Intel Computer Hardware 80C186EA User Manual

80C186EA/80C188EA AND 80L186EA/80L188EA

16-BIT HIGH-INTEGRATION EMBEDDED PROCESSORS

80C186 Upgrade for Power Critical Applications

Fully Static Operation

True CMOS Inputs and Outputs

Integrated Feature Set

Ð Static 186 CPU Core

Ð Power Save, Idle and Powerdown

Modes

Ð Clock Generator

Ð 2 Independent DMA Channels

Ð 3 Programmable 16-Bit Timers

Ð Dynamic RAM Refresh Control Unit

Ð Programmable Memory and

Peripheral Chip Select Logic

Ð Programmable Wait State Generator

Ð Local Bus Controller

Speed Versions Available (3V):

Ð 13 MHz (80L186EA13/80L188EA13)

Ð 8 MHz (80L186EA8/80L188EA8)

Direct Addressing Capability to

1 Mbyte Memory and 64 Kbyte I/O

Supports 80C187 Numeric Coprocessor

Interface (80C186EA only)

Available in the Following Packages:

Ð 68-Pin Plastic Leaded Chip Carrier

(PLCC)

Ð 80-Pin EIAJ Quad Flat Pack (QFP)

Ð 80-Pin Shrink Quad Flat Pack (SQFP)

Ð System-Level Testing Support

(High Impedance Test Mode)

Available in Extended Temperature

Speed Versions Available (5V):

Range ( 40 C to 85 C)

Ð 25 MHz (80C186EA25/80C188EA25)

Ð 20 MHz (80C186EA20/80C188EA20)

Ð 13 MHz (80C186EA13/80C188EA13)

The 80C186EA is a CHMOS high integration embedded microprocessor. The 80C186EA includes all of the

features of an ‘‘Enhanced Mode’’ 80C186 while adding the additional capabilities of Idle and Powerdown

Modes. In Numerics Mode, the 80C186EA interfaces directly with an 80C187 Numerics Coprocessor.

272432–1

*Other brands and names are the property of their respective owners.

Information in this document is provided in connection with Intel products. Intel assumes no liability whatsoever, including infringement of any patent or

copyright, for sale and use of Intel products except as provided in Intel’s Terms and Conditions of Sale for such products. Intel retains the right to make

changes to these specifications at any time, without notice. Microcomputer Products may have minor variations to this specification known as errata.

October 1995

Order Number: 272432-003

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80C186EA/80C188EA, 80L186EA/80L188EA

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA

Figure 1. 80C186EA/80C188EA Block Diagram

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80C186EA/80C188EA, 80L186EA/80L188EA

INTRODUCTION

80C186EA CORE ARCHITECTURE

Bus Interface Unit

Unless specifically noted, all references to the

80C186EA apply to the 80C188EA, 80L186EA, and

80L188EA. References to pins that differ between

the 80C186EA/80L186EA and the 80C188EA/

80L188EA are given in parentheses. The ‘‘L’’ in the

part number denotes low voltage operation. Physi-

cally and functionally, the ‘‘C’’ and ‘‘L’’ devices are

identical.

The 80C186EA core incorporates a bus controller

that generates local bus control signals. In addition,

it employs a HOLD/HLDA protocol to share the local

bus with other bus masters.

The bus controller is responsible for generating 20

bits of address, read and write strobes, bus cycle

status information and data (for write operations) in-

formation. It is also responsible for reading data off

the local bus during a read operation. SRDY and

ARDY input pins are provided to extend a bus cycle

beyond the minimum four states (clocks).

The 80C186EA is the second product in a new gen-

eration of low-power, high-integration microproces-

sors. It enhances the existing 80C186XL family by

offering new features and operating modes. The

80C186EA is object code compatible with the

80C186XL embedded processor.

The local bus controller also generates two control

signals (DEN and DT/R) when interfacing to exter-

nal transceiver chips. This capability allows the addi-

tion of transceivers for simple buffering of the mulit-

plexed address/data bus.

The 80L186EA is the 3V version of the 80C186EA.

The 80L186EA is functionally identical to the

80C186EA

embedded

processor.

Current

80C186EA customers can easily upgrade their de-

signs to use the 80L186EA and benefit from the re-

duced power consumption inherent in 3V operation.

The feature set of the 80C186EA/80L186EA meets

the needs of low-power, space-critical applications.

Low-power applications benefit from the static de-

sign of the CPU core and the integrated peripherals

as well as low voltage operation. Minimum current

consumption is achieved by providing a Powerdown

Mode that halts operation of the device, and freezes

the clock circuits. Peripheral design enhancements

ensure that non-initialized peripherals consume little

current.

Clock Generator

The processor provides an on-chip clock generator

for both internal and external clock generation. The

clock generator features a crystal oscillator, a divide-

by-two counter, and two low-power operating

modes.

The oscillator circuit is designed to be used with ei-

ther a parallel resonant fundamental or third-over-

tone mode crystal network. Alternatively, the oscilla-

tor circuit may be driven from an external clock

source. Figure 2 shows the various operating modes

of the oscillator circuit.

Space-critical applications benefit from the inte-

gration of commonly used system peripherals. Two

flexible DMA channels perform CPU-independent

data transfers. A flexible chip select unit simplifies

memory and peripheral interfacing. The interrupt unit

provides sources for up to 128 external interrupts

and will prioritize these interrupts with those generat-

ed from the on-chip peripherals. Three general pur-

pose timer/counters round out the feature set of the

80C186EA.

The crystal or clock frequency chosen must be twice

the required processor operating frequency due to

the internal divide-by-two counter. This counter is

used to drive all internal phase clocks and the exter-

nal CLKOUT signal. CLKOUT is a 50% duty cycle

processor clock and can be used to drive other sys-

tem components. All AC timings are referenced to

CLKOUT.

Figure 1 shows a block diagram of the 80C186EA/

80C188EA. The Execution Unit (EU) is an enhanced

8086 CPU core that includes: dedicated hardware to

speed up effective address calculations, enhance

execution speed for multiple-bit shift and rotate in-

structions and for multiply and divide instructions,

string move instructions that operate at full bus

bandwidth, ten new instructions, and static opera-

tion. The Bus Interface Unit (BIU) is the same as that

found on the original 80C186 family products. An

independent internal bus is used to allow communi-

cation between the BIU and internal peripherals.

The following parameters are recommended when

choosing a crystal:

Temperature Range:

ESR (Equivalent Series Resistance):

C0 (Shunt Capacitance of Crystal):

Application Specific

60X max

7.0 pF max

20 pF 2 pF

2 mW max

Drive Level:

(Load Capacitance):

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–4

272432–3

(A) Crystal Connection

(B) Clock Connection

NOTE:

The L C network is only required when using a third-overtone crystal.

Figure 2. Clock Configurations

80C186EA PERIPHERAL

ARCHITECTURE

Interrupt Control Unit

The 80C186EA can receive interrupts from a num-

ber of sources, both internal and external. The Inter-

rupt Control Unit (ICU) serves to merge these re-

quests on a priority basis, for individual service by

the CPU. Each interrupt source can be independent-

ly masked by the Interrupt Control Unit or all inter-

rupts can be globally masked by the CPU.

The 80C186EA has integrated several common sys-

tem peripherals with a CPU core to create a com-

pact, yet powerful system. The integrated peripher-

als are designed to be flexible and provide logical

interconnections between supporting units (e.g., the

interrupt control unit supports interrupt requests

from the timer/counters or DMA channels).

Internal interrupt sources include the Timers and

DMA channels. External interrupt sources come

from the four input pins INT3:0. The NMI interrupt

pin is not controlled by the ICU and is passed direct-

ly to the CPU. Although the timers only have one

request input to the ICU, separate vector types are

generated to service individual interrupts within the

Timer Unit.

The list of integrated peripherals include:

4-Input Interrupt Control Unit

3-Channel Timer/Counter Unit

2-Channel DMA Unit

13-Output Chip-Select Unit

Refresh Control Unit

Power Management logic

Timer/Counter Unit

The registers associated with each integrated peri-

heral are contained within a 128 x 16 register file

called the Peripheral Control Block (PCB). The PCB

can be located in either memory or I/O space on

any 256 byte address boundary.

The 80C186EA Timer/Counter Unit (TCU) provides

three 16-bit programmable timers. Two of these are

highly flexible and are connected to external pins for

control or clocking. A third timer is not connected to

any external pins and can only be clocked internally.

However, it can be used to clock the other two timer

channels. The TCU can be used to count external

events, time external events, generate non-repeti-

tive waveforms, generate timed interrupts, etc.

Figure 3 provides a list of the registers associated

with the PCB when the processor’s Interrupt Control

Unit is in Master Mode. In Slave Mode, the defini-

tions of some registers change. Figure 4 provides

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80C186EA/80C188EA, 80L186EA/80L188EA

PCB

Function

Offset

00H

02H

04H

06H

08H

0AH

0CH

0EH

10H

12H

14H

16H

18H

1AH

1CH

1EH

20H

22H

24H

26H

28H

2AH

2CH

Reserved

End of Interrupt

Poll

40H

42H

44H

46H

48H

4AH

4CH

4EH

50H

Reserved

Timer 0 Count

80H

82H

84H

86H

88H

8AH

8CH

8EH

90H

92H

94H

96H

98H

9AH

9CH

9EH

A0H

A2H

A4H

A6H

A8H

AAH

ACH

AEH

B0H

B2H

B4H

B6H

B8H

BAH

BCH

BEH

Reserved

UMCS

C0H

C2H

C4H

C6H

C8H

CAH

CCH

CEH

D0H

D2H

D4H

D6H

D8H

DAH

DCH

DEH

E0H

E2H

E4H

E6H

E8H

EAH

ECH

EEH

F0H

F2H

F4H

F6H

F8H

FAH

FCH

FEH

DMA0 Src. Lo

DMA0 Src. Hi

DMA0 Dest. Lo

DMA0 Dest. Hi

DMA0 Count

DMA0 Control

Reserved

DMA1 Src. Lo

DMA1 Src. Hi

DMA1 Dest. Lo

DMA1 Dest. Hi

DMA1 Count

DMA1 Control

Reserved

52H Timer 0 Compare A

54H Timer 0 Compare B

56H

58H

Timer 0 Control

Timer 1 Count

5AH Timer 1 Compare A

5CH Timer 1 Compare B

5EH

60H

Timer 1 Control

Timer 2 Count

Reserved

Refresh Base

Refresh Time

Refresh Control

Reserved

62H Timer 2 Compare

LMCS

64H

66H

68H

6AH

6CH

6EH

70H

72H

74H

76H

78H

7AH

7CH

7EH

Reserved

Timer 2 Control

Reserved

PACS

Poll Status

Interrupt Mask

Priority Mask

In-Service

MMCS

MPCS

Reserved

2EH Interrupt Request

Reserved

30H

32H

Interrupt Status

Timer Control

Power-Save

Power Control

Reserved

34H DMA0 Int. Control

36H DMA1 Int. Control

Step ID

38H

3AH

3CH

3EH

INT0 Control

INT1 Control

INT2 Control

INT3 Control

Reserved

Relocation

Figure 3. Peripheral Control Block Registers

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80C186EA/80C188EA, 80L186EA/80L188EA

Chip-Select Unit

PCB

Function

Offset

The 80C186EA Chip-Select Unit integrates logic

which provides up to 13 programmable chip-selects

to access both memories and peripherals. In addi-

tion, each chip-select can be programmed to auto-

matically terminate a bus cycle independent of the

condition of the SRDY and ARDY input pins. The

chip-select lines are available for all memory and

I/O bus cycles, whether they are generated by the

CPU, the DMA unit, or the Refresh Control Unit.

20H

22H

24H

26H

28H

2AH

Interrupt Vector

Specific EOI

Reserved

Interrupt Mask

Priority Mask

In-Service

Refresh Control Unit

Interrupt Request

Interrupt Status

TMR0 Interrupt Control

DMA0 Interrupt Control

DMA1 Interrupt Control

TMR1 Interrupt Control

TMR2 Interrupt Control

Reserved

The Refresh Control Unit (RCU) automatically gen-

erates a periodic memory read bus cycle to keep

dynamic or pseudo-static memory refreshed. A 9-bit

counter controls the number of clocks between re-

fresh requests.

A 9-bit address generator is maintained by the RCU

with the address presented on the A9:1 address

lines during the refresh bus cycle. Address bits

A19:13 are programmable to allow the refresh ad-

dress block to be located on any 8 Kbyte boundary.

Reserved

Figure 4. 80C186EA Slave Mode Peripheral

Control Block Registers

Power Management

The 80C186EA has three operational modes to con-

trol the power consumption of the device. They are

Power Save Mode, Idle Mode, and Powerdown

Mode.

DMA Control Unit

The 80C186EA DMA Contol Unit provides two inde-

pendent high-speed DMA channels. Data transfers

can occur between memory and I/O space in any

combination: memory to memory, memory to I/O,

I/O to I/O or I/O to memory. Data can be trans-

ferred either in bytes or words. Transfers may pro-

ceed to or from either even or odd addresses, but

even-aligned word transfers proceed at a faster rate.

Each data transfer consumes two bus cycles (a mini-

mum of eight clocks), one cycle to fetch data and

the other to store data. The chip-select/ready logic

may be programmed to point to the memory or I/O

space subject to DMA transfers in order to provide

hardware chip select lines. DMA cycles run at higher

priority than general processor execution cycles.

Power Save Mode divides the processor clock by a

programmable value to take advantage of the fact

that current is linearly proportional to frequency. An

unmasked interrupt, NMI, or reset will cause the

80C186EA to exit Power Save Mode.

Idle Mode freezes the clocks of the Execution Unit

and the Bus Interface Unit at a logic zero state while

all peripherals operate normally.

Powerdown Mode freezes all internal clocks at a

logic zero level and disables the crystal oscillator. All

internal registers hold their values provided V

maintained. Current consumption is reduced to tran-

sistor leakage only.

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80C186EA/80C188EA, 80L186EA/80L188EA

80C187 Interface (80C186EA Only)

The 80-lead QFP (EIAJ) pinouts are different be-

tween the 80C186XL and the 80C186EA. In addition

to the PDTMR pin, the 80C186EA has more power

and ground pins and the overall arrangement of pins

was shifted. A new circuit board layout for the

80C186EA is required.

The 80C187 Numerics Coprocessor may be used to

extend the 80C186EA instruction set to include

floating point and advanced integer instructions.

Connecting the 80C186EA RESOUT and TEST/

BUSY pins to the 80C187 enables Numerics Mode

operation. In Numerics Mode, three of the four Mid-

Range Chip Select (MCS) pins become handshaking

pins for the interface. The exchange of data and

control information proceeds through four dedicated

I/O ports.

Operating Modes

The 80C186XL has two operating modes, Compati-

ble and Enhanced. Compatible Mode is a pin-to-pin

replacement for the NMOS 80186, except for nu-

merics coprocessing. In Enhanced Mode, the proc-

essor has a Refresh Control Unit, the Power-Save

feature and an interface to the 80C187 Numerics

Coprocessor. The MCS0, MCS1, and MCS3 pins

change their functions to constitute handshaking

pins for the 80C187.

If an 80C187 is not present, the 80C186EA config-

ures itself for regular operation at reset.

NOTE:

The 80C187 is not specified for 3V operation and

therefore does not interface directly to the

80L186EA.

The 80C186EA allows all non-80C187 users to use

all the MCS pins for chip-selects. In regular opera-

tion, all 80C186EA features (including those of the

Enhanced Mode 80C186) are present except for the

interface to the 80C187. Numerics Mode disables

the three chip-select pins and reconfigures them for

connection to the 80C187.

ONCE Test Mode

To facilitate testing and inspection of devices when

fixed into a target system, the 80C186EA has a test

mode available which forces all output and input/

output pins to be placed in the high-impedance

state. ONCE stands for ‘‘ON Circuit Emulation’’. The

ONCE mode is selected by forcing the UCS and LCS

pins LOW (0) during a processor reset (these pins

are weakly held to a HIGH (1) level) while RESIN is

active.

TTL vs CMOS Inputs

The inputs of the 80C186EA are rated for CMOS

switching levels for improved noise immunity, but the

80C186XL inputs are rated for TTL switching levels.

In particular, the 80C186EA requires a minimum V

of 3.5V to recognize a logic one while the 80C186XL

requires a minimum V of only 1.9V (assuming 5.0V

operation). The solution is to drive the 80C186EA

with true CMOS devices, such as those from the HC

and AC logic families, or to use pullup resistors

where the added current draw is not a problem.

DIFFERENCES BETWEEN THE

80C186XL AND THE 80C186EA

The 80C186EA is intended as a direct functional up-

grade for 80C186XL designs. In many cases, it will

be possible to replace an existing 80C186XL with

little or no hardware redesign. The following sections

describe differences in pinout, operating modes, and

AC and DC specifications to keep in mind.

Timing Specifications

80C186EA timing relationships are expressed in a

simplified format over the 80C186XL. The AC per-

formance of an 80C186EA at a specified frequency

will be very close to that of an 80C186XL at the

same frequency. Check the timings applicable to

your design prior to replacing the 80C186XL.

Pinout Compatibility

The 80C186EA requires a PDTMR pin to time the

processor’s exit from Powerdown Mode. The original

pin arrangement for the 80C186XL in the PLCC

package did not have any spare leads to use for

PDTMR, so the DT/R pin was sacrificed. The ar-

rangement of all the other leads in the 68-lead PLCC

is identical between the 80C186XL and the

80C186EA. DT/R may be synthesized by latching

the S1 status output. Therefore, upgrading a PLCC

80C186XL to PLCC 80C186EA is straightforward.

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80C186EA/80C188EA, 80L186EA/80L188EA

input/output (I/O). Some pins have multiplexed

functions (for example, A19/S6). Additional symbols

indicate additional characteristics for each pin. Table

3 lists all the possible symbols for this column.

PACKAGE INFORMATION

This section describes the pins, pinouts, and thermal

characteristics for the 80C186EA in the Plastic

Leaded Chip Carrier (PLCC) package, Shrink Quad

Flat Pack (SQFP), and Quad Flat Pack (QFP) pack-

age. For complete package specifications and infor-

mation, see the Intel Packaging Outlines and Dimen-

sions Guide (Order Number: 231369).

The Input Type column indicates the type of input

(asynchronous or synchronous).

Asynchronous pins require that setup and hold times

be met only in order to guarantee recognition at a

particular clock edge. Synchronous pins require that

setup and hold times be met to guarantee proper

operation. For example, missing the setup or hold

time for the SRDY pin (a synchronous input) will re-

sult in a system failure or lockup. Input pins may also

be edge- or level-sensitive. The possible character-

istics for input pins are S(E), S(L), A(E) and A(L).

With the extended temperature range operational

characteristics are guaranteed over a temperature

range corresponding to 40 C to 85 C ambient.

Package types are identified by a two-letter prefix to

the part number. The prefixes are listed in Table 1.

Table 1. Prefix Identification

Package

Type

Temperature

Range

The Output States column indicates the output

state as a function of the device operating mode.

Output states are dependent upon the current activi-

ty of the processor. There are four operational

states that are different from regular operation: bus

hold, reset, Idle Mode and Powerdown Mode. Ap-

propriate characteristics for these states are also in-

dicated in this column, with the legend for all possi-

ble characteristics in Table 2.

Prefix Note

PLCC

Extended

QFP (EIAJ) Extended

SQFP

PLCC

Extended/Commercial

Commercial

QFP (EIAJ) Commercial

The Pin Description column contains a text de-

scription of each pin.

NOTE:

1. The 25 MHz version is only available in commercial tem-

perature range corresponding to 0 C to 70 C ambient.

As an example, consider AD15:0. I/O signifies the

pins are bidirectional. S(L) signifies that the input

function is synchronous and level-sensitive. H(Z)

signifies that, as outputs, the pins are high-imped-

ance upon acknowledgement of bus hold. R(Z) sig-

nifies that the pins float during reset. P(X) signifies

that the pins retain their states during Powerdown

Mode.

Pin Descriptions

Each pin or logical set of pins is described in Table

3. There are three columns for each entry in the Pin

Description Table.

The Pin Name column contains a mnemonic that

describes the pin function. Negation of the signal

name (for example, RESIN) denotes a signal that is

active low.

The Pin Type column contains two kinds of informa-

tion. The first symbol indicates whether a pin is pow-

er (P), ground (G), input only (I), output only (O) or

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 2. Pin Description Nomenclature

Description

Symbol

Ground (Connect to V

Power Pin (Apply

V Voltage)

)

Input Only Pin

Output Only Pin

Input/Output Pin

I/O

S(E)

S(L)

A(E)

A(L)

Synchronous, Edge Sensitive

Synchronous, Level Sensitive

Asynchronous, Edge Sensitive

Asynchronous, Level Sensitive

H(1)

H(0)

H(Z)

H(Q)

H(X)

Output Driven to V during Bus Hold

Output Floats during Bus Hold

Output Remains Active during Bus Hold

Output Retains Current State during Bus Hold

R(WH)

R(1)

R(0)

Output Weakly Held at V during Reset

Output Driven to V during Reset

Output Floats during Reset

R(Z)

R(Q)

R(X)

Output Remains Active during Reset

Output Retains Current State during Reset

I(1)

I(0)

I(Z)

I(Q)

I(X)

Output Driven to V during Idle Mode

Output Floats during Idle Mode

Output Remains Active during Idle Mode

Output Retains Current State during Idle Mode

P(1)

P(0)

P(Z)

P(Q)

P(X)

Output Driven to V during Powerdown Mode

Output Floats during Powerdown Mode

Output Remains Active during Powerdown Mode

Output Retains Current State during Powerdown Mode

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions

Name

Pin Input Output

Type Type States

Description

POWER connections consist of six pins which must be shorted

externally to a V board plane.

GROUND connections consist of five pins which must be shorted

externally to a V board plane.

CLKIN

A(E)

CLocK INput is an input for an external clock. An external

oscillator operating at two times the required processor operating

frequency can be connected to CLKIN. For crystal operation,

CLKIN (along with OSCOUT) are the crystal connections to an

internal Pierce oscillator.

OSCOUT

H(Q)

R(Q)

P(Q)

OSCillator OUTput is only used when using a crystal to generate

the external clock. OSCOUT (along with CLKIN) are the crystal

connections to an internal Pierce oscillator. This pin is not to be

used as 2X clock output for non-crystal applications (i.e., this pin is

N.C. for non-crystal applications). OSCOUT does not float in

ONCE mode.

CLKOUT

RESIN

H(Q)

R(Q)

P(Q)

CLocK OUTput provides a timing reference for inputs and outputs

of the processor, and is one-half the input clock (CLKIN)

frequency. CLKOUT has a 50% duty cycle and transistions every

falling edge of CLKIN.

A(L)

RESet IN causes the processor to immediately terminate any bus

cycle in progress and assume an initialized state. All pins will be

driven to a known state, and RESOUT will also be driven active.

The rising edge (low-to-high) transition synchronizes CLKOUT with

CLKIN before the processor begins fetching opcodes at memory

location 0FFFF0H.

RESOUT

PDTMR

H(0)

R(1)

P(0)

RESet OUTput that indicates the processor is currently in the

reset state. RESOUT will remain active as long as RESIN remains

active. When tied to the TEST/BUSY pin, RESOUT forces the

80C186EA into Numerics Mode.

I/O

A(L)

H(WH) Power-Down TiMeR pin (normally connected to an external

capacitor) that determines the amount of time the processor waits

after an exit from power down before resuming normal operation.

The duration of time required will depend on the startup

characteristics of the crystal oscillator.

R(Z)

P(1)

NMI

A(E)

Non-Maskable Interrupt input causes a Type 2 interrupt to be

serviced by the CPU. NMI is latched internally.

TEST/BUSY

(TEST)

TEST/BUSY is sampled upon reset to determine whether the

80C186EA is to enter Numerics Mode. In regular operation, the pin

is TEST. TEST is used during the execution of the WAIT

instruction to suspend CPU operation until the pin is sampled

active (low). In Numerics Mode, the pin is BUSY. BUSY notifies the

80C186EA of 80C187 Numerics Coprocessor activity.

AD15:0

(AD7:0)

I/O

S(L)

H(Z)

R(Z)

P(X)

These pins provide a multiplexed Address and Data bus. During

the address phase of the bus cycle, address bits 0 through 15 (0

through 7 on the 8-bit bus versions) are presented on the bus and

can be latched using ALE. 8- or 16-bit data information is

transferred during the data phase of the bus cycle.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 3. Pin Descriptions (Continued)

Input Output

Description

Name

Type Type

States

A18:16

A19/S6–A16

(A19–A8)

H(Z)

R(Z)

P(X)

These pins provide multiplexed Address during the address

phase of the bus cycle. Address bits 16 through 19 are

presented on these pins and can be latched using ALE.

A18:16 are driven to a logic 0 during the data phase of the bus

cycle. On the 8-bit bus versions, A15–A8 provide valid address

information for the entire bus cycle. Also during the data

phase, S6 is driven to a logic 0 to indicate a CPU-initiated bus

cycle or logic 1 to indicate a DMA-initiated bus cycle or a

refresh cycle.

S2:0

H(Z)

R(Z)

P(1)

Bus cycle Status are encoded on these pins to provide bus

transaction information. S2:0 are encoded as follows:

S2 S1

Bus Cycle Initiated

Interrupt Acknowledge

Read I/O

Write I/O

Processor HALT

Queue Instruction Fetch

Read Memory

Write Memory

Passive (no bus activity)

ALE/QS0

H(0)

R(0)

P(0)

Address Latch Enable output is used to strobe address

information into a transparent type latch during the address

phase of the bus cycle. In Queue Status Mode, QS0 provides

queue status information along with QS1.

BHE

(RFSH)

H(Z)

R(Z)

P(X)

Byte High Enable output to indicate that the bus cycle in

progress is transferring data over the upper half of the data

bus. BHE and A0 have the following logical encoding:

BHE Encoding (For 80C186EA/80L186EA Only)

Word Transfer

Even Byte Transfer

Odd Byte Transfer

Refresh Operation

On the 80C188EA/80L188EA, RFSH is asserted low to

indicate a Refresh bus cycle.

RD/QSMD

H(Z)

R(WH)

P(1)

ReaD output signals that the accessed memory or I/O device

must drive data information onto the data bus. Upon reset, this

pin has an alternate function. As QSMD, it enables Queue

Status Mode when grounded. In Queue Status Mode, the

ALE/QS0 and WR/QS1 pins provide the following information

about processor/instruction queue interaction:

QS1

QS0

Queue Operation

No Queue Operation

First Opcode Byte Fetched from the Queue

Subsequent Byte Fetched from the Queue

Empty the Queue

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

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Table 3. Pin Descriptions (Continued)

Name

Pin Input Output

Type Type States

Description

WR/QS1

H(Z)

R(Z)

P(1)

WRite output signals that data available on the data bus are to be

written into the accessed memory or I/O device. In Queue Status

Mode, QS1 provides queue status information along with QS0.

ARDY

A(L)

S(L)

Asychronous ReaDY is an input to signal for the end of a bus cycle.

ARDY is asynchronous on rising CLKOUT and synchronous on falling

CLKOUT. ARDY or SRDY must be active to terminate any processor

bus cycle, unless they are ignored due to correct programming of the

Chip Select Unit.

SRDY

S(L)

Synchronous ReaDY is an input to signal for the end of a bus cycle.

ARDY or SRDY must be active to terminate any processor bus cycle,

unless they are ignored due to correct programming of the Chip Select

Unit.

DEN

H(Z)

R(Z)

P(1)

Data ENable output to control the enable of bidirectional transceivers

when buffering a system. DEN is active only when data is to be

transferred on the bus.

DT/R

LOCK

H(Z)

R(Z)

P(X)

Data Transmit/Receive output controls the direction of a bi-

directional buffer in a buffered system. DT/R is only available on the

QFP (EIAJ) package and the SQFP package.

H(Z)

R(WH)

P(1)

LOCK output indicates that the bus cycle in progress is not to be

interrupted. The processor will not service other bus requests (such

as HOLD) while LOCK is active. This pin is configured as a weakly

held high input while RESIN is active and must not be driven low.

HOLD

HLDA

UCS

A(L)

HOLD request input to signal that an external bus master wishes to

gain control of the local bus. The processor will relinquish control of

the local bus between instruction boundaries not conditioned by a

LOCK prefix.

H(1)

R(0)

P(0)

HoLD Acknowledge output to indicate that the processor has

relinquished control of the local bus. When HLDA is asserted, the

processor will (or has) floated its data bus and control signals allowing

another bus master to drive the signals directly.

H(1)

R(1)

P(1)

Upper Chip Select will go active whenever the address of a memory

or I/O bus cycle is within the address limitations programmed by the

user. After reset, UCS is configured to be active for memory accesses

between 0FFC00H and 0FFFFFH. During a processor reset, UCS and

LCS are used to enable ONCE Mode.

LCS

H(1)

R(1)

P(1)

Lower Chip Select will go active whenever the address of a memory

bus cycle is within the address limitations programmed by the user.

LCS is inactive after a reset. During a processor reset, UCS and LCS

are used to enable ONCE Mode.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

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Table 3. Pin Descriptions (Continued)

Input Output

Type Type

Description

Name

States

MCS0/PEREQ

MCS1/ERROR

MCS2

I/O

A(L)

H(1)

R(1)

P(1)

These pins provide a multiplexed function. If enabled,

these pins normally comprise a block of Mid-Range Chip

Select outputs which will go active whenever the address

of a memory bus cycle is within the address limitations

programmed by the user. In Numerics Mode (80C186EA

only), three of the pins become handshaking pins for the

80C187. The CoProcessor REQuest input signals that a

data transfer is pending. ERROR is an input which

indicates that the previous numerics coprocessor

operation resulted in an exception condition. An interrupt

Type 16 is generated when ERROR is sampled active at

the beginning of a numerics operation. Numerics

Coprocessor Select is an output signal generated when

the processor accesses the 80C187.

MCS3/NCS

PCS4:0

H(1)

R(1)

P(1)

Peripheral Chip Selects go active whenever the address

of a memory or I/O bus cycle is within the address

limitations programmed by the user.

PCS5/A1

PCS6/A2

H(1)/H(X) These pins provide a multiplexed function. As additional

Peripheral Chip Selects, they go active whenever the

address of a memory or I/O bus cycle is within the

address limitations by the user. They may also be

programmed to provide latched Address A2:1 signals.

R(1)

P(1)

T0OUT

T1OUT

H(Q)

R(1)

P(Q)

Timer OUTput pins can be programmed to provide a

single clock or continuous waveform generation,

depending on the timer mode selected.

T0IN

T1IN

A(L)

A(E)

Timer INput is used either as clock or control signals,

depending on the timer mode selected.

DRQ0

DRQ1

A(L)

DMA ReQuest is asserted by an external request when it

is prepared for a DMA transfer.

INT0

INT1/SELECT

A(E,L)

Maskable INTerrupt input will cause a vector to a specific

Type interrupt routine. To allow interrupt expansion, INT0

and/or INT1 can be used with INTA0 and INTA1 to

interface with an external slave controller. INT1 becomes

SELECT when the ICU is configured for Slave Mode.

INT2/INTA0

INT3/INTA1/IRQ

I/O

A(E,L)

H(1)

R(Z)

P(1)

These pins provide multiplexed functions. As inputs, they

provide a maskable INTerrupt that will cause the CPU to

vector to a specific Type interrupt routine. As outputs,

each is programmatically controlled to provide an

INTerrupt Acknowledge handshake signal to allow

interrupt expansion. INT3/INTA1 becomes IRQ when the

ICU is configured for Slave Mode.

N.C.

No Connect. For compatibility with future products, do not

connect to these pins.

NOTE:

Pin names in parentheses apply to the 80C188EA and 80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

80C186EA/80C188EA (EIAJ QFP package) as

viewed from the top side of the component (i.e., con-

tacts facing down).

80C186EA PINOUT

Tables 4 and 5 list the 80C186EA pin names with

package location for the 68-pin Plastic Leaded Chip

Carrier (PLCC) component. Figure 9 depicts the

complete 80C186EA/80L186EA pinout (PLCC pack-

age) as viewed from the top side of the component

(i.e., contacts facing down).

Tables 8 and 9 list the 80C186EA/80C188EA pin

names with package location for the 80-pin Shrink

Quad Flat Pack (SQFP) component. Figure 7 depicts

the complete 80C186EA/80C188EA (SQFP) as

viewed from the top side of the component (i.e., con-

tacts facing down).

Tables 6 and 7 list the 80C186EA pin names with

package location for the 80-pin Quad Flat Pack

(EIAJ) component. Figure 6 depicts the complete

Table 4. PLCC Pin Names with Package Location

Bus Control Processor Control

Name Location

Address/Data Bus

I/O

Name

AD0

Location

Name

Location

Name

Location

ALE/QS0

RESIN

UCS

LCS

AD1

BHE (RFSH)

RESOUT

AD2

MCS0/PEREQ

MCS1/ERROR

MCS2

CLKIN

AD3

OSCOUT

CLKOUT

AD4

AD5

MCS3/NCS

RD/QSMD

WR/QS1

TEST/BUSY

PDTMR

AD6

PCS0

AD7

PCS1

ARDY

SRDY

NMI

AD8 (A8)

AD9 (A9)

AD10 (A10)

AD11 (A11)

AD12 (A12)

AD13 (A13)

AD14 (A14)

AD15 (A15)

PCS2

INT0

PCS3

DEN

INT1/SELECT

INT2/INTA0

INT3/INTA1/

IRQ

PCS4

LOCK

PCS5/A1

PCS6/A2

HOLD

HLDA

T0OUT

T0IN

Power

T1OUT

T1IN

A16

Name

Location

A17

DRQ0

DRQ1

26, 60

9, 43

A18

A19/S6

NOTE:

Pin names in parentheses apply to the 80C188EA/80L188EA.

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Table 5. PLCC Package Location with Pin Names

Location

Name

Location

Name

Location

Name

Location

Name

AD15 (A15)

AD7

DRQ0

MCS3/NCS

MCS2

DRQ1

T0IN

AD14 (A14)

AD6

MCS1/ERROR

MCS0/PEREQ

DEN

T1IN

ARDY

AD13 (A13)

AD5

T0OUT

T1OUT

RESIN

PCS0

CLKOUT

RESOUT

OSCOUT

CLKIN

PDTMR

AD12 (A12)

AD4

INT3/INTA1/

IRQ

INT2/INTA0

AD11 (A11)

AD3

PCS1

ALE/QS0

RD/QSMD

WR/QS1

BHE (RFSH)

A19/S6

A18

PCS2

INT1/SELECT

INT0

AD10 (A10)

AD2

PCS3

PCS4

NMI

AD9 (A9)

AD1

PCS5/A1

PCS6/A2

LCS

TEST/BUSY

LOCK

AD8 (A8)

AD0

SRDY

A17

UCS

HOLD

A16

HLDA

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

NOTES:

1. The nine-character alphanumeric code (XXXXXXXXD) underneath the product number is the Intel FPO number.

2. Pin names in parentheses apply to the 80C186EA/80L188EA.

272432–5

Figure 5. 68-Lead PLCC Pinout Diagram

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 6. QFP (EIAJ) Pin Names with Package Location

Bus Control Processor Control

Name Location

RESIN

Address/Data Bus

I/O

Name

Location

Name

Location

Name

Location

AD0

ALE/QS0

BHE (RFSH)

UCS

LCS

AD1

RESOUT

CLKIN

AD2

MCS0/PEREQ

MCS1/ERROR

MCS2

AD3

OSCOUT

CLKOUT

TEST/BUSY

PDTMR

NMI

AD4

AD5

RD/QSMD

WR/QS1

ARDY

SRDY

DT/R

MCS3/NCS

PCS0

AD6

AD7

PCS1

AD8 (A8)

AD9 (A9)

AD10 (A10)

AD11 (A11)

AD12 (A12)

AD13 (A13)

AD14 (A14)

AD15 (A15)

A16

INT0

PCS2

INT1/SELECT

INT2/INTA0

INT3/INTA1/

IRQ

PCS3

DEN

PCS4

LOCK

HOLD

HLDA

PCS5/A1

PCS6/A2

T0OUT

T0IN

N.C.

11, 14,

15, 63

T1OUT

T1IN

Power

A17

DRQ0

A18

DRQ1

Name

Location

A19/S6

12, 13, 24,

53,62

2, 33, 34,

44, 72, 73

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 7. QFP (EIAJ) Package Location with Pin Names

Location

Name

Location

Name

Location

Name

Location

Name

DRQ0

AD15 (A15)

MCS1/ERROR

MCS2

A16

MCS3/NCS

N.C.

A17

AD0

A18

HLDA

UCS

AD8 (A8)

AD1

A19/S6

BHE (RFSH)

WR/QS1

RD/QSMD

ALE/QS0

N.C.

HOLD

LCS

SRDY

PCS6/A2

PCS5/A1

PCS4

AD9 (A9)

AD2

LOCK

TEST/BUSY

NMI

AD10 (A10)

AD3

PCS3

INT0

PCS2

AD11 (A11)

INT1/SELECT

PCS1

N.C.

PCS0

RESIN

T1OUT

T0OUT

T1IN

AD4

N.C.

INT2/INTA0

INT3/INTA1/

IRQ

AD12 (A12)

AD5

CLKIN

OSCOUT

RESOUT

CLKOUT

ARDY

AD13 (A13)

AD6

DT/R

PDTMR

T0IN

AD14 (A14)

AD7

DEN

DRQ1

MCS0/PEREQ

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

NOTES:

1. The nine-character alphanumeric code (XXXXXXXXD) underneath the product number is the Intel FPO number.

2. Pin names in parentheses apply to the 80C186EA/80L188EA.

272432–6

Figure 6. Quad Flat Pack (EIAJ) Pinout Diagram

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80C186EA/80C188EA, 80L186EA/80L188EA

Table 8. SQFP Pin Functions with Package Location

Bus Control Processor Control

ALE/QS0

AD Bus

I/O

AD0

AD1

AD2

AD3

AD4

AD5

AD6

AD7

RESIN

UCS

LCS

BHE/(RFSH)

RESOUT

CLKIN

OSCOUT

CLKOUT

TEST/BUSY

NMI

MCS0/PEREQ

MCS1/ERROR

MCS2

RD/QSMD

WR/QS1

ARDY

SRDY

DEN

MCS3/NPS

INT0

AD8 (A8)

AD9 (A9)

AD10 (A10)

AD11 (A11)

AD12 (A12)

AD13 (A13)

AD14 (A14)

AD15 (A15)

A16/S3

INT1/SELECT

INT2/INTA0

INT3/INTA1

PDTMR

PCS0

PCS1

PCS2

PCS3

DT/R

LOCK

HOLD

HLDA

PCS4

PCS5/A1

PCS6/A2

Power and Ground

No Connection

TMR IN 0

TMR IN 1

TMR OUT 0

TMR OUT 1

N.C.

A17/S4

N.C.

A18/S5

A19/S6

DRQ0

DRQ1

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

Table 9. SQFP Pin Locations with Pin Names

AD0

A16/S3

HLDA

HOLD

SRDY

LOCK

TEST/BUSY

NMI

INT0

UCS

LCS

PCS6/A2

PCS5/A1

PCS4

PCS3

PCS2

PCS1

PCS0

N.C.

RES

TMR OUT 1

TMR OUT 0

TMR IN 1

TMR IN 0

DRQ1

AD8 (A8)

AD1

A17/S4

A18/S5

N.C.

A19/S6

AD9 (A9)

AD2

N.C.

BHE/(RFSH)

WR/QS1

RD/QSMD

ALE/QS0

AD10 (A10)

AD3

AD11 (A11)

INT1/SELECT

AD4

INT2/INTA0

INT3/INTA1

DT/R

PDTMR

DEN

MCS0/PEREQ

MCS1/ERROR

MCS2

AD12 (A12)

AD5

RESET

N.C.

CLKOUT

ARDY

AD13 (A13)

AD6

AD14 (A14)

AD7

AD15 (A15)

DRQ0

MCS3/NPS

NOTE:

Pin names in parentheses apply to the 80C186EA/80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–7

Figure 7. Shrink Quad Flat Pack (SQFP) Pinout Diagram

NOTES:

1. XXXXXXXXD indicates the Intel FPO number.

2. Pin names in parentheses apply to the 80C188EA.

(the ambient temperature) can be calculated

PACKAGE THERMAL

SPECIFICATIONS

from i (thermal resistance from the case to ambi-

ent) with the following equation:

The 80C186EA/80L186EA is specified for operation

when T (the case temperature) is within the range

- P

of 0 C to 85 C (PLCC package) or 0 C to 106 C

Typical values for i

in Table 10.

at various airflows are given

(QFP-EIAJ) package. T may be measured in any

environment to determine whether the processor is

within the specified operating range. The case tem-

perature must be measured at the center of the top

surface.

P (the maximum power consumption, specified in

watts) is calculated by using the maximum ICC as

tabulated in the DC specifications and V

of 5.5V.

Table 10. Thermal Resistance (i ) at Various Airflows (in C/Watt)

Airflow Linear ft/min (m/sec)

200

400

600

800 1000

(0) (1.01) (2.03) (3.04) (4.06) (5.07)

(PLCC)

(QFP)

29 25

66 63

16.5

60.5

(SQFP)

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80C186EA/80C188EA, 80L186EA/80L188EA

ELECTRICAL SPECIFICATIONS

NOTICE: This data sheet contains preliminary infor-

mation on new products in production. It is valid for

the devices indicated in the revision history. The

specifications are subject to change without notice.

Absolute Maximum Ratings*

Storage Temperature ÀÀÀÀÀÀÀÀÀÀ 65 C to 150 C

*WARNING: Stressing the device beyond the ‘‘Absolute

Maximum Ratings’’ may cause permanent damage.

These are stress ratings only. Operation beyond the

‘‘Operating Conditions’’ is not recommended and ex-

tended exposure beyond the ‘‘Operating Conditions’’

may affect device reliability.

Case Temperature under Bias ÀÀÀ 65 C to 150 C

Supply Voltage with Respect

to V ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 0.5V to 6.5V

Voltage on Other Pins with Respect

to V

ÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀÀ 0.5V to V

0.5V

itors is application and board layout dependent. The

processor can cause transient power surges when

its output buffers transition, particularly when con-

nected to large capacitive loads.

Recommended Connections

Power and ground connections must be made to

multiple V and V pins. Every 80C186EA based

CC SS

circuit board should contain separate power (V

)

and ground (V ) planes. All V and V pins must

Always connect any unused input pins to an appro-

priate signal level. In particular, unused interrupt pins

(NMI, INT3:0) should be connected to V to avoid

be connected to the appropriate plane. Pins identi-

fied as ‘‘N.C.’’ must not be connected in the system.

Decoupling capacitors should be placed near the

processor. The value and type of decoupling capac-

unwanted interrupts. Leave any unused output pin

or any ‘‘N.C.’’ pin unconnected.

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80C186EA/80C188EA, 80L186EA/80L188EA

DC SPECIFICATIONS (80C186EA/80C188EA)

Symbol

Parameter

Supply Voltage

Min

Max

Units

Conditions

4.5

5.5

Input Low Voltage for All Pins

Input High Voltage for All Pins

Output Low Voltage

0.5

0.3 V

0.7 V

0.5

0.45

3 mA (min)

HYR

e b

2 mA (min)

Output High Voltage

0.5

Input Hysterisis on RESIN

0.30

Input Leakage Current (except

RD/QSMD, UCS, LCS, MCS0/PEREQ,

MCS1/ERROR, LOCK and TEST/BUSY)

IL1

(Note 1)

Input Leakage Current

(RD/QSMD, UCS, LCS, MCS0/PEREQ,

MCS1, ERROR, LOCK and TEST/BUSY

275

0.7 V

IL2

Output Leakage Current

0.45

(Note 2)

OUT

Supply Current Cold (RESET)

80C186EA25/80C188EA25

80C186EA20/80C188EA20

80C186EA13/80C188EA13

105

mA (Notes 3, 5)

Supply Current In Idle Mode

80C186EA25/80C188EA25

80C186EA20/80C188EA20

80C186EA13/80C188EA13

mA (Note 5)

Supply Current In Powerdown Mode

80C186EA25/80C188EA25

80C186EA20/80C188EA20

80C186EA13/80C188EA13

100

(Note 5)

Output Pin Capacitance

Input Pin Capacitance

1 MHz (Note 4)

1 MHz

OUT

NOTES:

1. RD/QSMD, UCS, LCS, MCS0/PEREQ, MCS1/ERROR, LOCK and TEST/BUSY have internal pullups that are only acti-

vated during RESET. Loading these pins above I

operation.

275 mA will cause the processor to enter alternate modes of

2. Output pins are floated using HOLD or ONCE Mode.

3. Measured at worst case temperature and V with all outputs loaded as specified in the AC Test Conditions, and with the

device in RESET (RESIN held low). RESET is worst case for I

4. Output capacitance is the capacitive load of a floating output pin.

5. Operating conditions for 25 MHz are 0 C to 70 C, V

5.0V 10%.

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80C186EA/80C188EA, 80L186EA/80L188EA

DC SPECIFICATIONS (80L186EA/80L188EA)

Symbol

Parameter

Supply Voltage

Min

Max

Units

Conditions

2.7

5.5

Input Low Voltage for All Pins

Input High Voltage for All Pins

Output Low Voltage

0.5

0.3 V

0.7 V

0.5

0.45

1.6 mA (min)

HYR

e b

1 mA (min)

Output High Voltage

0.5

Input Hysterisis on RESIN

0.30

Input Leakage Current (except

RD/QSMD, UCS, LCS, MCS0/PEREQ,

MCS1, LOCK and TEST)

IL1

(Note 1)

Input Leakage Current

(RD/QSMD, UCS, LCS, MCS0,

MCS1, LOCK and TEST)

275

0.7 V

IL2

Output Leakage Current

0.45

(Note 2)

OUT

Supply Current (RESET, 5.5V)

80L186EA-13

80L186EA-8

CC5

(Note 3)

Supply Current (RESET, 2.7V)

80L186EA-13

80L186EA-8

CC3

ID5

(Note 3)

Supply Current Idle (5.5V)

80L186EA-13

80L186EA-8

Supply Current Idle (2.7V)

80L186EA-13

80L186EA-8

ID5

Supply Current Powerdown (5.5V)

80L186EA-13

80L186EA-8

PD5

PD3

100

Supply Current Powerdown (2.7V)

80L186EA-13

80L186EA-8

Output Pin Capacitance

Input Pin Capacitance

1 MHz (Note 4)

1 MHz

OUT

NOTES:

1. RD/QSMD, UCS, LCS, MCS0, MCS1, LOCK and TEST have internal pullups that are only activated during RESET.

e b

Loading these pins above I

275 mA will cause the processor to enter alternate modes of operation.

2. Output pins are floated using HOLD or ONCE Mode.

3. Measured at worst case temperature and V with all outputs loaded as specified in the AC Test Conditions, and with the

device in RESET (RESIN held low).

4. Output capacitance is the capacitive load of a floating output pin.

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80C186EA/80C188EA, 80L186EA/80L188EA

VERSUS FREQUENCY AND VOLTAGE

PDTMR PIN DELAY CALCULATION

The current (I ) consumption of the processor is

and

The PDTMR pin provides a delay between the as-

sertion of NMI and the enabling of the internal

clocks when exiting Powerdown. A delay is required

only when using the on-chip oscillator to allow the

crystal or resonator circuit time to stabilize.

essentially composed of two components; I

CCS

is the quiescent current that represents internal

device leakage, and is measured with all inputs or

floating outputs at GND or V (no clock applied to

the device). I

NOTE:

is equal to the Powerdown current

The PDTMR pin function does not apply when

RESIN is asserted (i.e., a device reset during Pow-

erdown is similar to a cold reset and RESIN must

remain active until after the oscillator has stabi-

lized).

and is typically less than 50 mA.

is the switching current used to charge and

CCS

discharge parasitic device capacitance when chang-

ing logic levels. Since I is typically much greater

than I , I can often be ignored when calculating

CCS

To calculate the value of capacitor required to pro-

vide a desired delay, use the equation:

PD PD

440

(5V, 25 C)

desired delay in seconds

I is related to the voltage and frequency at which

CCS

the device is operating. It is given by the formula:

Where: t

capacitive load on PDTMR in mi-

crofarads

Power

DEV

. . I

CCS

DEV

Where: V

Device operating voltage (V

)

EXAMPLE: To get a delay of 30_b0 ms, a capacitor

value of C 440 (300 10 0.132 mF is

required. Round up to standard (available) capaci-

tive values.

)

Device capacitance

Device operating frequency

DEV

Device current

CCS

NOTE:

Measuring C

on a device like the 80C186EA

The above equation applies to delay times greater

than 10 ms and will compute the TYPICAL capaci-

tance needed to achieve the desired delay. A delay

DEV

would be difficult. Instead, C

is calculated using

the above formula by measuring I at a known V

DEV

and frequency (see Table 11). Using this C

val-

variance of

temperature, voltage, and device process ex-

tremes. In general, higher V and/or lower tem-

50% or

25% can occur due to

DEV

ue, I can be calculated at any voltage and fre-

quency within the specified operating range.

perature will decrease delay time, while lower V

and/or higher temperature will increase delay time.

EXAMPLE: Calculate the typical I when operating

at 20 MHz, 4.8V.

4.8 0.515 20

49 mA

Table 11. C

CCS

Values

DEV

Parameter

Typ

Max

Units

Notes

(Device in Reset)

(Device in Idle)

0.515

0.391

0.905

0.635

mA/V*MHz

1, 2

DEV

1, 2

1. Max C

is calculated at 40 C, all floating outputs driven to V

or GND, and all

DEV

outputs loaded to 50 pF (including CLKOUT and OSCOUT).

2. Typical C is calculated at 25 C with all outputs loaded to 50 pF except CLKOUT and

DEV

OSCOUT, which are not loaded.

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80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80C186EA25/80C186EA20/80C186EA13

Symbol

Parameter

Min

Max

Min

Max

Min

Max Units Notes

(12)

INPUT CLOCK

25 MHz

20 MHz

13 MHz

CLKIN Frequency

CLKIN Period

CLKIN High Time

CLKIN Low Time

CLKIN Rise Time

CLKIN Fall Time

38.5

26 MHz

1, 2

1, 3

OUTPUT CLOCK

CLKIN to CLKOUT Delay

CLKOUT Period

CLKOUT High Time

CLKOUT Low Time

CLKOUT Rise Time

CLKOUT Fall Time

2*T

1, 4

1, 5

(T/2)

OUTPUT DELAYS

ALE, S2:0, DEN, DT/R,

BHE, (RFSH), LOCK, A19:16

ns 1, 4, 6, 7

ns 1, 4, 6, 8

CHOV1

CHOV2

CLOV1

MCS3:0, LCS, UCS, PCS6:0,

NCS, RD, WR

BHE (RFSH), DEN, LOCK,

RESOUT, HLDA,

T0OUT, T1OUT, A19:16

1, 4, 6

RD, WR, MCS3:0, LCS,

UCS, PCS6:0, AD15:0

(A15:8, AD7:0),

CLOV2

NCS, INTA1:0, S2:0

RD, WR, BHE (RFSH), DT/R,

LOCK, S2:0, A19:16

CHOF

CLOF

DEN, AD15:0 (A15:8, AD7:0)

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80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS (Continued)

AC CharacteristicsÐ80C186EA25/80C186EA20/80C186EA13

Symbol

Parameter

Min

Max

(12)

Min

Max

Min

Max

Units

Notes

SYNCHRONOUS INPUTS

25 MHz

20 MHz

13 MHz

TEST, NMI, INT3:0,

T1:0IN, ARDY

1, 9

CHIS

CHIH

CLIS

CLIH

CLIS

CLIH

TEST, NMI, INT3:0,

T1:0IN, ARDY

AD15:0 (AD7:0), ARDY,

SRDY, DRQ1:0

1, 10

1, 9

AD15:0 (AD7:0), ARDY,

SRDY, DRQ1:0

HOLD, PEREQ, ERROR

(80C186EA Only)

HOLD, PEREQ, ERROR

(80C186EA Only)

1, 9

RESIN (to CLKIN)

1, 9

CLIS

CLIH

RESIN (from CLKIN)

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at V for high time, V for low time.

IH IL

3. Only required to guarantee I . Maximum limits are bounded by T , T

and T

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. T

8. T

applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

applies to RD and WR only after a HOLD release.

CHOV1

CHOV2

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. T

applies to BHE (RFSH) and A19:16 only after a HOLD release.

CHOVS

12. Operating conditions for 25 MHz are 0 C to 70 C, V

5.0V 10%.

Pin names in parentheses apply to the 80C188EA/80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80L186EA13/80L186EA8

Symbol

Parameter

Min

13 MHz

Max

Min

8 MHz

Max

Units

Notes

INPUT CLOCK

CLKIN Frequency

CLKIN Period

CLKIN High Time

CLKIN Low Time

CLKIN Rise Time

CLKIN Fall Time

38.5

62.5

MHz

1, 2

1, 3

OUTPUT CLOCK

CLKIN to CLKOUT Delay

CLKOUT Period

CLKOUT High Time

CLKOUT Low Time

CLKOUT Rise Time

CLKOUT Fall Time

2*T

1, 4

1, 5

(T/2)

OUTPUT DELAYS

ALE, LOCK

1, 4, 6, 7

CHOV1

CHOV2

MCS3:0, LCS, UCS,

PCS6:0, RD, WR

1, 4,

6, 8

S2:0 (DEN), DT/R,

BHE (RFSH), A19:16

CHOV3

CLOV1

CLOV2

LOCK, RESOUT, HLDA,

T0OUT, T1OUT

1, 4, 6

RD, WR, MCS3:0, LCS,

UCS, PCS6:0, INTA1:0

BHE (RFSH), DEN, A19:16

AD15:0 (A15:8, AD7:0)

S2:0

1, 4, 6

CLOV3

CLOV4

CLOV5

CHOF

RD, WR, BHE (RFSH),

DT/R, LOCK,

S2:0, A19:16

DEN, AD15:0

(A15:8, AD7:0)

CLOF

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at V for high time, V for low time.

IH IL

3. Only required to guarantee I . Maximum limits are bounded by T , T

and T

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. T

8. T

applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

applies to RD and WR only after a HOLD release.

CHOV1

CHOV2

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. T

applies to BHE (RFSH) and A19:16 only after a HOLD release.

CHOVS

12. Pin names in parentheses apply to the 80C188EA/80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS

AC CharacteristicsÐ80L186EA13/80L186EA8

Symbol

Parameter

Min

Max

Min

Max

Units

Notes

SYNCHRONOUS INPUTS

13 MHz

8 MHz

TEST, NMI, INT3:0, T1:0IN, ARDY

AD15:0 (AD7:0), ARDY, SRDY, DRQ1:0

HOLD

1, 9

CHIS

CHIH

CLIS

CLIH

CLIS

CLIH

CLIS

CLIH

1, 10

1, 9

HOLD

1, 9

RESIN (to CLKIN)

1, 9

RESIN (from CLKIN)

1, 9

NOTES:

1. See AC Timing Waveforms, for waveforms and definition.

2. Measured at V for high time, V for low time.

IH IL

3. Only required to guarantee I . Maximum limits are bounded by T , T

and T

4. Specified for a 50 pF load, see Figure 13 for capacitive derating information.

5. Specified for a 50 pF load, see Figure 14 for rise and fall times outside 50 pF.

6. See Figure 14 for rise and fall times.

7. T

8. T

applies to BHE (RFSH), LOCK and A19:16 only after a HOLD release.

applies to RD and WR only after a HOLD release.

CHOV1

CHOV2

9. Setup and Hold are required to guarantee recognition.

10. Setup and Hold are required for proper operation.

11. T

applies to BHE (RFSH) and A19:16 only after a HOLD release.

CHOVS

12. Pin names in parentheses apply to the 80C188EA/80L188EA.

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80C186EA/80C188EA, 80L186EA/80L188EA

AC SPECIFICATIONS (Continued)

Relative Timings (80C186EA25/20/13, 80L186EA13/8)

Symbol

Parameter

Min

Max

Unit

Notes

RELATIVE TIMINGS

ALE Rising to ALE Falling

LHLL

Address Valid to ALE Falling

Chip Selects Valid to ALE Falling

Address Hold from ALE Falling

ALE Falling to WR Falling

(/2T

AVLL

PLLL

LLAX

LLWL

LLRL

ALE Falling to RD Falling

RD Rising to ALE Rising

RHLH

WHLH

AFRL

RLRH

WLWH

RHAV

WHDX

WHDEX

WHPH

RHPH

PHPL

DXDL

OVRH

RHOX

WR Rising to ALE Rising

Address Float to RD Falling

RD Falling to RD Rising

(2*T)

WR Falling to WR Rising

RD Rising to Address Active

Output Data Hold after WR Rising

WR Rising to DEN Rising

(/2T

1, 4

WR Rising to Chip Select Rising

RD Rising to Chip Select Rising

CS Inactive to CS Active

DEN Inactive to DT/R Low

ONCE (UCS, LCS) Active to RESIN Rising

ONCE (UCS, LCS) to RESIN Rising

NOTES:

1. Assumes equal loading on both pins.

2. Can be extended using wait states.

3. Not tested.

4. Not applicable to latched A2:1. These signals change only on falling T .

5. For write cycle followed by read cycle.

6. Operating conditions for 25 MHz are 0 C to 70 C, V

5.0V 10%.

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80C186EA/80C188EA, 80L186EA/80L188EA

AC TEST CONDITIONS

The AC specifications are tested with the 50 pF load

shown in Figure 8. See the Derating Curves section

to see how timings vary with load capacitance.

272432–8

50 pF for all signals.

Figure 8. AC Test Load

Specifications are measured at the V /2 crossing

point, unless otherwise specified. See AC Timing

Waveforms, for AC specification definitions, test

pins, and illustrations.

AC TIMING WAVEFORMS

272432–9

Figure 9. Input and Output Clock Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–10

NOTE:

20% V

Float

80% V

Figure 10. Output Delay and Float Waveform

272432–11

NOTE:

RESIN measured to CLKIN, not CLKOUT

Figure 11. Input Setup and Hold

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–12

NOTES:

1. T

for write cycle followed by read cycle.

DXDL

2. Pin names in parentheses apply to tthe 80C188EA.

Figure 12. Relative Signal Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

DERATING CURVES

272432–14

272432–13

Figure 14. Typical Rise and Fall Variations

Versus Load Capacitance

Figure 13. Typical Output Delay Variations

Versus Load Capacitance

must ensure that the ramp time for V is not so

long that RESIN is never really sampled at a logic

RESET

low level when V

conditions.

reaches minimum operating

The processor performs a reset operation any time

the RESIN pin is active. The RESIN pin is actually

synchronized before it is presented internally, which

means that the clock must be operating before a

reset can take effect. From a power-on state, RESIN

must be held active (low) in order to guarantee cor-

rect initialization of the processor. Failure to pro-

vide RESIN while the device is powering up will

result in unspecified operation of the device.

Figure 16 shows the timing sequence when RESIN

is applied after V is stable and the device has

been operating. Note that a reset will terminate all

activity and return the processor to a known operat-

ing state. Any bus operation that is in progress at the

time RESIN is asserted will terminate immediately

(note that most control signals will be driven to their

inactive state first before floating).

Figure 15 shows the correct reset sequence when

first applying power to the processor. An external

clock connected to CLKIN must not exceed the V

While RESIN is active, signals RD/QSMD, UCS,

LCS, MCS0/PEREQ, MCS1/ERROR, LOCK, and

TEST/BUSY are configured as inputs and weakly

held high by internal pullup transistors. Forcing UCS

and LCS low selects ONCE Mode. Forcing QSMD

low selects Queue Status Mode. Forcing TEST/

BUSY high at reset and low four clocks later enables

Numerics Mode. Forcing LOCK low is prohibited and

results in unspecified operation.

threshold being applied to the processor. This is nor-

mally not a problem if the clock driver is supplied

with the same V

that supplies the processor.

When attaching a crystal to the device, RESIN must

remain active until both V and CLKOUT are stable

(the length of time is application specific and de-

pends on the startup characteristics of the crystal

circuit). The RESIN pin is designed to operate cor-

rectly using an RC reset circuit, but the designer

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80C186EA/80C188EA, 80L186EA/80L188EA

Figure 15. Powerup Reset Waveforms

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80C186EA/80C188EA, 80L186EA/80L188EA

Figure 16. Warm Reset Waveforms

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80C186EA/80C188EA, 80L186EA/80L188EA

BUS CYCLE WAVEFORMS

Figures 17 through 23 present the various bus cycles that are generated by the processor. What is shown in

the figure is the relationship of the various bus signals to CLKOUT. These figures along with the information

present in AC Specifications allow the user to determine all the critical timing analysis needed for a given

application.

272432-17

NOTES:

1. During the data phase of the bus cycle, A19/S6 is driven high for a DMA or refresh cycle.

2. Pin names in parentheses apply to the 80C188EA.

Figure 17. Read, Fetch and Refresh Cycle Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

272432-18

NOTES:

1. During the data phase of the bus cycle, A19/S6 is driven high for a DMA cycle.

2. Pin names in parentheses apply to the 80C188EA.

Figure 18. Write Cycle Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–19

NOTES:

1. The processor drives these pins to 0 during Idle and Powerdown Modes.

2. Pin names in parentheses apply to the 80C188EA.

Figure 19. Halt Cycle Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

NOTES:

1. INTA occurs one clock later in Slave Mode.

2. Pin names in parentheses apply to the 80C188EA.

272432–20

Figure 20. INTA Cycle Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–21

NOTE:

1. Pin names in parentheses apply to the 80C188EA.

Figure 21. HOLD/HLDA Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–22

NOTE:

1. Pin names in parentheses apply to the 80C188EA.

Figure 22. DRAM Refresh Cycle During Hold Acknowledge

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80C186EA/80C188EA, 80L186EA/80L188EA

272432–23

NOTES:

1. Generalized diagram for READ or WRITE.

2. ARDY low by either edge causes a wait state. Only rising ARDY is fully synchronized.

3. SRDY low causes a wait state. SRDY must meet setup and hold times to ensure correct device operation.

4. Either ARDY or SRDY active high will terminate a bus cycle.

5. Pin names in parentheses apply to the 80C188EA.

Figure 23. Ready Waveform

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80C186EA/80C188EA, 80L186EA/80L188EA

All instructions which involve memory accesses can

require one or two additional clocks above the mini-

mum timings shown due to the asynchronous hand-

shake between the bus interface unit (BIU) and exe-

cution unit.

80C186EA/80C188EA EXECUTION

TIMINGS

A determination of program exeuction timing must

consider the bus cycles necessary to prefetch in-

structions as well as the number of execution unit

cycles necessary to execute instructions. The fol-

lowing instruction timings represent the minimum

execution time in clock cycle for each instruction.

The timings given are based on the following as-

sumptions:

With a 16-bit BIU, the 80C186EA has sufficient bus

performance to endure that an adequate number of

prefetched bytes will reside in the queue (6 bytes)

most of the time. Therefore, actual program exeuc-

tion time will not be substanially greater than that

derived from adding the instruction timings shown.

The opcode, along with any data or displacement

required for execution of a particular instruction,

has been prefetched and resides in the queue at

the time it is needed.

The 80C188EA 8-bit BIU is limited in its performance

relative to the execution unit. A sufficient number of

prefetched bytes may not reside in the prefetch

queue (4 bytes) much of the time. Therefore, actual

program execution time will be substantially greater

than that derived from adding the instruction timings

shown.

No wait states or bus HOLDs occur.

All word-data is located on even-address bound-

aries. (80C186EA only)

All jumps and calls include the time required to fetch

the opcode of the next instruction at the destination

address.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY

80C186EA 80C188EA

Function

Format

Comments

Clock

Cycles

DATA TRANSFER

MOV

Move:

Immediate to register/memory

Immediate to register

1 0 0 0 1 0 0 w

1 0 0 0 1 0 1 w

1 1 0 0 0 1 1 w

1 0 1 1 w reg

1 0 1 0 0 0 0 w

1 0 1 0 0 0 1 w

1 0 0 0 1 1 1 0

1 0 0 0 1 1 0 0

mod reg r/m

mod 000 r/m

data

2/12

2/9

12–13

3–4

2/12*

2/9

data

data if w

12–13

3–4

8/16-bit

data if w

Memory to accumulator

addr-low

addr-high

Accumulator to memory

addr-low

Segment register to register/memory

mod 0 reg r/m

2/9

2/11

2/13

2/15

PUSH

Push:

Memory

1 1 1 1 1 1 1 1

0 1 0 1 0 reg

0 0 0 reg 1 1 0

0 1 1 0 1 0 s 0

mod 1 1 0 r/m

Segment register

Immediate

data

data if s

PUSHA

Push All

Pop:

Memory

0 1 1 0 0 0 0 0

POP

1 0 0 0 1 1 1 1

0 1 0 1 1 reg

0 0 0 reg 1 1 1

mod 0 0 0 r/m

(regⁱ01)

Segment register

POPA

Pop All

0 1 1 0 0 0 0 1

XCHG

Exchange:

1 0 0 0 0 1 1 w

1 0 0 1 0 reg

mod reg r/m

4/17

4/17*

Input from:

Fixed port

1 1 1 0 0 1 0 w

1 1 1 0 1 1 0 w

port

10*

Variable port

OUT

Output to:

Fixed port

1 1 1 0 0 1 1 w

1 1 1 0 1 1 1 w

1 1 0 1 0 1 1 1

1 0 0 0 1 1 0 1

1 1 0 0 0 1 0 1

1 1 0 0 0 1 0 0

1 0 0 1 1 1 1 1

1 0 0 1 1 1 1 0

1 0 0 1 1 1 0 0

1 0 0 1 1 1 0 1

Variable port

XLAT

Translate byte to AL

LEA

LDS

LES

Load EA to register

Load pointer to DS

Load pointer to ES

mod reg r/m

(modⁱ11)

LAHF

SAHF

Load AH with flags

Store AH into flags

PUSHF

Push flags

Pop flags

POPF

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

80C186EA 80C188EA

Function

Format

Comments

Clock

Cycles

DATA TRANSFER (Continued)

SEGMENT

Segment Override:

0 0 1 0 1 1 1 0

0 0 1 1 0 1 1 0

0 0 1 1 1 1 1 0

0 0 1 0 0 1 1 0

ARITHMETIC

ADD

Add:

Reg/memory with register to either

Immediate to register/memory

Immediate to accumulator

0 0 0 0 0 0 d w

1 0 0 0 0 0 s w

0 0 0 0 0 1 0 w

mod reg r/m

mod 0 0 0 r/m

data

3/10

4/16

3/4

3/10

4/16

3/4

data if s w 01

data

data if w

8/16-bit

ADC

Add with carry:

Reg/memory with register to either

Immediate to register/memory

Immediate to accumulator

0 0 0 1 0 0 d w

1 0 0 0 0 0 s w

0 0 0 1 0 1 0 w

mod reg r/m

mod 0 1 0 r/m

data

3/10

4/16

3/4

3/10

4/16

3/4

data if s w 01

data

data if w

INC

Increment:

1 1 1 1 1 1 1 w

0 1 0 0 0 reg

mod 0 0 0 r/m

3/15

SUB

Subtract:

Reg/memory and register to either

Immediate from register/memory

Immediate from accumulator

0 0 1 0 1 0 d w

1 0 0 0 0 0 s w

0 0 1 0 1 1 0 w

mod reg r/m

mod 1 0 1 r/m

data

3/10

4/16

3/4

3/10

4/16

3/4

data if s w 01

data

data if w

8/16-bit

SBB

Subtract with borrow:

Reg/memory and register to either

Immediate from register/memory

Immediate from accumulator

0 0 0 1 1 0 d w

1 0 0 0 0 0 s w

0 0 0 1 1 1 0 w

mod reg r/m

mod 0 1 1 r/m

data

3/10

4/16

3/4

3/10

4/16

data if s w 01

data

data if w

3/4

DEC

Decrement

1 1 1 1 1 1 1 w

0 1 0 0 1 reg

mod 0 0 1 r/m

3/15

CMP

Compare:

Immediate with register/memory

Immediate with accumulator

0 0 1 1 1 0 1 w

0 0 1 1 1 0 0 w

1 0 0 0 0 0 s w

0 0 1 1 1 1 0 w

1 1 1 1 0 1 1 w

0 0 1 1 0 1 1 1

0 0 1 0 0 1 1 1

0 0 1 1 1 1 1 1

0 0 1 0 1 1 1 1

mod reg r/m

mod 1 1 1 r/m

data

3/10

3/4

3/10

3/4

3/10

data if s w 01

data

data if w

8/16-bit

NEG

AAA

DAA

AAS

DAS

Change sign register/memory

ASCII adjust for add

mod 0 1 1 r/m

3/10

Decimal adjust for add

ASCII adjust for subtract

Decimal adjust for subtract

MUL

Multiply (unsigned):

1 1 1 1 0 1 1 w

mod 100 r/m

Memory-Byte

Memory-Word

26–28

35–37

32–34

41–43

26–28

35–37

32–34

41–48

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

80C186EA 80C188EA

Function

Format

Comments

Clock

Cycles

ARITHMETIC (Continued)

IMUL

Integer multiply (signed):

1 1 1 1 0 1 1 w

mod 1 0 1 r/m

Memory-Byte

Memory-Word

25–28

34–37

31–34

40–43

25–28

34–37

32–34

40–43*

(signed)

IMUL

Integer Immediate multiply

0 1 1 0 1 0 s 1

1 1 1 1 0 1 1 w

mod reg r/m

data

data if s

22–25

29–32

22-25

29–32

DIV

Divide (unsigned):

mod 1 1 0 r/m

Memory-Byte

Memory-Word

IDIV

Integer divide (signed):

1 1 1 1 0 1 1 w

mod 1 1 1 r/m

Memory-Byte

Memory-Word

44–52

53–61

50–58

59–67

44–52

53–61

50–58

59–67*

AAM

AAD

CBW

CWD

ASCII adjust for multiply

ASCII adjust for divide

Convert byte to word

1 1 0 1 0 1 0 0

1 1 0 1 0 1 0 1

1 0 0 1 1 0 0 0

1 0 0 1 1 0 0 1

0 0 0 0 1 0 1 0

Convert word to double word

LOGIC

Shift/Rotate Instructions:

1 1 0 1 0 0 0 w

1 1 0 1 0 0 1 w

1 1 0 0 0 0 0 w

mod TTT r/m

2/15

n/17

mod TTT r/m

count

TTT Instruction

0 0 0

0 0 1

0 1 0

0 1 1

ROL

ROR

RCL

RCR

1 0 0 SHL/SAL

1 0 1

1 1 1

SHR

SAR

AND

And:

Reg/memory and register to either

Immediate to register/memory

Immediate to accumulator

0 0 1 0 0 0 d w

1 0 0 0 0 0 0 w

0 0 1 0 0 1 0 w

mod reg r/m

mod 1 0 0 r/m

data

3/10

4/16

3/4

3/10*

4/16*

3/4*

data

data if w

8/16-bit

TEST And function to flags, no result:

3/10

1 0 0 0 0 1 0 w

1 1 1 1 0 1 1 w

1 0 1 0 1 0 0 w

mod reg r/m

mod 0 0 0 r/m

data

3/10

4/10

3/4

Immediate data and register/memory

Immediate data and accumulator

data

4/10*

data if w

3/4

OR Or:

Reg/memory and register to either

Immediate to register/memory

Immediate to accumulator

0 0 0 0 1 0 d w

1 0 0 0 0 0 0 w

0 0 0 0 1 1 0 w

mod reg r/m

mod 0 0 1 r/m

data

3/10

4/16

3/4

3/10*

data

4/16

data if w

3/4*

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

80C186EA 80C188EA

Function

Format

Comments

Clock

Cycles

LOGIC (Continued)

XOR

Exclusive or:

Reg/memory and register to either

Immediate to register/memory

Immediate to accumulator

0 0 1 1 0 0 d w

1 0 0 0 0 0 0 w

0 0 1 1 0 1 0 w

1 1 1 1 0 1 1 w

mod reg r/m

mod 1 1 0 r/m

data

3/10

4/16

3/4

3/10*

4/16*

3/4

data

data if w

8/16-bit

NOT

Invert register/memory

mod 0 1 0 r/m

3/10

3/10*

STRING MANIPULATION

MOVS

CMPS

SCAS

LODS

STOS

Move byte/word

1 0 1 0 0 1 0 w

1 0 1 0 0 1 1 w

1 0 1 0 1 1 1 w

1 0 1 0 1 1 0 w

1 0 1 0 1 0 1 w

0 1 1 0 1 1 0 w

0 1 1 0 1 1 1 w

14*

22*

15*

12*

10*

Compare byte/word

Scan byte/word

Load byte/wd to AL/AX

Store byte/wd from AL/AX

INS

Input byte/wd from DX port

OUTS

Output byte/wd to DX port

Repeated by count in CX (REP/REPE/REPZ/REPNE/REPNZ)

MOVS

CMPS

SCAS

LODS

STOS

Move string

Compare string

Scan string

Load string

1 1 1 1 0 0 1 0

1 1 1 1 0 0 1 z

1 1 1 1 0 0 1 0

1 0 1 0 0 1 0 w

1 0 1 0 0 1 1 w

1 0 1 0 1 1 1 w

1 0 1 0 1 1 0 w

1 0 1 0 1 0 1 w

0 1 1 0 1 1 0 w

22n

15n

11n

22n

15n*

11n*

Store string

9n*

8n*

INS

Input string

OUTS

Output string

1 1 1 1 0 0 1 0

0 1 1 0 1 1 1 w

8n*

CONTROL TRANSFER

CALL

Call:

Direct within segment

1 1 1 0 1 0 0 0

1 1 1 1 1 1 1 1

disp-low

disp-high

mod 0 1 0 r/m

13/19

17/27

indirect within segment

Direct intersegment

1 0 0 1 1 0 1 0

1 1 1 1 1 1 1 1

segment offset

segment selector

(mod 11)

Indirect intersegment

mod 0 1 1 r/m

JMP

Unconditional jump:

Short/long

1 1 1 0 1 0 1 1

1 1 1 0 1 0 0 1

1 1 1 1 1 1 1 1

disp-low

Direct within segment

disp-high

mod 1 0 0 r/m

11/17

11/21

indirect within segment

Direct intersegment

Indirect intersegment

1 1 1 0 1 0 1 0

segment offset

segment selector

(mod 11)

1 1 1 1 1 1 1 1

mod 1 0 1 r/m

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

80C186EA

Clock

80C188EA

Clock

Function

Format

Comments

Cycles

CONTROL TRANSFER (Continued)

RET

Return from CALL:

Within segment

1 1 0 0 0 0 1 1

1 1 0 0 0 0 1 0

1 1 0 0 1 0 1 1

1 1 0 0 1 0 1 0

0 1 1 1 0 1 0 0

0 1 1 1 1 1 0 0

0 1 1 1 1 1 1 0

0 1 1 1 0 0 1 0

0 1 1 1 0 1 1 0

0 1 1 1 1 0 1 0

0 1 1 1 0 0 0 0

0 1 1 1 1 0 0 0

0 1 1 1 0 1 0 1

0 1 1 1 1 1 0 1

0 1 1 1 1 1 1 1

0 1 1 1 0 0 1 1

0 1 1 1 0 1 1 1

0 1 1 1 1 0 1 1

0 1 1 1 0 0 0 1

0 1 1 1 1 0 0 1

1 1 1 0 0 0 1 1

1 1 1 0 0 0 1 0

1 1 1 0 0 0 0 1

1 1 1 0 0 0 0 0

Within seg adding immed to SP

Intersegment

data-low

data-high

Intersegment adding immediate to SP

data-low

disp

JE/JZ

Jump on equal/zero

4/13

5/15

6/16

4/13

5/15

6/16

JMP not

taken/JMP

taken

JL/JNGE

JLE/JNG

JB/JNAE

JBE/JNA

Jump on less/not greater or equal

Jump on less or equal/not greater

Jump on below/not above or equal

Jump on below or equal/not above

JP/JPE

Jump on parity/parity even

Jump on overflow

Jump on sign

JNE/JNZ

JNL/JGE

JNLE/JG

JNB/JAE

JNBE/JA

JNP/JPO

Jump on not equal/not zero

Jump on not less/greater or equal

Jump on not less or equal/greater

Jump on not below/above or equal

Jump on not below or equal/above

Jump on not par/par odd

JNO

JNS

Jump on not overflow

Jump on not sign

JCXZ

LOOP

Jump on CX zero

Loop CX times

LOOP not

taken/LOOP

taken

LOOPZ/LOOPE

LOOPNZ/LOOPNE

Loop while zero/equal

Loop while not zero/equal

ENTER

Enter Procedure

1 1 0 0 1 0 0 0

data-low

data-high

22 16(n 1) 26 20(n 1)

LEAVE

Leave Procedure

1 1 0 0 1 0 0 1

INT

Interrupt:

Type specified

Type 3

1 1 0 0 1 1 0 1

1 1 0 0 1 1 0 0

1 1 0 0 1 1 1 0

type

if INT. taken/

if INT. not

taken

INTO

Interrupt on overflow

48/4

IRET

Interrupt return

1 1 0 0 1 1 1 1

0 1 1 0 0 0 1 0

BOUND

Detect value out of range

mod reg r/m

33–35

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

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80C186EA/80C188EA, 80L186EA/80L188EA

INSTRUCTION SET SUMMARY (Continued)

80C186EA 80C188EA

Function

Format

Comments

Clock

Cycles

PROCESSOR CONTROL

CLC

CMC

STC

CLD

STD

Clear carry

1 1 1 1 1 0 0 0

1 1 1 1 0 1 0 1

1 1 1 1 1 0 0 1

1 1 1 1 1 1 0 0

1 1 1 1 1 1 0 1

1 1 1 1 1 0 1 0

1 1 1 1 1 0 1 1

1 1 1 1 0 1 0 0

1 0 0 1 1 0 1 1

1 1 1 1 0 0 0 0

Complement carry

Set carry

Clear direction

Set direction

CLI

STI

Clear interrupt

Set interrupt

HLT

Halt

WAIT

LOCK

Wait

if TEST

Bus lock prefix

NOP

No Operation

1 0 0 1 0 0 0 0

(TTT LLL are opcode to processor extension)

Shaded areas indicate instructions not available in 8086/8088 microsystems.

NOTE:

*Clock cycles shown for byte transfers. For word operations, add 4 clock cycles for all memory transfers.

The Effective Address (EA) of the memory operand

is computed according to the mod and r/m fields:

reg is assigned according to the following:

Segment

if mod

11 then r/m is treated as a REG field

reg

00 then DISP

high are absent

0*, disp-low and disp-

tended to 16-bits, disp-high is absent

if mod

01 then DISP

disp-low sign-ex-

if mod

if r/m

10 then DISP

disp-high: disp-low

000 then EA

001 then EA

010 then EA

011 then EA

100 then EA

101 then EA

110 then EA

111 then EA

(BX)

(SI)

(DI)

(SI)

(DI)

DISP

REG is assigned according to the following table:

(BX)

(BP)

16-Bit (w

8-Bit (w

000 AL

000 AX

001 CX

010 DX

011 BX

100 SP

101 BP

110 SI

(SI)

DISP

001 CL

010 DL

011 BL

100 AH

101 CH

110 DH

111 BH

(DI)

(BP)

(BX)

DISP

DISP*

DISP

DISP follows 2nd byte of instruction (before data if

required)

111 DI

*except if mod

disp-high: disp-low.

00 and r/m

110 then EA

The physical addresses of all operands addressed

by the BP register are computed using the SS seg-

ment register. The physical addresses of the desti-

nation operands of the string primitive operations

(those addressed by the DI register) are computed

using the ES segment, which may not be overridden.

EA calculation time is 4 clock cycles for all modes,

and is included in the execution times given whenev-

er appropriate.

Segment Override Prefix

reg

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80C186EA/80C188EA, 80L186EA/80L188EA

REVISION HISTORY

ERRATA

Intel 80C186EA/80L186EA devices are marked with

a 9-character alphanumeric Intel FPO number un-

derneath the product number. This data sheet up-

date is valid for devices with an ‘‘A’’, ‘‘B’’, ‘‘C’’, ‘‘D’’,

or ‘‘E’’ as the ninth character in the FPO number, as

illustrated in Figure 5 for the 68-lead PLCC package,

Figure 6 for the 84-lead QFP (EIAJ) package, and

Figure 7 for the 80-lead SQFP device. Such devices

may also be identified by reading a value of 01H,

02H, 03H from the STEPID register.

An 80C186EA/80L186EA with a STEPID value of

01H or 02H has the following known errata. A device

with a STEPID of 01H or 02H can be visually identi-

fied by noting the presence of an ‘‘A’’, ‘‘B’’, or ‘‘C’’

alpha character, next to the FPO number. The FPO

number location is shown in Figures 5, 6, and 7.

1. An internal condition with the interrupt controller

can cause no acknowledge cycle on the INTA1

line in response to INT1. This errata only occurs

when Interrupt 1 is configured in cascade mode

and a higher priority interrupt exists. This errata

will not occur consistantly, it is dependent on in-

terrupt timing.

This data sheet replaces the following data sheets:

272019-002Ð80C186EA

272020-002Ð80C188EA

272021-002Ð80L186EA

272022-002Ð80L188EA

272307-001ÐSB80C186EA/SB80L186EA

272308-001ÐSB80C188EA/SB80L188EA

An 80C186EA/80L186EA with a STEPID value of

03H has no known errata. A device with a STEPID of

03H can be visually identified by noting the presence

of a ‘‘D’’ or ‘‘E’’ alpha character next to the FPO

number. The FPO number location is shown in Fig-

ures 5, 6, and 7.

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