select Next to continue.  
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Configuring for Intel® Rapid Recover Technology  
6. Select the Update policy – Continuous update or Update on request.  
7. Select Finish to complete the creation of the recovery volume.  
The system will synchronize the master disk with the recovery disk once after the  
creation of the recovery volume.  
Disk Synchronization Mode  
There are two modes of updating or synchronizing the recovery disk with the master  
disk – either continuous update or manual update.  
To change from Continuous Update mode to Update On Request mode using the Intel  
Matrix Storage Console, select the Advanced mode from the View menu, right-click  
on the recovery volume, and select Disable Continuous Update.  
To change from Update On Request mode to Continuous update mode, complete the  
following steps:  
1. Right-click on the recovery volume name and select Modify Volume.  
2. Select Next on the Modify Recovery Volume Wizard dialog box to continue.  
3. On the next screen, select Continuous update.  
4. Select Next and then Finish to complete the operation.  
Mounting the Recovery Disk  
NOTE  
Mounting the recovery disk will result in displaying the recovery disk in Microsoft  
Windows Explorer. The recovery disk contents will be write-protected to preserve data  
integrity with master disk.  
To mount the mount the recovery disk, complete the following steps:  
1. Make sure that the recovery volume is in Update On Request mode.  
2. Then right-click on the recovery volume name and select Access Recovery Drive  
Files.  
3. Select OK on the information dialog box.  
The recovery disk will now be mounted and can be seen in Microsoft Windows  
Explorer.  
NOTE  
Individual files or folders can be copied from the recovery disk to the master disk. No  
write operations can be performed on the recovery disk.  
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To un-mount the recovery disk, complete the following steps:  
1. In the Advanced mode, right-click on the recovery volume name.  
2. Select Access Recovery Drive Files.  
3. Select OK on the information dialog box.  
The recovery disk is now un-mounted and reappears in Intel Matrix Storage Console.  
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A Error Messages and Indicators  
Intel Desktop Board DP45SG reports POST errors in two ways:  
By sounding a beep code  
By displaying an error message on the monitor  
BIOS Beep Codes  
The BIOS also issues a beep code (one long tone followed by two short tones) during  
POST if the video configuration fails (a faulty video card or no card installed) or if an  
external ROM module does not properly checksum to zero. Table 17 lists the BIOS  
codes.  
Table 17.Beep Codes  
Beep  
3
Description  
No memory  
Siren  
Processor overheat (on reboot)  
BIOS Error Messages  
When a recoverable error occurs during the POST, the BIOS displays an error message  
describing the problem. Table 18 gives an explanation of the BIOS error messages.  
Table 18.BIOS Error Messages  
Error Message  
Explanation  
PROCESSOR_THERMAL_TRIP_ERROR  
Processor was previously shutdown due to a thermal event  
(overheating).  
MULTI_BIT_ECC_ERROR  
SINGLE_BIT_ECC_ERROR  
CMOS_BATTERY_ERROR  
CMOS_CHECKSUM_ERROR  
CMOS_TIMER_ERROR  
The firmware has detected that a Multi-Bit ECC Error occurred.  
The firmware has detected that a Single-Bit ECC Error occurred.  
The firmware has detected that a CMOS battery failure occurred.  
The firmware has detected that a CMOS Checksum Error occurred.  
The firmware has detected that the system date/time has not  
been set.  
MEMORY_SIZE_DECREASE_ERROR  
The firmware has detected that the system memory has  
decreased.  
INTRUDER_DETECTION_ERROR  
SPD_TOLER_ERROR  
The system chassis was opened.  
SERIAL PRESENCE DETECT (SPD) device data missing or  
inconclusive. Properly programmed SPD device data is required  
for reliable operation.  
MEM_OPTIMAL_ERROR  
The installed amount of memory in Channel A is not equal to the  
amount of memory in Channel B. Maximum memory performance  
is achieved with equal amounts of memory installed in each  
channel.  
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B Regulatory Compliance  
This appendix contains the following regulatory compliance information for Intel  
Desktop Board DP45SG:  
Safety standards  
European Union Declaration of Conformity statement  
Product Ecology statements  
Electromagnetic Compatibility (EMC) regulations  
Product certifications  
Safety Standards  
Intel Desktop Board DP45SG complies with the safety standards stated in Table 19  
when correctly installed in a compatible host system.  
Table 19.Safety Standards  
Regulation  
Title  
CSA/UL 60950-1, First  
Edition  
Information Technology Equipment – Safety - Part 1: General  
Requirements (USA and Canada)  
EN 60950-1:2006, Second  
Edition  
Information Technology Equipment – Safety - Part 1: General  
Requirements (European Union)  
IEC 60950-1:2005, Second  
Edition  
Information Technology Equipment – Safety - Part 1: General  
Requirements (International)  
Place Battery Marking  
There is insufficient space on this Desktop Board to provide instructions for replacing  
and disposing of the Lithium ion coin cell battery. For system safety certification, the  
statement below or an equivalent statement is required to be permanently and legibly  
marked on the chassis near the battery.  
CAUTION  
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be  
recycled where possible. Disposal of used batteries must be in accordance with local  
environmental regulations.  
A suitable caution label is included with Intel Desktop Board DP45SG.  
Related Links  
For information about replacing the battery, go to page 55.  
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Intel Desktop Board DP45SG Product Guide  
European Union Declaration of Conformity  
Statement  
We, Intel Corporation, declare under our sole responsibility that the product Intel®  
Desktop Board DP45SG is in conformity with all applicable essential requirements  
necessary for CE marking, following the provisions of the European Council Directives  
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).  
The product is properly CE marked demonstrating this conformity and is for  
distribution within all member states of the EU with no restrictions.  
This product follows the provisions of the European Directives 2004/108/EC and  
2006/95/EC.  
Čeština Tento výrobek odpovídá požadavkům evropských směrnic 2004/108/EC a  
2006/95/EC.  
Dansk Dette produkt er i overensstemmelse med det europæiske direktiv  
2004/108/EC & 2006/95/EC.  
Dutch Dit product is in navolging van de bepalingen van Europees Directief  
2004/108/EC & 2006/95/EC.  
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC  
kehtestatud nõuetele.  
Suomi Tämä tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC määräyksiä.  
Français Ce produit est conforme aux exigences de la Directive Européenne  
2004/108/EC & 2006/95/EC.  
Deutsch Dieses Produkt entspricht den Bestimmungen der Europäischen Richtlinie  
2004/108/EC & 2006/95/EC.  
Ελληνικά Το παρόν προϊόν ακολουθεί τις διατάξεις των Ευρωπαϊκών Οδηγιών  
2004/108/EC και 2006/95/EC.  
Magyar E termék megfelel a 2004/108/EC és 2006/95/EC Európai Irányelv  
előírásainak.  
Icelandic Þessi vara stenst reglugerð Evrópska Efnahags Bandalagsins númer  
2004/108/EC & 2006/95/EC.  
Italiano Questo prodotto è conforme alla Direttiva Europea 2004/108/EC &  
2006/95/EC.  
Latviešu Šis produkts atbilst Eiropas Direktīvu 2004/108/EC un 2006/95/EC  
noteikumiem.  
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Regulatory Compliance  
Lietuvių Šis produktas atitinka Europos direktyvų 2004/108/EC ir 2006/95/EC  
nuostatas.  
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej  
2004/108/EC u 2006/95/EC.  
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet  
2004/108/EC & 2006/95/EC.  
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej  
2004/108/EC i 2006/95/EC.  
Portuguese Este produto cumpre com as normas da Diretiva Européia 2004/108/EC  
& 2006/95/EC.  
Español Este producto cumple con las normas del Directivo Europeo 2004/108/EC &  
2006/95/EC.  
Slovensky Tento produkt je v súlade s ustanoveniami európskych direktív  
2004/108/EC a 2006/95/EC.  
Slovenščina Izdelek je skladen z določbami evropskih direktiv 2004/108/EC in  
2006/95/EC.  
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &  
2006/95/EC.  
Türkçe Bu ürün, Avrupa Birliği’nin 2004/108/EC ve 2006/95/EC yönergelerine uyar.  
Product Ecology Statements  
The following information is provided to address worldwide product ecology concerns  
and regulations.  
Recycling Considerations  
As part of its commitment to environmental responsibility, Intel has implemented the  
Intel® Product Recycling Program to allow retail consumers of Intel’s branded products  
to return used products to selected locations for proper recycling.  
for the details of this program, including the scope of covered products, available  
locations, shipping instructions, terms and conditions, etc.  
中文  
作为其对环境责任之承诺的部分,英特尔已实施 Intel Product Recycling Program  
(英特尔产品回收计划),以允许英特尔品牌产品的零售消费者将使用过的产品退还至指定地点作恰  
当的重复使用处理。  
了解此计划的详情,包括涉及产品之范围、回收地点、运送指导、条款和条件等。  
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Deutsch  
Als Teil von Intels Engagement für den Umweltschutz hat das Unternehmen das Intel  
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel  
Markenprodukten ermöglicht, gebrauchte Produkte an ausgewählte Standorte für  
ordnungsgemäßes Recycling zurückzugeben.  
Details zu diesem Programm, einschließlich der darin eingeschlossenen Produkte,  
verfügbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der  
Español  
Como parte de su compromiso de responsabilidad medioambiental, Intel ha  
implantado el programa de reciclaje de productos Intel, que permite que los  
consumidores al detalle de los productos Intel devuelvan los productos usados en los  
lugares seleccionados para su correspondiente reciclado.  
para ver los detalles del programa, que incluye los productos que abarca, los lugares  
disponibles, instrucciones de envío, términos y condiciones, etc.  
Français  
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis  
en œuvre le programme Intel Product Recycling Program (Programme de recyclage  
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler  
les produits usés en les retournant à des adresses spécifiées.  
savoir plus sur ce programme, à savoir les produits concernés, les adresses  
disponibles, les instructions d'expédition, les conditions générales, etc.  
日本語  
インテルでは、環境保護活動の一環として、使い終えたインテル  
ブランド製品を指定の場所へ返送していただき、リサイクルを適切に行えるよう、インテル製品リサイクル  
プログラムを発足させました。  
対象製品、返送先、返送方法、ご利用規約など、このプログラムの詳細情報は、http://www.intel.com/in  
tel/other/ehs/product_ecology (英語)をご覧ください。  
Malay  
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,  
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan  
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke  
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.  
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi  
tersedia, arahan penghantaran, terma & syarat, dsb.  
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Regulatory Compliance  
Portuguese  
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o  
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar  
produtos Intel usados para locais selecionados, onde esses produtos são reciclados de  
maneira adequada.  
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Inglês) para  
obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os  
locais disponíveis, as instruções de envio, os termos e condições, etc.  
Russian  
В качестве части своих обязательств к окружающей среде, в Intel создана  
программа утилизации продукции Intel (Product Recycling Program) для  
предоставления конечным пользователям марок продукции Intel возможности  
возврата используемой продукции в специализированные пункты для должной  
утилизации.  
Пожалуйста, обратитесь на веб-сайт  
http://www.intel.com/intel/other/ehs/product_ecology за информацией об этой  
программе, принимаемых продуктах, местах приема, инструкциях об отправке,  
положениях и условиях и т.д.  
Türkçe  
Intel, çevre sorumluluğuna bağımlılığının bir parçası olarak, perakende tüketicilerin  
Intel markalı kullanılmış ürünlerini belirlenmiş merkezlere iade edip uygun şekilde geri  
dönüştürmesini amaçlayan Intel Ürünleri Geri Dönüşüm Programı’nı uygulamaya  
koymuştur.  
Bu programın ürün kapsamı, ürün iade merkezleri, nakliye talimatları, kayıtlar ve  
şartlar v.s dahil bütün ayrıntılarını ögrenmek için lütfen  
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Lead-free 2LI/Pb-free 2LI Board  
The electronics industry is transitioning to European Union (EU) Restriction of  
Hazardous Substances (RoHS)-compliant products. The RoHS legislation restricts the  
use of six materials. One of these restricted materials is lead. Lead is the most  
common and problematic of the RoHS restricted materials.  
There are exemptions in RoHS that allow the use of lead in some very limited locations  
in electronic products. Maximum lead concentration values have been established for  
RoHS-compliant electronic products that allow up to 1000 ppm of lead.  
Lead-free/Pb-free is a nickname that is often used (or misused) for RoHS-compliant  
products. In this case, the term "Lead-free/Pb-free" means that lead has been  
removed where required by the RoHS legislation but still may exist as an impurity  
below 1000 ppm.  
The term "Lead-free 2LI/Pb-free 2LI" means lead-free second level interconnect (2LI).  
The balls, leads, or pads used to connect the component to a printed circuit board are  
lead-free, but the first level interconnect (FLI) is not lead-free. The use of lead in the  
FLI is acceptable because of the RoHS "flip chip" or "die bump" interconnect  
exemption.  
Intel Desktop Board DP45SG is a lead-free second level interconnect product.  
Table 20 shows the lead-free second level interconnect marks as they appear on the  
board and accompanying collateral. These marks are based on JEDEC standard  
J-STD-609, “Marking and Labeling of Components, PCBs and PCBAs to Identify Lead,  
Lead Free and Other Attributes.”  
For more information concerning Intel’s lead-free initiatives, refer to:  
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Regulatory Compliance  
Table 20.Lead-Free Second Level Interconnect Marks  
Description  
Mark  
This symbol is used to identify  
electrical and electronic  
assemblies and components in  
which the Pb concentration  
level in the Desktop Board  
substrate and the solder  
connections from the board to  
the components (second-level  
interconnect) is not greater  
than 0.1% by weight  
or  
or  
(1000 ppm).  
Restriction of Hazardous Substances (RoHS)  
EU RoHS  
EU RoHS Directive 2002/95/EC restricts the use of the following six materials in  
various types of electronic and electrical equipment:  
Lead  
Mercury  
Cadmium  
Hexavalent chromium  
Polybrominated biphenyls (PBB)  
Polybrominated diphenyl ether (PBDE)  
The maximum concentrations allowed are 0.1% or 1000 ppm (except for cadmium,  
which is limited to 0.01% or 100 ppm) by weight of homogeneous material.  
Intel Desktop Board DP45SG complies with these restrictions.  
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Intel Desktop Board DP45SG Product Guide  
China RoHS  
“China RoHS” is the term used by industry generally to describe legislation  
implemented by the Ministry of Information Industry (MII) in the People's Republic of  
China for the control of pollution by electronic information products (EIP). The official  
title of the China RoHS regulation is “Management Methods for Controlling Pollution by  
Electronic Information Products.”  
China RoHS bans the same substances and has the same limits as EU RoHS.  
However, the China RoHS regulation requires specific product marking and a self-  
declaration of the controlled substances contained in each product.  
Intel Desktop Board DP45SG is a China RoHS-compliant product.  
The required China RoHS mark indicates the product’s Environmental Friendly Usage  
Period (EFUP). The EFUP is defined as the number of years for which listed controlled  
substances will not leak or chemically deteriorate while in the product. The EFUP for  
Intel Desktop Boards has been determined to be 10 years.  
The EFUP for Intel Desktop Board DP45SG is shown in Table 21.  
Table 21.China RoHS Environmentally Friendly Use Period Mark  
Description  
Mark  
This is an example of the  
symbol used on Intel Desktop  
Boards and associated  
collateral. The color of the  
mark may vary depending  
upon the application. The  
Environmental Friendly Usage  
Period (EFUP) for Intel  
Desktop Boards has been  
determined to be 10 years.  
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Regulatory Compliance  
The China MII stipulates that a material Self Declaration Table (SDT) must be included  
in a product’s user documentation. The SDT for Intel Desktop Board DP45SG is shown  
Figure 29. Intel Desktop Board DP45SG China RoHS Material  
Self Declaration Table  
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Intel Desktop Board DP45SG Product Guide  
EMC Regulations  
Intel Desktop Board DP45SG complies with the EMC regulations stated in Table 22  
when correctly installed in a compatible host system.  
Table 22.EMC Regulations  
Regulation (Class B)  
Title  
FCC 47 CFR Part 15,  
Subpart B  
Title 47 of the Code of Federal Regulations, Part 15, Subpart B,  
Radio Frequency Devices. (USA)  
ICES-003 Issue 4  
Interference-Causing Equipment Standard, Digital Apparatus.  
(Canada)  
EN55022:2006  
Limits and methods of measurement of Radio Interference  
Characteristics of Information Technology Equipment. (European  
Union)  
EN55024:1998  
EN55022:2006  
Information Technology Equipment – Immunity Characteristics  
Limits and methods of measurement. (European Union)  
Australian Communications Authority, Standard for  
Electromagnetic Compatibility. (Australia and New Zealand)  
CISPR 22:2005  
+A1:2005 +A2:2006  
Limits and methods of measurement of Radio Disturbance  
Characteristics of Information Technology Equipment.  
(International)  
CISPR 24:1997  
+A1:2001 +A2:2002  
Information Technology Equipment – Immunity Characteristics –  
Limits and Methods of Measurement. (International)  
VCCI V-3/2007.04,  
V-4/2007.04  
Voluntary Control for Interference by Information Technology  
Equipment (Japan)  
Japanese Kanji statement translation: This is a Class B product based on the standard  
of the Voluntary Control Council for Interference from Information Technology  
Equipment (VCCI). If this is used near a radio or television receiver in a domestic  
environment, it may cause radio interference. Install and use the equipment  
according to the instruction manual.  
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Regulatory Compliance  
Korean Class B statement translation: This is household equipment that is certified to  
comply with EMC requirements. You may use this equipment in residential  
environments and other non-residential environments.  
Ensure Electromagnetic Compatibility (EMC)  
Compliance  
Before computer integration, make sure that the power supply and other modules or  
peripherals, as applicable, have passed Class B EMC testing and are marked  
accordingly.  
Pay close attention to the following when reading the installation instructions for the  
host chassis, power supply, and other modules:  
Product certifications or lack of certifications  
External I/O cable shielding and filtering  
Mounting, grounding, and bonding requirements  
Keying connectors when mating the wrong connectors could be hazardous  
If the power supply and other modules or peripherals, as applicable, are not Class B  
EMC compliant before integration, then EMC testing may be required on a  
representative sample of the newly completed computer.  
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Product Certifications  
Board-Level Certification Markings  
Intel Desktop Board DP45SG has the product certification markings shown in Table 23.  
Table 23.Product Certification Markings  
Description  
Mark  
UL joint US/Canada Recognized Component mark. Includes adjacent  
UL file number for Intel Desktop Boards: E210882.  
FCC Declaration of Conformity logo mark for Class B equipment.  
Includes Intel name and DP45SG model designation.  
CE mark. Declaring compliance to European Union (EU) EMC  
directive and Low Voltage directive.  
Australian Communications Authority (ACA) and New Zealand Radio  
Spectrum Management (NZ RSM) C-tick mark. Includes adjacent  
Intel supplier code number, N-232.  
Japan VCCI (Voluntary Control Council for Interference) mark.  
S. Korea MIC (Ministry of Information and Communication) mark.  
Includes adjacent MIC certification number: CPU-DP45SG (B).  
Taiwan BSMI (Bureau of Standards, Metrology and Inspections)  
mark. Includes adjacent Intel company number, D33025.  
Printed wiring board manufacturer’s recognition mark. Consists of a  
unique UL recognized manufacturer’s logo, along with a flammability  
rating (solder side).  
V-0  
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Regulatory Compliance  
Chassis and Component Certifications  
Ensure that the chassis and certain components; such as the power supply, peripheral  
drives, wiring, and cables; are components certified for the country or market where  
used. Agency certification marks on the product are proof of certification. Typical  
product certifications include:  
In Europe  
The CE marking signifies compliance with all applicable European requirements. If the  
chassis and other components are not properly CE marked, a supplier’s Declaration of  
Conformity statement to the European EMC directive and Low Voltage directive (as  
applicable), should be obtained. Additionally, other directives, such as the Radio and  
Telecommunications Terminal Equipment (R&TTE) directive may also apply depending  
on product features.  
In the United States  
A certification mark by a Nationally Recognized Testing Laboratory (NRTL) such as UL,  
CSA, or ETL signifies compliance with safety requirements. Wiring and cables must  
also be UL listed or recognized and suitable for the intended use. The FCC Class B  
logo for home or office use signifies compliance with electromagnetic interference  
(EMI) requirements.  
In Canada  
A nationally recognized certification mark such as CSA or cUL signifies compliance with  
safety requirements. The Industry Canada statement at the front of this product guide  
demonstrates compliance with Canadian EMC regulations.  
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Intel Desktop Board DP45SG Product Guide  
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